Assistant Professor


1-1 Sensui-cho, Tobata-ku, Kitakyushu-shi, Fukuoka

Research Fields, Keywords

Permanent Magnet Synchronous Motor, Inverter, Motor Control, Wireless Power Transfer System



Undergraduate Education 【 display / non-display

  • 2007.03   Kagoshima University   Faculty of Engineering   Graduated   JAPAN

Post Graduate Education 【 display / non-display

  • 2009.03  Kagoshima University  Graduate School, Division of Science and Engineering  Master's Course  Completed  JAPAN

Degree 【 display / non-display

  • Kagoshima University -  Doctor of Engineering  2016.03

Biography in Kyutech 【 display / non-display

  • 2013.04

    Kyushu Institute of TechnologyFaculty of Engineering   Department of Electrical Engineering and Electronics   Assistant Professor  

Biography before Kyutech 【 display / non-display

  • 2011.04

      Researcher   JAPAN

  • 2009.10

      Researcher   JAPAN

  • 2009.04

      Researcher   JAPAN

Academic Society Memberships 【 display / non-display

  • 2014.03


Specialized Field (scientific research fund) 【 display / non-display

  • Power engineering/Power conversion/Electric machinery


Publications (Article) 【 display / non-display

  • Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding

    Imakiire Akihiro, Sugiura Kazuhiko, Tsuruta Kazuhiro, Toda Keiji, Kozako Masahiro, Hikita Masayuki, Tatsumi Kohei, Inagaki Masakazu, Iizuka Tomonori, Sato Nobuaki, Shimizu Koji, Ueda Kazutoshi

    IEEJ Transactions on Industry Applications  ( The Institute of Electrical Engineers of Japan )  139 ( 10 ) 838 - 846   2019.10  [Refereed]

     View Summary

    <p>This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.</p>

    DOI Scopus CiNii

  • Induction machine with localized voltage unbalance compensation

        1248 - 1255   2019.05  [Refereed]

     View Summary

    © 2019 IEEE. This paper introduces a new means of operating an induction machine which utilizes a relatively small converter circuit that is capable of maintaining balanced conditions within the machine even during periods of a voltage unbalance in its AC supply, The control method required for satisfactory operation of the circuit is described and the validity of the control method is confirmed by simulation. Finally, it is shown by experiment that the technique allows one to maintain the performance of the induction machine for both sudden voltage sag and voltage surge conditions. This proposed approach is expected to solve persistent problems such as over current, local heating, vibration and stalling when an unbalance voltage occurs.

    DOI Scopus

  • Development and evaluation of SiC inverter using Ni micro plating bonding power module

    Kawagoe A., Itose T., Imakiire A., Kozako M., Hikita M., Tatsumi K., Iizuka T., Morisako I., Sato N., Shimizu K., Ueda K., Sugiura K., Tsuruta K., Toda K.

    2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019      36 - 39   2019.04  [Refereed]

     View Summary

    © 2019 IEEE. This paper reports on evaluation of inverter system using silicon carbide (SiC) power module with a novel packaging technology of Ni micro plating bonding. The power module is developed to make the structure maximize the performance of SiC attracting attention in recent years. As a result, it was found that the developed inverter reduces the inverter loss and improves the efficiency of the entire inverter system as compared with in-vehicle product using Si-IGBT and the inverter consisting of the conventional package structure using SiC MOSFET. Moreover, it was confirmed that switching was possible even when the chip temperature exceeded 200°C, suggesting that the developed inverter can be driven under the high temperature environment.

    DOI Scopus

  • Investigation of System Configuration of Wireless Power Transfer System for Power Supply in Pure Car Carrier Ship

      7 ( 1 ) 14 - 24   2019.03  [Refereed]

  • Electrical Characteristics of Wireless Power Transfer System with Repeating Coil for AGV Considering the Misalignment of Coils

      6 ( 4 ) 165 - 172   2018.10  [Refereed]

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Grants-in-Aid for Scientific Research 【 display / non-display

  • Development of contactless power transfer system for automated guided vehicle available during driving

    Grant-in-Aid for Young Scientists(B)

    Project Year:  2015.04  -  2018.03

    Project Number:  15K18022