Authorship：Lead author   Language：English   Publishing type：Research paper (international conference proceedings)

DOI： 10.1115/LEMP2020-8553

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We have developed a polishing pad using materials with different wear rates to achieve highly efficient polishing of difficult-to-process material substrates. Nylon fibers with good mechanical properties are arranged with other materials, followed by dressing to form protrusions on the polishing pad surface. Stable polishing performance can be expected if the orientation and arrangement of the nylon fibers can be controlled. A sapphire substrate was polished using the prototype polishing pad developed in this research. The results indicated 30% improvement in material removal rate compared to the ready-made pad.

DOI： 10.11420/jsat.62.264

CiNii Research

Authorship：Last author   Language：English   Publishing type：Research paper (international conference proceedings)

<p>Mixed colloidal silica particles as abrasive in slurries have been proposed to improve and realize a high removal rate and smooth surface without subsurface damage, on sapphire chemical mechanical polishing (CMP). Mixed silica particles were fabricated by different sizes of nano-silica particle with the range of pH 7-13. The characteristics of the mixed large and small silica particles has been observed. Dynamic light scattering (DLS) spectra results revealed that the structure of the mixed particle, the small particle at the size of 4 nm are adsorbed on the large silica particles and increase in the size of the abrasive particles. Furthermore, we found that pH value affected to abrasive particle size. In these cases, our polishing tests results show that material removal rate (MRR) of the sapphire CMP totally increase. This confirmed that mixed particles could produce a higher MRR than single colloidal silica slurry. Finally, the mechanism of sapphire removal was discussed.</p>

DOI： 10.1299/jsmelem.2017.9.173

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Language：Japanese   Publishing type：Research paper (scientific journal)

水と同等の屈折率を有する透明な樹脂パッドを用いて、スラリー中の微粒子観察やシリコン酸化膜の膜測など、CMPにおけるモニタリング技術に関する研究を行っている。今回は低屈折率の透明樹脂パッドを用いたモニタリング技術のコンセプトと、その足がかりとなる実験データについて報告する。

DOI： 10.11522/pscjspe.2017s.0_523

CiNii Article

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

DOI： 10.2493/jjspe.88.427

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

DOI： 10.11522/pscjspe.2022s.0_126

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)

<p>Total internal reflection is an optical imaging technique for nanoparticle tracking and observation employing the scattered light from an evanescent field near the interface or reference surface. Generally, the nanoparticle behavior is the three-dimensional Brownian motion in an aqueous medium. The motion can be traced by an optical microscopy, but it cannot be traced by an electron microscopy technique. In the three-dimensional nanoparticle moving position, the <i>X</i> and <i>Y</i> positions are parallel to the surface, which can be traced by the general microscopy techniques. However, the height position <i>Z</i> of a nanoparticle perpendicular to the surface could not be traced without the longitudinal scanning method. Here, a novel method is proposed to investigate the 3D position of nanoparticles by applying multi-wavelength evanescent fields microscopy, which has a high spatial resolution in the <i>Z</i>-direction without longitudinal scanning. This paper focuses on the verification of measurement in the <i>Z</i>-direction. A piezoelectric actuator was employed to control the nanoparticle displacement in height <i>Z</i>. Standard polystyrene 100 nm particles were randomly adhered on a spherical tip that connected with the piezoelectric actuator. The spherical tip was essentially made from an optical adhesive (<i>n</i> = 1.348) with a refractive index close to the water for decreasing the unnecessary signal from the tip-self during nanoparticle observation in the water. The proposed method could obtain the multi-wavelength scattering lights from the observed nanoparticles by an 8-bit color camera with higher than 50 frames per second recording to investigate the 3D nanoscale tracking. The <i>X</i> and <i>Y</i> positions of nanoparticles were determined by the centroid of the scattering light intensities. The height <i>Z</i> was determined from the logarithm ratios between the detected scattering light intensities of both wavelengths. The measurement repeatability of the absolute difference in height between nanoparticles could be measured less than ±16 nm by using the proposed method. The penetration height measurability range was approximated at 250 nm from the reference surface.</p>

DOI： 10.20965/ijat.2021.p0831

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<p>The nanoscale polishing phenomena between substrate surface, 105 nm-sized SiO₂ particles slurry, and polishing pad during CMP process were experimentally observed and evaluated to identify the main factors which effectively polish a 4H-SiC substrate. The nanoscale polishing phenomena were observed in-situ by our developed compact apparatus applied an optical evanescent field. The observation is able to detect the scattering light from either the nano-abrasive particles or the pad asperities when they react to the surface to being polishing. The nanoparticle motion phenomena, which two conditions (i)only nanoparticles (without pad) and (ii)nanoparticles with pad sliding, on 4H-SiC substrate were observed. According to the observed results, the observed scattering light of nanoparticle on 4H-SiC was the ellipse shape compared with the observing on SiO₂ substrate. Furthermore, we could observe the particles moved nearer and then adhered on the surface. Less particle’s Brownian motion when the particle moved nearer to the surface. In case of nanoparticle with pad sliding, we could observe only the scattering light of pad sliding because the scattering light intensity of particle is quite lower than pad. Therefore, approached nanoparticle to 4H-SiC surface phenomena might be one possible role to explain higher polishing rate CMP parameter.</p>

DOI： 10.11522/pscjspe.2021a.0_102

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)

<p>An abrasive nanoparticle behavior in chemical mechanical polishing (CMP) process is a three-dimensional (3D) motion near a substrate or reference surface. The height position is a longitudinal distance between the reference surface and nanoparticle, which is a challenge for measuring the height position in a wet condition. Our previous report could estimate the relative height of polystyrene 100 nm particles by applying multi-wavelength evanescent fields, but the absolute height was not confirmed yet. Therefore, in this report, we proposed a design concept for absolute height verification by using the developed nano-step height patterns. The nano-step height was approximately less than hundred nanometers from the reference surface. The nano-step height made from an optical resin that has a refractive index close to water to decrease the scattering light during observing nanoparticles in water. Polystyrene 100 nm particles on the nano-step height were used to estimate the absolute height of nanoparticle. The proposed concept could be used to verify the nanoparticle's absolute height in water, which can be applied to clarify the nanoparticle phenomena during the CMP process in the near future.</p>

DOI： 10.11522/pscjspe.2021a.0_588

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

DOI： 10.11522/pscjspe.2021a.0_113

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

<p>The motion of nano-silica abrasive particle before attaching to the SiC surface being polished was analyzed numerically based on Brownian motion with DLVO theory, and then was compared with the results observed by evanescent light field localized on the SiC surface. We found that, when approximately 100 nm-sized silica particles are moving in close proximity within 100 nm from the SiC substrate surface, the nanoparticles would stay intermittently with slightly oscillating behavior before attaching to the surface.</p>

DOI： 10.11522/pscjspe.2021a.0_126

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

DOI： 10.11522/pscjspe.2021s.0_314

CiNii Article

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

<p>Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, these residual nanoparticles from polishing slurry on the wafer are usually inspected before-and-after cleaning process, not during the wet cleaning process. Accordingly, these cleaning phenomena mechanism on the surface have already not clearly known. Therefore, we have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light that is generated by an optically internal reflection. This report introduces some of observed physical characteristical phenomena during duplicated scrub cleaning process of 10 and 30 nm gold particles by PVA brushes without and with skin layer, which have different contact area ratio on the surface being cleaned.</p>

DOI： 10.1299/jsmekanto.2021.27.10a02

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CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekanto/2021.27/0/2021.27_10A02/_pdf

Authorship：Corresponding author   Language：English   Publishing type：Research paper (scientific journal)

<p>Superconductive-assisted machining (SUAM) is a polishing method that employs a magnetic levitation tool, which is based on a superconductive phenomenon called the pinning effect. Since the tool magnetically levitates, the issue of tool interference is eliminated. In this study, in order to set up the polishing conditions of the magnetic levitation tool, we evaluated the relation between the flux density distribution relative to the tool position and the holding force acting on the magnetic levitation tool to maintain its initial position, set by field cooling by the superconducting bulk. For the holding force, we measured the attractive, repulsive, restoring, and driving forces. We found that the greater the holding force, the smaller the initial distance between the superconducting bulk and the magnetic levitation tool. The attractive force was found to peak when the levitated tool was displaced 6 mm from an initial position of 9 mm from the bulk, and it became only the self-weight of the magnetic levitation tool at displacements of 30 mm and above, where the pinning effect broke down. We then evaluated the polishing characteristics for SUS304 and A1100P at a tool displacement that results in the maximum attractive force. In the polishing experiment, we employed a water-based diamond slurry because the temperature of the workpiece was close to room temperature. We found that it was possible to polish SUS304 and A1100P while avoiding the effects of magnetization due to the polishing pressure or induced currents that accompany the rotation of the metal plate. The arithmetic average roughness, <i>Ra</i>, of A1100P was relatively high due to the effect of scratches, while that of SUS304 improved from 92 nm before polishing to 55 nm after polishing when polished with grains with a diameter of 1 μm.</p>

DOI： 10.20965/IJAT.2021.P0234

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Language：English   Publishing type：Research paper (international conference proceedings)

<p>This study used a water-soluble inclusion complex, fullerene/β-cyclodextrins(C₆₀/β-CDs), as additive abrasive with conventional SiO₂ slurry for the chemical mechanical polishing/planarization(CMP) of the silicon carbide substrate wafer. The hydrodynamic size(<i>d_H</i>) of C₆₀/β-CDs suspension was measured by the dynamic light scattering(DLS) method; the appearance of a C₆₀/β-CDs inclusion complex is observed by TEM. The C₆₀/β-CDs hybrid SiO₂-based slurry performed a higher removal rate than conventional SiO₂ slurry, and the polished surface showed a lower depression and roughness, too.</p>

DOI： 10.1299/jsmelem.2021.10.094-114

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)

<p>Chemical-Mechanical Polishing (CMP) process has emerged as the method of choice for planarization in the semiconductor industry. The interaction force between the surface being polished and the abrasive nanoparticles plays a significant role in flattening the substrate surface in the CMP process. For example, when the SiO₂ nanoparticle is distant from the SiC substrate surface, the interaction force between the surface and the nanoparticles is presented. This force could be analysed using Derjaguin and Landau and Verwey and Overbeek (DLVO) theory and particle Brownian motion. According to the simulation results, we found that very fine abrasive nanoparticle such as smaller than approximately 10 nm is comparatively approach to the surface being polished more certainly.</p>

DOI： 10.1299/jsmelem.2021.10.178-171

CiNii Research

Language：English   Publishing type：Research paper (international conference proceedings)

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Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.1088/1361-6501/ab87ec

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Language：English   Publishing type：Research paper (international conference proceedings)

DOI： 10.1088/1742-6596/1590/1/012023

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Authorship：Last author   Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.35848/1347-4065/ab8c9b

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Language：Japanese   Publishing type：Research paper (scientific journal)

<p>Cleaning phenomena in semiconductor manufacturing is about the nano-contamination being repelled out from, or adhering to, the wafer surface. However, residual contamination on the wafer has been usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light generated by internal reflection. This article introduces some of observed physical phenomena during duplicated cleaning process in both contact cleaning by a PVA brush and non-contact cleaning by mega-sonic wave.</p>

DOI： 10.1299/jsmekanto.2020.17e02

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekanto/2020/0/2020_17E02/_pdf

Language：English   Publishing type：Research paper (international conference proceedings)

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Language：Japanese   Publishing type：Research paper (other academic)

DOI： 10.11522/pscjspe.2020S.0_486

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007896718

Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.11522/pscjspe.2020S.0_660

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007896839

Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.11522/pscjspe.2020S.0_588

CiNii Article

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DOI： 10.11522/pscjspe.2020S.0_622

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DOI： 10.11522/pscjspe.2020S.0_658

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DOI： 10.1109/ESIT.2018.8665198

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The manufacturing process of the transparent pad was developed by the thermal imprint method equipped with a special jig for controlling the thickness, pattern and electrode structure. Particle behavior is controlled by the electric field using a wire mesh inserted into a low index transparent polishing pad. As a result, the movement of hybrid particles of diamond particles and silica particles can be observed in an electric field using a digital microscope. Furthermore, in the polishing experiment, it was possible to obtain a higher amount of material removal in the presence of the electric field than in the absence of the electric field.

DOI： 10.1299/jsmemmt.2019.13.D39

CiNii Article

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Language：Japanese   Publishing type：Research paper (conference, symposium, etc.)

In surface fabrication process, such as the polishing in semiconductor substrate, there are many nano-particles moving on or nearby the surface to be polished. We have been establishing an optical method to observe and to track the 3-dimensional position of each dynamical moving nano-particle on time by applying an evanescent light field. In this report, the scattering light characteristic from a moving nano-particle in an evanescent field generated by internal reflection on a silica glass surface was analysed by FDTD (Finite Difference Time Domain) method on MATLAB. We discuss the scattering light from a particle moving perpendicularly to a surface in an interval time as one recorded frame in practical observation.

DOI： 10.1299/jsmemmt.2019.13.D18

CiNii Article

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Language：Japanese   Publishing type：Research paper (conference, symposium, etc.)

In recent years, superconductive assisted machining method (SUAM) using a magnetic levitation tool utilizing a superconducting phenomenon such as pinning effect has been developed to reduce tool interference on the conventinal procceing method. Measurement of the force by the magnetic levitation tool is evauated in the air to determind polishing conditions. In our study, polishing test were performed not only on aluminum plate but also stainless steel plate using fixed and loose abrasives. As a result, the superconductive assisted machining method was applicable to stainless steel material.

DOI： 10.1299/jsmemmt.2019.13.D38

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DOI： 10.1149/09202.0191ecst

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DOI： 10.11522/pscjspe.2019S.0_904

CiNii Article

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DOI： 10.11522/pscjspe.2019S.0_459

CiNii Article

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Language：English   Publishing type：Research paper (other academic)

DOI： 10.1299/jsmekyushu.2019.72.A42

CiNii Article

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Language：English   Publishing type：Research paper (other academic)

DOI： 10.11522/pscjspe.2019A.0_18

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007800812

Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.7567/JJAP.57.07MD03

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<p>We repot on the hybrid fine particles using core silica particles adsorbed on the ultra fine nano particles such as nano silica particles (ca.4nm diameter) and fullerenol for Chemical Mechanical Polishing of Hard to process materials. In our study, chemical reactivity and mechanical action from the hybrid particles were investigated using the several diameters of the core silica particles. At the case of adsorption of the nano silica particles and fullerenol, chemical reactivity become dominant parameter under the small size region although the nano particle is coated on the surface of the core silica particles. These results expect that both parameters as chemical reactivity and mechanical action can be control by the sizes of core particles and coating condition of the nano silica particles. We also optimize the structure of the hybrid silica particles at the case of the nano silica particles and/or fullerenol to meet the high performance CMP of hard to process materials and discuss about these results.</p>

DOI： 10.11522/pscjspe.2018A.0_312

CiNii Article

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Precision machining techniques have a number of serious problem, such as tool interference against complicated machining shapes and improvement of accuracy in processing. To resolve these issues, we suggest the Superconductive Assisted Machining (SUAM) method, which involves application of a magnetic levitation tool using the pinning effect of superconductivity during polishing processing. The SUAM method can eliminate tool interference because machining shape is determined by movement of the magnetic levitation tool during processing. Here, we measured the holding force, such as attractive and repulsive forces, from the pinning effect of superconductivity. The results indicated a maximum attractive force of 4 N with an initial magnetic levitation tool height of 9 mm. In this case, the holding force was dependent on the initial distance between the magnetic levitation tool and the superconductor bulk. In addition, we evaluated the dependence of polishing pressure and rotation frequency on polishing rate using fixed abrasive polishing pads. The results indicated that the polishing removal rates increase with increasing polishing pressure and rotation frequency.

DOI： 10.11420/jsat.62.219

CiNii Article

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Fabrication process of the pad has been developed by imprint method with special zig to control of the thickness and patter and electrode structure. Movement of the fine particle is controlled by electrical field using copper wire electrode inserted in the low refractive index – transparency polishing pad. As results, we can be observe the movement of the diamond particle between the pattern structures under the pad by electrical field using digital microscope.

DOI： 10.1299/jsmemmt.2018.12.D06

CiNii Article

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Language：Japanese   Publishing type：Research paper (other academic)

<p>The study on adhesion and desorption mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. This report proposes an optical method to visualize only the nano-particles moving near to Si₃N₄ and SiO₂ film surfaces by applying an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. Adhesion and desorption phenomena of the polystyrene latex standard particles (50±1 nm) and the SiO₂ particles (55 nm) moving near to the Si₃N₄ and SiO₂ film surfaces were observed by our developed experimental setup. Furthermore, desorption phenomenon of SiO₂ particles (105 nm) with the flow occurred by polyvinyl alcohol (PVA) sponge brush sliding was also demonstrated.</p>

DOI： 10.1299/jsmekanto.2018.24.OS0105

CiNii Article

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Language：Japanese   Publishing type：Research paper (other academic)

DOI： 10.11522/pscjspe.2018S.0_129

CiNii Article

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Language：English   Publishing type：Research paper (international conference proceedings)

© 2018 CURRAN-CONFERENCE. All rights reserved. This study proposes a non-contact measurement method for detecting a micro tool tip position at a nanometre precision in atmospheric environment as a non-contact tool setter. Particularly, to measure rotating small tools, optical measurement method are applied in non-contact tool setters. However, the generally used geometrical optical measurement methods do fundamentally not have nanometre precision due to the well-known light diffraction phenomenon, notably when measuring a micro tool. Furthermore, the non-contact tool setter for measuring a rotating micro tool has been indispensable because the position of a tool tip during rotation is different from the position of a static tool. The precision of tool position non-contact measurement is definitely required in nanometre scale due to the miniaturization of micro rotating tool size down to smaller than 50 μm. An evanescent light field is applied to detect a micro tool tip position in nanometre scale without contacting between a micro tool and a reference surface. In this paper, non-rotation micro tools with diameter of 50 μm were experimentally approached to and/or departed from a reference surface of a plano-convex lens by a nano-controlled piezo actuator to verify our proposed detection method. Consequently, the tool tips were recognised in the evanescent field during 300 nm range (or the evanescent field effective penetration depth) from the reference surface. It implies that the tool tip position could be detected more precisely than ±150 nm by only recognising the scattering light from the evanescent light field without tool contacting.

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DOI： 10.11522/pscjspe.2018S.0_781

CiNii Article

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DOI： 10.1299/jsmekyushu.2018.71.G26

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Language：Japanese   Publishing type：Research paper (other academic)

DOI： 10.11522/pscjspe.2018A.0_295

CiNii Article

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Language：English   Publishing type：Research paper (international conference proceedings)

DOI： 10.1088/1742-6596/871/1/012048

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DOI： 10.7567/JJAP.56.07KH02

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DOI： 10.7567/JJAP.56.07KB01

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DOI： 10.20965/ijat.2017.p0736

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Language：Japanese   Publishing type：Research paper (scientific journal)

<p>Non-contact tool setter for rotating micro tools has been needed because the position of tool tip during rotation is different from the position when the tool is not rotating. Furthermore, precision of tool position measurement is definitely required in nanoscale due to the miniaturization of micro rotating tool size down to smaller than 50<i>μ</i>m. An evanescent light field is applied to detect a micro tool tip position in nanoscale without contacting between micro tool and detector. In this report, micro tools with diameter of <i>φ</i> 50<i>μ</i>m were approached to and/or departed from a glass reference plane surface by a nano-controled piezo actuator to verify our detection method. Consequently, the tool tips were detected in the evanescent field during 300 nm range from the reference surface, implying that the tool tip can be detected in the precision of less than ±150 nm by only observing the scattering light from the evanescent light field without contacting.</p>

DOI： 10.1299/jsmemecj.2017.s1330103

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmemecj/2017/0/2017_S1330103/_pdf

Authorship：Corresponding author   Language：Japanese   Publishing type：Research paper (scientific journal)

DOI： 10.11522/pscjspe.2017a.0_765

CiNii Article

CiNii Research

Authorship：Corresponding author   Language：Japanese   Publishing type：Research paper (scientific journal)

DOI： 10.1299/jsmekyushu.2017.70.907

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekyushu/2017.70/0/2017.70_907/_pdf

Language：Japanese   Publishing type：Research paper (scientific journal)

ナノスケールにおける加工現象として，ナノ粒子を用いたポリシング加工がある．本研究は，ポリシング加工のナノ粒子の挙動を観察し，ナノ粒子による加工現象を解明することを目的とする．そこで本研究では，表面上近傍に局在するエバネッセント光を用いた実時間観測を行っている．既知のナノ単粒子に多波長エバネッセント光を当て，その散乱光の強度を調べたので，ここに報告する．

DOI： 10.11522/pscjspe.2017a.0_985

CiNii Article

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

During copper chemical mechanical polishing (CMP) process, large amount of contamination residues on polished surface as removing of great number of copper. The common contaminations such as abrasives, metallic ion, and organic compound, that will discourage the metallic line of fabrication, even result in decline of efficiency. Benzotriazole(BTA) is known as passivation behavior that combined with metallic surface forming the protective layer from the serious corrosion, but it indicates a feature hard to be removed comprehensively in the general cleaning solution, for example water, ethanol, and acetone…etc. Polyhydroxylated fullerene, called fullerenol, as the outstanding nanoparticle is utilized in biomedicine, material science, and precision engineering fields according to its water-solubility, medicinal chemistry, and cage structure. This study aims to introduce the diluted fullerenol solution to remove the remained BTA film in post cleaning system. The 20mm in square of copper specimen is treated by 0.05M BTA solution for 2 min, and then dipped into diluted fullerenol solution for 2 min. Finally, it is measured by x-ray photoelectron spectroscopy (XPS), to observe the signal from 1s orbital of nitrogen. The results show the N1s peak (˜400eV) is decrease even disappears after treated by diluted fullerenol solution (0.01wt%, 0.05wt%, and 0.1wt%).

DOI： 10.11522/pscjspe.2017s.0_789

CiNii Article

CiNii Research

Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.7567/JJAP.55.06JG02

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/150000112623

Language：English   Publishing type：Research paper (international conference proceedings)

Scopus

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84964413075&origin=inward

Authorship：Corresponding author   Language：Japanese   Publishing type：Research paper (scientific journal)

<p>Transparency micro-patterned pad is used to observe fine particles by an epi-illumination microscope. The material of transparency micro-patterned pad is resin which has almost same as the refractive index of water. Therefore, it has characteristic that the micro pattern could disappear in the observation image by filling water. Epi-illumination microscope has illumination system and the detection system on the same side. In this study, we succeeded to observe the diamond particles with a diameter of 1μm on the glass substrate at 1000 frame/s in dark-field illumination. This results show that the fine particles could be observed simplicity, and also suggest the possibility that the fine particles observation on opaque substrate using the epi-illumination microscope.</p>

DOI： 10.1299/jsmemecj.2016.s1330203

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmemecj/2016/0/2016_S1330203/_pdf

Language：Japanese   Publishing type：Research paper (scientific journal)

本研究では超電導現象である磁気浮上を利用し、金型や3Dプリンタなどの中空部品成形技術が抱える問題を解消する新規中空加工技術の確立を目指している。その概要としては、磁気浮上を利用して磁性体や超伝導体を一定間隔離して浮上させトラップし、さらに回転運動を加え回転工具とすることで被加工物を切削する技術である。本報では樹脂などを用いて本加工技術の原理検証を行ったので、その内容について報告する。

DOI： 10.11522/pscjspe.2016s.0_971

CiNii Article

CiNii Research

Authorship：Corresponding author   Language：Japanese   Publishing type：Research paper (scientific journal)

CMPでは，複数の加工材料に対して最適なスラリーやポリシングパッドを適用させる必要がある．これらの部材を最適化するためには，材料除去メカニズムに基づき，スラリー中微粒子の種類や微粒子径，材質，薬液を選定することが重要である．そこで本研究では，サファイア，SiO2などの複数の基板に対して動的光散乱法（DLS）を用いて微粒子径の変化について評価したので報告する．

DOI： 10.11522/pscjspe.2016s.0_371

CiNii Article

CiNii Research

Language：Japanese   Publishing type：Research paper (scientific journal)

This report proposes a new method to three-dimensionally track each single nano-particle that has been interacting with a surface in nanoscale processing phenomena by using dual wavelength of evanescent field.

DOI： 10.11522/pscjspe.2016s.0_5

CiNii Article

CiNii Research

Language：English   Publishing type：Research paper (other academic)

This research studies the method to optimization of polishing slurry which colloidal silica based (SiO_2 slurry) containing C_<60>(OH)_n n=ca.10 for Chemical Mechanical Polishing (CMP) process by concentration dependence on the C_<60>(OH)_n solute between 0-0.05 wt% and varying size of abrasive particle in colloidal silica slurry between 20-55 nm. We focussed on relationship between the effect of abrasive particle size and polishing performance such as Material Removl Rate (MRR) and surface roughness of sapphire substartes. This paper consists of two parts, the first section in order of slurry preparation and polishing condition setting up for CMP process. The last section are the MRR value calculating and abrasive particle diameter size before and after CMP process measuring for optimization of mixed colloidal silica and fullerenol slurry in CMP of sapphire. These results indicate that diameter of the fine particle composed by colloidal silica slurry and C_<60>(OH)_n is a dominant parametrs to determid the MRR values against the apphire CMP.

DOI： 10.1299/jsmekyushu.2016.69.361

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekyushu/2016.69/0/2016.69_361/_pdf

Authorship：Corresponding author   Language：English   Publishing type：Research paper (international conference proceedings)

日本   神戸   2014.11.19  -  2014.11.21

DOI： 10.1109/ICPT.2014.7017281

Scopus

Other Link： http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6996093

Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.1299/jsmekyushu.2014.67._724-1_

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110009951361

Language：English   Publishing type：Research paper (scientific journal)

The material removal mechanisms on the SiO_2-CMP have been studied to develop new slurries and polishing pads for the advanced ULSI devices. We focus on the chemical reacted layer at the surface of SiO_2 film because formation of the layer is effected by pH of the slurry. Relationship between the MRR (Material removal rate) and chemical reacted layer was suggested by the results of the CMP tests and SEM observations at various pH conditions from 7.5 to 12.5. The size of the SiO_2 fine particles increase as the higher pH reason because the surface of the SiO_2 fine particles might be changed during the CMP. In our report, we discuss the material removal mechanism based on the experimental result of the SEM observation on the SiO_2 fine particles.

DOI： 10.1299/jsmemmt.2014.10.175

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110009939352

Language：Japanese   Publishing type：Research paper (other academic)

Improvement of polishing performance against the hard-to-work material is required to realize high throughput manufacturing process of the wafers. Recently, Doi has reported new polishing technology of the high efficiency polishing methods of the materials assisted by plasma. In this method, it is difficult to use conventional polishing device because of microwave resistance. We develop new nano carbon particle formed by UV laser irradiation against fullerenol and diamond particles for the polishing method and will report our experimental results.

DOI： 10.11522/pscjspe.2014A.0_19

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130005479359

Language：Japanese   Publishing type：Research paper (other academic)

DOI： 10.11522/pscjspe.2014S.0_279

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130005478850

Language：English   Publishing type：Research paper (other academic)

Material Removal Rate of sapphire CMP using silica slurry with the fullerenol increase as the higher concentration of the fullerenol in the slurry. The surface roughness of the sapphire substrate gives the influence against the MRR of sapphire CMP. Raman spectra indicate that molecule structure did not change during CMP process. The structure of fine particle by silica particle and fullerenol in the liquid characterize using DLS method. As results, two layers fullerenol molecules are adsorbed on the silica particle. And we discuss on the fine particle with the fullerenol based on our results.

DOI： 10.1299/jsmemmt.2014.10.177

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110009939353

Authorship：Corresponding author   Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.1143/JJAP.51.05EF04

Scopus

CiNii Article

Other Link： http://iopscience.iop.org/1347-4065/

Language：English   Publishing type：Research paper (scientific journal)

DOI： 10.20965/ijat.2012.p0163

Scopus

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84863240980&origin=inward

Authorship：Corresponding author   Language：English   Publishing type：Research paper (scientific journal)

Language：English   Publishing type：Research paper (scientific journal)

Scopus

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84862909298&origin=inward

Language：English   Publishing type：Research paper (international conference proceedings)

Scopus

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=79957668547&origin=inward

Event date： 2017.01   Language：English  

水と同等の屈折率を有する透明な樹脂パッドを用いて、スラリー中の微粒子観察やシリコン酸化膜の膜測など、CMPにおけるモニタリング技術に関する研究を行っている。今回は低屈折率の透明樹脂パッドを用いたモニタリング技術のコンセプトと、その足がかりとなる実験データについて報告する。

CiNii Article

Event date： 2017.01   Language：Japanese  

ナノスケールにおける加工現象として，ナノ粒子を用いたポリシング加工がある．本研究は，ポリシング加工のナノ粒子の挙動を観察し，ナノ粒子による加工現象を解明することを目的とする．そこで本研究では，表面上近傍に局在するエバネッセント光を用いた実時間観測を行っている．既知のナノ単粒子に多波長エバネッセント光を当て，その散乱光の強度を調べたので，ここに報告する．

CiNii Article

Event date： 2017.01   Language：English  

CiNii Article

Event date： 2016.01   Language：Japanese  

CiNii Article

Event date： 2016.01   Language：Japanese  

本研究では超電導現象である磁気浮上を利用し、金型や3Dプリンタなどの中空部品成形技術が抱える問題を解消する新規中空加工技術の確立を目指している。その概要としては、磁気浮上を利用して磁性体や超伝導体を一定間隔離して浮上させトラップし、さらに回転運動を加え回転工具とすることで被加工物を切削する技術である。本報では樹脂などを用いて本加工技術の原理検証を行ったので、その内容について報告する。

CiNii Article

Event date： 2016.01   Language：Japanese  

CMPでは，複数の加工材料に対して最適なスラリーやポリシングパッドを適用させる必要がある．これらの部材を最適化するためには，材料除去メカニズムに基づき，スラリー中微粒子の種類や微粒子径，材質，薬液を選定することが重要である．そこで本研究では，サファイア，SiO2などの複数の基板に対して動的光散乱法（DLS）を用いて微粒子径の変化について評価したので報告する．

CiNii Article

Event date： 2016.01   Language：Japanese  

CiNii Article

Event date： 2016.01   Language：English  

This research studies the method to optimization of polishing slurry which colloidal silica based (SiO_2 slurry) containing C_<60>(OH)_n n=ca.10 for Chemical Mechanical Polishing (CMP) process by concentration dependence on the C_<60>(OH)_n solute between 0-0.05 wt% and varying size of abrasive particle in colloidal silica slurry between 20-55 nm. We focussed on relationship between the effect of abrasive particle size and polishing performance such as Material Removl Rate (MRR) and surface roughness of sapphire substartes. This paper consists of two parts, the first section in order of slurry preparation and polishing condition setting up for CMP process. The last section are the MRR value calculating and abrasive particle diameter size before and after CMP process measuring for optimization of mixed colloidal silica and fullerenol slurry in CMP of sapphire. These results indicate that diameter of the fine particle composed by colloidal silica slurry and C_<60>(OH)_n is a dominant parametrs to determid the MRR values against the apphire CMP.

CiNii Article

Event date： 2015.10.18   Language：English  

This article reveals a non-contact measurement method for evaluating micro cutting tool diameter in precision of sub micrometer in atmosphere environment. Practically, optical methods are widely used in non-contact tool measurements. However, the generally-used geometrical optical measurement methods do fundamentally not have sub micrometer precision due to well-known light diffraction phenomenon, notably when measuring a micro tool. We have been proposing and developing a measurement method particularly for the micro tool applying laser diffraction. In this article, we subtracted a transparent light component from a laser light distribution diffracted by the micro tool to be measured to enhance diffraction pattern characteristics. Consequently, micro rods of 15, 20 and 30 micrometer in diameter could be precisely measured. Furthermore, in order to verify this measurement validity, a 2 helical flutes micro tool (20 micrometer in diameter) during rotation (4 min-1) was also measured as 400 nm difference comparatively with an image from a scanning electron microscopy (SEM) image.

Event date： 2015.10.18   Language：English  

Transparency micro-patterned pad, which have high transmittance at the visible wavelength region and low refractive index equivalent to water, has been developed to observe particle movement during lapping and polishing process directly. The fundamental geometry of the micro pattern has a trapezoidal pyramid shape having the base width of 6.97 μm, the height of 2.40 μm and the pitch of 12.00 μm. In the case of transparency micro-patterned pad at low diffraction index, pyramid pattern contrast in the observation image could be eliminated by filling water between the transparency micro-patterned pad and glass substrate. Therefore, we succeeded observation on the movement of diamond particles by light scattering without interference from the transparency micro-patterned pad pattern. This observation results suggest that the transparency micro-patterned pad would be a useful tool for the dynamic observation directly during the lapping and polishing.

Event date： 2015.01   Language：Japanese  

CiNii Article

Event date： 2015.01   Language：Japanese  

CiNii Article

Event date： 2015.01   Language：Japanese  

CiNii Article

Event date： 2015.01   Language：Japanese  

CiNii Article

Event date： 2015.01   Language：Japanese  

CiNii Article

Event date： 2015.01   Language：English  

Transparency micro-patterned pad, which have high transmittance at the visible wavelength region and low refractive index equivalent to water, has been developed to observe particle movement during lapping and polishing process directly. The fundamental geometry of the micro pattern has a trapezoidal pyramid shape having the base width of 6.97μm, the height of 2.40μm and the pitch of 12.00μm. In the case of transparency micro-patterned pad at low diffraction index, pyramid pattern contrast in the observation image could be eliminated by filling water between the transparency micro-patterned pad and glass substrate. Therefore, we succeeded observation on the movement of diamond particles by light scattering without interference from the transparency micro-patterned pad pattern. This observation results suggest that the transparency micro-patterned pad would be a useful tool for the dynamic observation directly during the lapping and polishing.

CiNii Article

Event date： 2015.01   Language：English  

This article reveals a non-contact measurement method for evaluating micro cutting tool diameter in precision of sub micrometer in atmosphere environment. Practically, optical methods are widely used in non-contact tool measurements. However, the generally-used geometrical optical measurement methods do fundamentally not have sub micrometer precision due to well-known light diffraction phenomenon, notably when measuring a micro tool. We have been proposing and developing a measurement method particularly for the micro tool applying laser diffraction. In this article, we subtracted a transparent light component from a laser light distribution diffracted by the micro tool to be measured to enhance diffraction pattern characteristics. Consequently, micro rods of 15, 20 and 30 micrometer in diameter could be precisely measured. Furthermore, in order to verify this measurement validity, a 2 helical flutes micro tool (20 micrometer in diameter) during rotation (4 min^<-1>) was also measured as 400 nm difference comparatively with an image from a scanning electron microscopy (SEM) image.

CiNii Article

Event date： 2015.01   Language：English  

CiNii Article

Event date： 2015.01   Language：English  

CiNii Article

Event date： 2012.01.01   Language：English  

The Far-field laser diffraction has been applying to monitor tool cutting-edge position with sub-micrometre precision because of eliciting a diffraction phenomenon. In this paper, a pulsed laser was irradiated to a gap consisting of a high-speed (150,000min-1) rotation tool and a workpiece edge in order to experimentally measured the distance of the tool tip away from the workpiece every 50 nm by the detected diffraction pattern.

Event date： 2011.03.01   Language：English  

A fluorescent agent was used instead of slurry to visualize the flow of slurry, the polishing liquid solution supplied in Chemical Mechanical Polishing (CMP). Under ultraviolet irradiation, the fluorescent agent emits light, which performs the flow of the slurry under the quartz glass, which is applied as a photomask substrate in Flat-Panel Display (FPD) manufacturing. The emitted light was observed with a digital camera. Compared to a round shape of quartz glass substrate, a large amount of fluorescent agent supplied was taken away by the straight edges of the quadrilateral geometry of the substrate and moved to the outer edge of a polishing pad placed on a platen. The fluorescent agent that was taken away by the quadrilateral geometry also remained as several uneven spiral patterns on the polishing pad when the revolution speeds both of the quadrilateral substrate and the platen, which are practically set at same or almost revolution speed, were not sufficient. Next, when the quadrilateral substrate rotated at high revolution speed (60 min -1), the fluorescent agent flowed most evenly and spread throughout the entire substrate area in the shortest time. Finally, a combination of thermocouples and a wireless signal transmission system is introduced to investigate the temperature in glass substrate CMP process.

Event date： 2010.12.01   Language：English  

CMP is applied to polish the photomask substrate. The quadrilateral quartz glass used as the FPD photomask substrate has become enlarged. However, the slurry cannot flow throughout the glass surface evenly due to enlarged size of the substrate. The purpose of this work is to improve on the spread of slurry into non-inflow region by suctioning the slurry on the polishing pad through a hole at center of platen. The fluorescent agent was used instead of slurry for flow visualization.

Audience： High school students

Type：Visiting lecture

長崎県立松浦高等学校

Audience： High school students

Type：Visiting lecture

熊本県立東稜高等学校

Audience： High school students

Type：Visiting lecture

広島県立海田高等学校

Audience： High school students

Type：Visiting lecture

熊本市立必由館高等学校　2年

Audience： High school students

Type：Visiting lecture

福岡県立太宰府高等学校　1年

Audience： Junior students

Type：Visiting lecture

明治学園中学校　1~2年

Audience： High school students

Type：Visiting lecture

広島なぎさ高等学校　2年

Audience： High school students

Type：Visiting lecture

熊本県立阿蘇中央高等学校　1～2年

Audience： High school students

Type：Visiting lecture

福岡県立中間高等学校　1～3年

Audience： High school students

Type：Visiting lecture

筑紫台高等学校