Faculty Profiles - SUZUKI Keisuke

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Study on material removal mechanism for Cu-CMP on a patterned silicon wafer Reviewed International journal

Bakier M.A.Y.A., Matsumoto R., Fuchiwaki M., Khajornrungruang P., Suzuki K.

10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021 243 - 245 2021.01

Investigation on the Abrasive Phenomenon of Colloidal SiO<inf>2</inf> Particles and Water-soluble C<inf>60</inf> Inclusion Complex Particles in the CMP Process of the 4H-SiC Substrate Wafer Reviewed

Tsai Y.H., Suzuki K., Chen C.C.A., Khajornrnrungruang P.

10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021 248 - 251 2021.01

Study on polishing method using double magnet system by superconductive assisted machining method Reviewed International journal

Suzuki K., Nakasaki T., Nakashima H., Kajornrunruan P., Onomata M., Kinoshita Y., Zhang R., Otabe E.S.

JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, LEMP 2020 2020.01

Development of new polishing pad with a semispherical shape formed by materials with different wear rates Reviewed

ONIKI Takahiro, KATO Yuya, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke, TASHIRO Yasunori, MATSUO Masaaki

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 62 ( 5 ) 264 - 266 2018.05

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (scientific journal)

We have developed a polishing pad using materials with different wear rates to achieve highly efficient polishing of difficult-to-process material substrates. Nylon fibers with good mechanical properties are arranged with other materials, followed by dressing to form protrusions on the polishing pad surface. Stable polishing performance can be expected if the orientation and arrangement of the nylon fibers can be controlled. A sapphire substrate was polished using the prototype polishing pad developed in this research. The results indicated 30% improvement in material removal rate compared to the ready-made pad.

DOI： 10.11420/jsat.62.264

Analytical on mixed colloidal silica particle in slurry of sapphire Chemical Mechanical Polishing Reviewed International journal

BUN-ATHUEK NATTHAPHON, YOSHIMOTO YUTAKA, SAKAI KOYA, KHAJORNRUNGRUANG PANART, SUZUKI KEISUKE

Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers ) 2017.9 ( 0 ) 173 2017.11

Authorship：Last author Language：English Publishing type：Research paper (international conference proceedings)

Mixed colloidal silica particles as abrasive in slurries have been proposed to improve and realize a high removal rate and smooth surface without subsurface damage, on sapphire chemical mechanical polishing (CMP). Mixed silica particles were fabricated by different sizes of nano-silica particle with the range of pH 7-13. The characteristics of the mixed large and small silica particles has been observed. Dynamic light scattering (DLS) spectra results revealed that the structure of the mixed particle, the small particle at the size of 4 nm are adsorbed on the large silica particles and increase in the size of the abrasive particles. Furthermore, we found that pH value affected to abrasive particle size. In these cases, our polishing tests results show that material removal rate (MRR) of the sapphire CMP totally increase. This confirmed that mixed particles could produce a higher MRR than single colloidal silica slurry. Finally, the mechanism of sapphire removal was discussed.

DOI： 10.1299/jsmelem.2017.9.173

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低屈折率の透明樹脂パッドを用いたCMPにおけるモニタリング技術に関する研究

鬼木喬玄, 鈴木恵友, カチョーンルンルアンパナート

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2017S ( 0 ) 523 - 524 2017.01

Language：Japanese Publishing type：Research paper (scientific journal)

水と同等の屈折率を有する透明な樹脂パッドを用いて、スラリー中の微粒子観察やシリコン酸化膜の膜測など、CMPにおけるモニタリング技術に関する研究を行っている。今回は低屈折率の透明樹脂パッドを用いたモニタリング技術のコンセプトと、その足がかりとなる実験データについて報告する。

DOI： 10.11522/pscjspe.2017s.0_523

5G・ポスト5Gに向けた次世代半導体実装の試作開発と評価技術 Reviewed

末次正, 鈴木恵友

精密工学会誌 ( 公益社団法人精密工学会 ) 88 ( 6 ) 427 - 430 2022.06

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2022S ( 0 ) 126 - 126 2022.03

A Novel Method for 3D Nanoscale Tracking of 100 nm Polystyrene Particles in Multi-Wavelength Evanescent Fields Microscopy – Absolute Difference Height Verification – Reviewed International journal

Blattler Aran, Khajornrungruang Panart, Suzuki Keisuke, Saenna Soraya

International Journal of Automation Technology ( Fuji Technology Press Ltd. ) 15 ( 6 ) 831 - 841 2021.11

Language：English Publishing type：Research paper (scientific journal)

Total internal reflection is an optical imaging technique for nanoparticle tracking and observation employing the scattered light from an evanescent field near the interface or reference surface. Generally, the nanoparticle behavior is the three-dimensional Brownian motion in an aqueous medium. The motion can be traced by an optical microscopy, but it cannot be traced by an electron microscopy technique. In the three-dimensional nanoparticle moving position, the X and Y positions are parallel to the surface, which can be traced by the general microscopy techniques. However, the height position Z of a nanoparticle perpendicular to the surface could not be traced without the longitudinal scanning method. Here, a novel method is proposed to investigate the 3D position of nanoparticles by applying multi-wavelength evanescent fields microscopy, which has a high spatial resolution in the Z-direction without longitudinal scanning. This paper focuses on the verification of measurement in the Z-direction. A piezoelectric actuator was employed to control the nanoparticle displacement in height Z. Standard polystyrene 100 nm particles were randomly adhered on a spherical tip that connected with the piezoelectric actuator. The spherical tip was essentially made from an optical adhesive (n = 1.348) with a refractive index close to the water for decreasing the unnecessary signal from the tip-self during nanoparticle observation in the water. The proposed method could obtain the multi-wavelength scattering lights from the observed nanoparticles by an 8-bit color camera with higher than 50 frames per second recording to investigate the 3D nanoscale tracking. The X and Y positions of nanoparticles were determined by the centroid of the scattering light intensities. The height Z was determined from the logarithm ratios between the detected scattering light intensities of both wavelengths. The measurement repeatability of the absolute difference in height between nanoparticles could be measured less than ±16 nm by using the proposed method. The penetration height measurability range was approximated at 250 nm from the reference surface.

DOI： 10.20965/ijat.2021.p0831

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Study on Nanoscale Observatory in Polishing Phenomena applying Optical Evanescent Field

Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Baba Akiyoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 102 - 103 2021.09

Language：English Publishing type：Research paper (scientific journal)

The nanoscale polishing phenomena between substrate surface, 105 nm-sized SiO2 particles slurry, and polishing pad during CMP process were experimentally observed and evaluated to identify the main factors which effectively polish a 4H-SiC substrate. The nanoscale polishing phenomena were observed in-situ by our developed compact apparatus applied an optical evanescent field. The observation is able to detect the scattering light from either the nano-abrasive particles or the pad asperities when they react to the surface to being polishing. The nanoparticle motion phenomena, which two conditions (i)only nanoparticles (without pad) and (ii)nanoparticles with pad sliding, on 4H-SiC substrate were observed. According to the observed results, the observed scattering light of nanoparticle on 4H-SiC was the ellipse shape compared with the observing on SiO2 substrate. Furthermore, we could observe the particles moved nearer and then adhered on the surface. Less particle’s Brownian motion when the particle moved nearer to the surface. In case of nanoparticle with pad sliding, we could observe only the scattering light of pad sliding because the scattering light intensity of particle is quite lower than pad. Therefore, approached nanoparticle to 4H-SiC surface phenomena might be one possible role to explain higher polishing rate CMP parameter.

DOI： 10.11522/pscjspe.2021a.0_102

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale

Blattler Aran, Khajornrungruang Panart, Suzuki Keisuke, Baba Akiyoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 588 - 589 2021.09

Language：English Publishing type：Research paper (scientific journal)

An abrasive nanoparticle behavior in chemical mechanical polishing (CMP) process is a three-dimensional (3D) motion near a substrate or reference surface. The height position is a longitudinal distance between the reference surface and nanoparticle, which is a challenge for measuring the height position in a wet condition. Our previous report could estimate the relative height of polystyrene 100 nm particles by applying multi-wavelength evanescent fields, but the absolute height was not confirmed yet. Therefore, in this report, we proposed a design concept for absolute height verification by using the developed nano-step height patterns. The nano-step height was approximately less than hundred nanometers from the reference surface. The nano-step height made from an optical resin that has a refractive index close to water to decrease the scattering light during observing nanoparticles in water. Polystyrene 100 nm particles on the nano-step height were used to estimate the absolute height of nanoparticle. The proposed concept could be used to verify the nanoparticle's absolute height in water, which can be applied to clarify the nanoparticle phenomena during the CMP process in the near future.

DOI： 10.11522/pscjspe.2021a.0_588

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 113 - 114 2021.09

Computational analysis of nano abrasive motion on SiC surface

Saenna Soraya, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Permpatdechakul Thitipat

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 126 - 127 2021.09

Language：Japanese Publishing type：Research paper (scientific journal)

The motion of nano-silica abrasive particle before attaching to the SiC surface being polished was analyzed numerically based on Brownian motion with DLVO theory, and then was compared with the results observed by evanescent light field localized on the SiC surface. We found that, when approximately 100 nm-sized silica particles are moving in close proximity within 100 nm from the SiC substrate surface, the nanoparticles would stay intermittently with slightly oscillating behavior before attaching to the surface.

DOI： 10.11522/pscjspe.2021a.0_126

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021S ( 0 ) 314 - 315 2021.03

Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, UTSUMI Haruki, HAMADA Satomi, WADA Yutaka, HIYAMA Hirokuni

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2021.27 ( 0 ) 10A02 2021.01

Language：Japanese Publishing type：Research paper (scientific journal)

Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, these residual nanoparticles from polishing slurry on the wafer are usually inspected before-and-after cleaning process, not during the wet cleaning process. Accordingly, these cleaning phenomena mechanism on the surface have already not clearly known. Therefore, we have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light that is generated by an optically internal reflection. This report introduces some of observed physical characteristical phenomena during duplicated scrub cleaning process of 10 and 30 nm gold particles by PVA brushes without and with skin layer, which have different contact area ratio on the surface being cleaned.

DOI： 10.1299/jsmekanto.2021.27.10a02

Other Link： https://www.jstage.jst.go.jp/article/jsmekanto/2021.27/0/2021.27_10A02/_pdf

Study on Polishing Method Using Magnetic Levitation Tool in Superconductive-Assisted Machining Reviewed International journal

Nakashima Hidetaka, Nakasaki Tatsuya, Tanaka Tatsuhiro, Kinoshita Yushi, Tanaka Yuki, Khajornrungruang Panart, Otabe Edmund Soji, Suzuki Keisuke

International Journal of Automation Technology ( Fuji Technology Press Ltd. ) 15 ( 2 ) 234 - 242 2021.01

Authorship：Corresponding author Language：English Publishing type：Research paper (scientific journal)

Superconductive-assisted machining (SUAM) is a polishing method that employs a magnetic levitation tool, which is based on a superconductive phenomenon called the pinning effect. Since the tool magnetically levitates, the issue of tool interference is eliminated. In this study, in order to set up the polishing conditions of the magnetic levitation tool, we evaluated the relation between the flux density distribution relative to the tool position and the holding force acting on the magnetic levitation tool to maintain its initial position, set by field cooling by the superconducting bulk. For the holding force, we measured the attractive, repulsive, restoring, and driving forces. We found that the greater the holding force, the smaller the initial distance between the superconducting bulk and the magnetic levitation tool. The attractive force was found to peak when the levitated tool was displaced 6 mm from an initial position of 9 mm from the bulk, and it became only the self-weight of the magnetic levitation tool at displacements of 30 mm and above, where the pinning effect broke down. We then evaluated the polishing characteristics for SUS304 and A1100P at a tool displacement that results in the maximum attractive force. In the polishing experiment, we employed a water-based diamond slurry because the temperature of the workpiece was close to room temperature. We found that it was possible to polish SUS304 and A1100P while avoiding the effects of magnetization due to the polishing pressure or induced currents that accompany the rotation of the metal plate. The arithmetic average roughness, Ra, of A1100P was relatively high due to the effect of scratches, while that of SUS304 improved from 92 nm before polishing to 55 nm after polishing when polished with grains with a diameter of 1 μm.

DOI： 10.20965/IJAT.2021.P0234

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Investigation on the Abrasive Phenomenon of Colloidal SiO2 Particles and Water-soluble C60 Inclusion Complex Particles in the CMP Process of the 4H-SiC Substrate Wafer Reviewed International journal

Tsai Yueh-Hsun, Suzuki Keisuke, Chen Chao-Chang A., Khajornrnrungruang Panart

Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers ) 2021.10 ( 0 ) 094-114 2021.01

Language：English Publishing type：Research paper (international conference proceedings)

This study used a water-soluble inclusion complex, fullerene/β-cyclodextrins(C60/β-CDs), as additive abrasive with conventional SiO2 slurry for the chemical mechanical polishing/planarization(CMP) of the silicon carbide substrate wafer. The hydrodynamic size(dH) of C60/β-CDs suspension was measured by the dynamic light scattering(DLS) method; the appearance of a C60/β-CDs inclusion complex is observed by TEM. The C60/β-CDs hybrid SiO2-based slurry performed a higher removal rate than conventional SiO2 slurry, and the polished surface showed a lower depression and roughness, too.

DOI： 10.1299/jsmelem.2021.10.094-114

Brownian motion simulation of SiO2 abrasive nanoparticle on SiC substrate surface Reviewed International journal

SAENNA Soraya, KHAJORNRUNGRUANG Panart, BLATTLER Aran, PERMPATDECHAKUL Thitipat, SUZUKI Keisuke, BAKIER Mohammed A.

Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers ) 2021.10 ( 0 ) 178-171 2021.01

Language：English Publishing type：Research paper (scientific journal)

Chemical-Mechanical Polishing (CMP) process has emerged as the method of choice for planarization in the semiconductor industry. The interaction force between the surface being polished and the abrasive nanoparticles plays a significant role in flattening the substrate surface in the CMP process. For example, when the SiO2 nanoparticle is distant from the SiC substrate surface, the interaction force between the surface and the nanoparticles is presented. This force could be analysed using Derjaguin and Landau and Verwey and Overbeek (DLVO) theory and particle Brownian motion. According to the simulation results, we found that very fine abrasive nanoparticle such as smaller than approximately 10 nm is comparatively approach to the surface being polished more certainly.

DOI： 10.1299/jsmelem.2021.10.178-171

Brownian motion simulation of SiO<inf>2</inf> abrasive nanoparticle on SiC substrate surface Reviewed

Saenna S., Khajornrungruang P., Blattler A., Permpatdechakul T., Suzuki K., Bakier M.A.

10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021 353 - 357 2021.01

High-speed three-dimensional tracking of individual 100 nm polystyrene standard particles in multi-wavelength evanescent fields Reviewed

Blattler A., Khajornrungruang P., Suzuki K., Permpatdechakul T.

Measurement Science and Technology 31 ( 9 ) 2020.09

Evaluation of superconductor assisted machining (SUAM) with superconducting coated conductors using the finite element method Reviewed

Kinoshita Y., Zhang R., Otabe E.S., Suzuki K., Tanaka Y., Nakashima H., Nakasaki T.

Journal of Physics: Conference Series 1590 ( 1 ) 2020.07

Advanced chemical-mechanical planarization for 4H-SiC substrate by water-soluble inclusion complexes of fullerene Reviewed

Tsai Y.H., Chen C.C.A., Suzuki K., Khajornrungruang P., Chiu S.F., Hua C.T.

Japanese Journal of Applied Physics 59 ( SL ) 2020.07

Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, HAMADA Satomi, WADA Yuutaka, HIYAMA HIYAMA

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2020 ( 0 ) 17E02 2020.03

Language：Japanese Publishing type：Research paper (scientific journal)

Cleaning phenomena in semiconductor manufacturing is about the nano-contamination being repelled out from, or adhering to, the wafer surface. However, residual contamination on the wafer has been usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light generated by internal reflection. This article introduces some of observed physical phenomena during duplicated cleaning process in both contact cleaning by a PVA brush and non-contact cleaning by mega-sonic wave.

DOI： 10.1299/jsmekanto.2020.17e02

Other Link： https://www.jstage.jst.go.jp/article/jsmekanto/2020/0/2020_17E02/_pdf

Three-dimensional tracking and height verification of polystyrene particles with piezo actuator positioning by means of multi-wavelength evanescent fields Reviewed

Blattler A., Khajornrungruang P., Suzuki K., Permpatdechakul T.

Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020 53 - 56 2020.01

Study on novel nano fine particles reacted with fullerene for hard to process material Reviewed

Hisayoshi Fuya, Suzuki Keisuke, Tsai Yueh-Hsun, Khajornrungruang Panart, Yasunaga Takuo, Takazaki Hiroko, Ouchi Masayoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 486 - 487 2020.01

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:2nd report : Non-contact Removal of Abrasive Nano-particles during Enforcing Mega sonic Reviewed

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Permpatdechakul Thitipat, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 660 - 661 2020.01

ナノスケールにおける加工現象可視化に関する研究:第6報:単一ナノ粒子の三次元目変位の検証 Reviewed

ブラットラーアラン, カチョーンルンルアンパナート, 鈴木恵友, パームパッデーチャークンティティパット

精密工学会学術講演会講演論文集 2020 ( 0 ) 588 - 589 2020.01

作用表面上におけるナノスケール現象の化学的実時間観測に関する研究:第1報:ラマン分光光度計の開発 Reviewed

ドバンタン, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 2020 ( 0 ) 622 - 623 2020.01

局在光によるナノ研磨現象観測に関する研究:第1報:開発した小型装置による実験的評価 Reviewed

パームパッデーチャークンティティパット, カチョーンルンルアンパナート, 鈴木恵友, ブラットラーアラン, 寺山裕

精密工学会学術講演会講演論文集 2020 ( 0 ) 658 - 659 2020.01

Study on Relationship of the Material Removal Amount and the Increase in Abrasive Nanoparticle Size during Si-CMP Reviewed

Boripatkosol S., Bun-Athuek N., Khajornrungruang P., Suzuki K., Chanthawong N., Phaisalpanumas P.

ESIT 2018 - 3rd International Conference on Engineering Science and Innovative Technology, Proceedings 2019.03

Research on high speed polishing technology using electrode embedded type low refractive transparent pad

Kato Yuya, Ryunosuke Matsumoto, Suzuki Keisuke, Panart Khajornrungruang

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 2019.01

Language：Japanese Publishing type：Research paper (conference, symposium, etc.)

The manufacturing process of the transparent pad was developed by the thermal imprint method equipped with a special jig for controlling the thickness, pattern and electrode structure. Particle behavior is controlled by the electric field using a wire mesh inserted into a low index transparent polishing pad. As a result, the movement of hybrid particles of diamond particles and silica particles can be observed in an electric field using a digital microscope. Furthermore, in the polishing experiment, it was possible to obtain a higher amount of material removal in the presence of the electric field than in the absence of the electric field.

DOI： 10.1299/jsmemmt.2019.13.D39

Other Link： https://ci.nii.ac.jp/naid/130007836392

FDTD Simulation for Analysing Scattering Light Characteristic of Moving Nano-particle in Evanescent Field Reviewed

Khajornrungruang PANART, SUZUKI Keisuke, TAIRA Kanako, ARAMAKI Hirochika

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 2019.01

Language：Japanese Publishing type：Research paper (conference, symposium, etc.)

In surface fabrication process, such as the polishing in semiconductor substrate, there are many nano-particles moving on or nearby the surface to be polished. We have been establishing an optical method to observe and to track the 3-dimensional position of each dynamical moving nano-particle on time by applying an evanescent light field. In this report, the scattering light characteristic from a moving nano-particle in an evanescent field generated by internal reflection on a silica glass surface was analysed by FDTD (Finite Difference Time Domain) method on MATLAB. We discuss the scattering light from a particle moving perpendicularly to a surface in an interval time as one recorded frame in practical observation.

DOI： 10.1299/jsmemmt.2019.13.D18

Other Link： https://ci.nii.ac.jp/naid/130007836425

Study on processing method using superconductive assisted machining method

NAKASHIMA Hidetaka, NAKASAKI Tatsuya, TANAKA Yuki, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 2019.01

Language：Japanese Publishing type：Research paper (conference, symposium, etc.)

In recent years, superconductive assisted machining method (SUAM) using a magnetic levitation tool utilizing a superconducting phenomenon such as pinning effect has been developed to reduce tool interference on the conventinal procceing method. Measurement of the force by the magnetic levitation tool is evauated in the air to determind polishing conditions. In our study, polishing test were performed not only on aluminum plate but also stainless steel plate using fixed and loose abrasives. As a result, the superconductive assisted machining method was applicable to stainless steel material.

DOI： 10.1299/jsmemmt.2019.13.D38

Other Link： https://ci.nii.ac.jp/naid/130007836391

Characteristic Evaluation of Scattering Light from Cutting edge in Evanescent Field by Using Numerical Simulation Method Reviewed

Aramaki Hirochika, Khajornrungruang Panart, Suzuki Keisuke, Taira Kanako

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2019 ( 0 ) 904 - 905 2019.01

ナノスケールにおける加工現象可視化に関する研究:第5報:標準粒子の三次元挙動観測の試み

ブラッドラーアラン, カチョーンルンルアンパナート, 鈴木恵友, パームパッデーチャークンティティパッド

精密工学会学術講演会講演論文集 2019 ( 0 ) 459 - 460 2019.01

The Performance Evaluation of Developed Apparatus for Observing the Nanoparticles Phenomena During CMP Process by Applying Evanescent Field

Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Taira Kanako

日本機械学会九州支部講演論文集 2019 ( 0 ) 2019.01

Study on Organic Fibers in The Polishing Pad for Sapphire Chemical Mechanical Polishing

Chansatarpornkul Sansuwan, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 2019 ( 0 ) 18 - 19 2019.01

Real time nanoscale cleaning phenomenon observation during PVA brush scrubbing by evanescent field Reviewed

Terayama Y., Khajornrungruang P., Suzuki K., Kusatsu K., Hamada S., Wada Y., Hiyama H.

ECS Transactions 92 ( 2 ) 191 - 197 2019.01

Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire Reviewed

57 ( 7 ) 2018.07

Study on the Optimization of Hybrid fine particles on Chemical Mechanical Polishing of Hard to process materials:Chemical reactivity and Mechanical action

Suzuki Keisuke, Bun-Athuek Natthaphon, Takazaki Hiroko, Yasunaga Takuo, Yoshimoto Yutaka, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018 ( 0 ) 312 - 313 2018.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

We repot on the hybrid fine particles using core silica particles adsorbed on the ultra fine nano particles such as nano silica particles (ca.4nm diameter) and fullerenol for Chemical Mechanical Polishing of Hard to process materials. In our study, chemical reactivity and mechanical action from the hybrid particles were investigated using the several diameters of the core silica particles. At the case of adsorption of the nano silica particles and fullerenol, chemical reactivity become dominant parameter under the small size region although the nano particle is coated on the surface of the core silica particles. These results expect that both parameters as chemical reactivity and mechanical action can be control by the sizes of core particles and coating condition of the nano silica particles. We also optimize the structure of the hybrid silica particles at the case of the nano silica particles and/or fullerenol to meet the high performance CMP of hard to process materials and discuss about these results.

DOI： 10.11522/pscjspe.2018A.0_312

Other Link： https://ci.nii.ac.jp/naid/130007602798

Study on polishing method using magnetic levitation tool by superconducting

TANAKA Yuki, NAKASHIMA Hidetaka, HIRAMATU Yuta, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 62 ( 4 ) 219 - 220 2018.01

Language：Japanese Publishing type：Research paper (other academic)

Precision machining techniques have a number of serious problem, such as tool interference against complicated machining shapes and improvement of accuracy in processing. To resolve these issues, we suggest the Superconductive Assisted Machining (SUAM) method, which involves application of a magnetic levitation tool using the pinning effect of superconductivity during polishing processing. The SUAM method can eliminate tool interference because machining shape is determined by movement of the magnetic levitation tool during processing. Here, we measured the holding force, such as attractive and repulsive forces, from the pinning effect of superconductivity. The results indicated a maximum attractive force of 4 N with an initial magnetic levitation tool height of 9 mm. In this case, the holding force was dependent on the initial distance between the magnetic levitation tool and the superconductor bulk. In addition, we evaluated the dependence of polishing pressure and rotation frequency on polishing rate using fixed abrasive polishing pads. The results indicated that the polishing removal rates increase with increasing polishing pressure and rotation frequency.

DOI： 10.11420/jsat.62.219

Other Link： https://ci.nii.ac.jp/naid/130007492417

Study on fabrication method of low refractive transparent pad by thermal transfer Reviewed

Kato Yuya, Suzuki Keisuke, Khajornrungruang Panart, Yamaguchi Yuta, Tsai Yueh-Hsun

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2018 ( 0 ) 2018.01

Language：Japanese Publishing type：Research paper (other academic)

Fabrication process of the pad has been developed by imprint method with special zig to control of the thickness and patter and electrode structure. Movement of the fine particle is controlled by electrical field using copper wire electrode inserted in the low refractive index – transparency polishing pad. As results, we can be observe the movement of the diamond particle between the pattern structures under the pad by electrical field using digital microscope.

DOI： 10.1299/jsmemmt.2018.12.D06

Other Link： https://ci.nii.ac.jp/naid/130007637887

Observation of Nano-particle Adhesion and Desorption Phenomenon Near to Silicon Nitride and Oxide Film Surface in an Evanescent Field

TERAYAMA Yutaka, NAKANO Asato, Khajornrungruang Panart, SUZUKI Keisuke, WADA Yutaka, HAMADA Satomi

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2018 ( 0 ) 2018.01

Language：Japanese Publishing type：Research paper (other academic)

The study on adhesion and desorption mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. This report proposes an optical method to visualize only the nano-particles moving near to Si3N4 and SiO2 film surfaces by applying an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. Adhesion and desorption phenomena of the polystyrene latex standard particles (50±1 nm) and the SiO2 particles (55 nm) moving near to the Si3N4 and SiO2 film surfaces were observed by our developed experimental setup. Furthermore, desorption phenomenon of SiO2 particles (105 nm) with the flow occurred by polyvinyl alcohol (PVA) sponge brush sliding was also demonstrated.

DOI： 10.1299/jsmekanto.2018.24.OS0105

Other Link： https://ci.nii.ac.jp/naid/130007486587

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale-4th: Estimation of longitudinal Resolution Reviewed

Shirakawa Hiroaki, Blatter Aran, Takemoto Ryo, Khajornrungruang Panart, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018 ( 0 ) 129 - 130 2018.01

Study on non-contact micro tool tip nano-position detection by means of evanescent field penetration depth Reviewed

Khajornrungruang P., Suzuki K., Inoue T.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 18th International Conference and Exhibition, EUSPEN 2018 139 - 140 2018.01

Language：English Publishing type：Research paper (international conference proceedings)

© 2018 CURRAN-CONFERENCE. All rights reserved. This study proposes a non-contact measurement method for detecting a micro tool tip position at a nanometre precision in atmospheric environment as a non-contact tool setter. Particularly, to measure rotating small tools, optical measurement method are applied in non-contact tool setters. However, the generally used geometrical optical measurement methods do fundamentally not have nanometre precision due to the well-known light diffraction phenomenon, notably when measuring a micro tool. Furthermore, the non-contact tool setter for measuring a rotating micro tool has been indispensable because the position of a tool tip during rotation is different from the position of a static tool. The precision of tool position non-contact measurement is definitely required in nanometre scale due to the miniaturization of micro rotating tool size down to smaller than 50 μm. An evanescent light field is applied to detect a micro tool tip position in nanometre scale without contacting between a micro tool and a reference surface. In this paper, non-rotation micro tools with diameter of 50 μm were experimentally approached to and/or departed from a reference surface of a plano-convex lens by a nano-controlled piezo actuator to verify our proposed detection method. Consequently, the tool tips were recognised in the evanescent field during 300 nm range (or the evanescent field effective penetration depth) from the reference surface. It implies that the tool tip position could be detected more precisely than ±150 nm by only recognising the scattering light from the evanescent light field without tool contacting.

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85054532311&origin=inward

Study of Electroosmotic Micro-Flow Enhanced Abrasives Distribution in Nanoparticle Contained Slurry for Copper Chemical Mechanical Planarization

蔡岳勳, 鈴木恵友, 陳彰, Khajornrungruang Panart

精密工学会学術講演会講演論文集 2018 ( 0 ) 781 - 782 2018.01

Study on the nano combined fine particles in the CMP

SAKAI Koya, UEDA Tatsunori, YOSHIMOTO Hiroshi, SUZUKI Keisuke, BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUANG PANART

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2018 ( 0 ) 2018.01

Visualization of Slurry Flow between Polishing Pad and Wafer in CMP (4th Report):Difference due to pad conditioning conditions Reviewed

Fukuda Akira, Sekiduka Noriaki, Yamamoto Hiroki, Suzuki Keisuke, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018 ( 0 ) 295 - 296 2018.01

Evaluation of Magnetic Cutting and Polishing with Superconducting Bulks Reviewed

871 ( 1 ) 2017.07

In situ measurement method for film thickness using transparency resin sheet with low refractive index under wet condition on chemical mechanical polishing Reviewed

56 ( 7 ) 2017.07

Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire Reviewed

56 ( 7 ) 2017.07

Micro tool diameter monitoring by means of laser diffraction for on-machine measurement Reviewed

11 ( 5 ) 736 - 741 2017.01

Study on fullerenol as the additive to remove BTA film remaining on copper surface in chemical mechanical polishing process Reviewed

Tsai Y.H., Suzuki K., Chen C.C.A.

ICPT 2017 - International Conference on Planarization/CMP Technology 54 - 59 2017.01

Non-contact Micro Tool Tip Position Detection Method by Evanescent Light Field

Khajornrungruang PANART, INOUE Tomoki, SUZUKI Keisuke

The Proceedings of Mechanical Engineering Congress, Japan ( The Japan Society of Mechanical Engineers ) 2017 ( 0 ) S1330103 2017.01

Language：Japanese Publishing type：Research paper (scientific journal)

Non-contact tool setter for rotating micro tools has been needed because the position of tool tip during rotation is different from the position when the tool is not rotating. Furthermore, precision of tool position measurement is definitely required in nanoscale due to the miniaturization of micro rotating tool size down to smaller than 50μm. An evanescent light field is applied to detect a micro tool tip position in nanoscale without contacting between micro tool and detector. In this report, micro tools with diameter of φ 50μm were approached to and/or departed from a glass reference plane surface by a nano-controled piezo actuator to verify our detection method. Consequently, the tool tips were detected in the evanescent field during 300 nm range from the reference surface, implying that the tool tip can be detected in the precision of less than ±150 nm by only observing the scattering light from the evanescent light field without contacting.

DOI： 10.1299/jsmemecj.2017.s1330103

Other Link： https://www.jstage.jst.go.jp/article/jsmemecj/2017/0/2017_S1330103/_pdf

Study on processing technology using magnetic levitation tool by superconducting

Tanaka Yuki, Suzuki Keisuke, Khajornrungruang Panart, Otabe Soji, Nakashima Hidetaka

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2017A ( 0 ) 765 - 766 2017.01

Study on processing technology using magnetic levitation tool by superconducting

TANAKA Yuki, SUZUKI Keisuke, Khajornrungruang P

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2017.70 ( 0 ) 907 2017.01

ナノスケールにおける加工現象可視化に関する研究

白川裕晃, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2017A ( 0 ) 985 - 986 2017.01

Language：Japanese Publishing type：Research paper (scientific journal)

ナノスケールにおける加工現象として，ナノ粒子を用いたポリシング加工がある．本研究は，ポリシング加工のナノ粒子の挙動を観察し，ナノ粒子による加工現象を解明することを目的とする．そこで本研究では，表面上近傍に局在するエバネッセント光を用いた実時間観測を行っている．既知のナノ単粒子に多波長エバネッセント光を当て，その散乱光の強度を調べたので，ここに報告する．

DOI： 10.11522/pscjspe.2017a.0_985

Nanoparticle Application of Polyhydroxylated Fullerene (Fullerenol) on Post Cleaning Process of Copper Wafer

Tsai Yuehhsun, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2017S ( 0 ) 789 - 790 2017.01

Language：Japanese Publishing type：Research paper (scientific journal)

During copper chemical mechanical polishing (CMP) process, large amount of contamination residues on polished surface as removing of great number of copper. The common contaminations such as abrasives, metallic ion, and organic compound, that will discourage the metallic line of fabrication, even result in decline of efficiency. Benzotriazole(BTA) is known as passivation behavior that combined with metallic surface forming the protective layer from the serious corrosion, but it indicates a feature hard to be removed comprehensively in the general cleaning solution, for example water, ethanol, and acetone…etc. Polyhydroxylated fullerene, called fullerenol, as the outstanding nanoparticle is utilized in biomedicine, material science, and precision engineering fields according to its water-solubility, medicinal chemistry, and cage structure. This study aims to introduce the diluted fullerenol solution to remove the remained BTA film in post cleaning system. The 20mm in square of copper specimen is treated by 0.05M BTA solution for 2 min, and then dipped into diluted fullerenol solution for 2 min. Finally, it is measured by x-ray photoelectron spectroscopy (XPS), to observe the signal from 1s orbital of nitrogen. The results show the N1s peak (˜400eV) is decrease even disappears after treated by diluted fullerenol solution (0.01wt%, 0.05wt%, and 0.1wt%).

DOI： 10.11522/pscjspe.2017s.0_789

Light scattering model for individual sub-100-nm particle size determination in an evanescent field Reviewed

55 ( 6 ) 2016.05

Study on evaluation method for surface topography of polishing pad based on optical Fourier transform Reviewed

2016.02

Study on fine particles observation using Transparency micro-patterned pad during CMP

ONIKI Takahiro, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart

The Proceedings of Mechanical Engineering Congress, Japan ( The Japan Society of Mechanical Engineers ) 2016 ( 0 ) S1330203 2016.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (scientific journal)

Transparency micro-patterned pad is used to observe fine particles by an epi-illumination microscope. The material of transparency micro-patterned pad is resin which has almost same as the refractive index of water. Therefore, it has characteristic that the micro pattern could disappear in the observation image by filling water. Epi-illumination microscope has illumination system and the detection system on the same side. In this study, we succeeded to observe the diamond particles with a diameter of 1μm on the glass substrate at 1000 frame/s in dark-field illumination. This results show that the fine particles could be observed simplicity, and also suggest the possibility that the fine particles observation on opaque substrate using the epi-illumination microscope.

DOI： 10.1299/jsmemecj.2016.s1330203

Other Link： https://www.jstage.jst.go.jp/article/jsmemecj/2016/0/2016_S1330203/_pdf

超伝導バルクを利用した磁気浮上工具による中空加工技術に関する研究

日高裕, 上原和晃, カチョーンルンルアンパナート, 小田部荘司, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2016S ( 0 ) 971 - 972 2016.01

Language：Japanese Publishing type：Research paper (scientific journal)

本研究では超電導現象である磁気浮上を利用し、金型や3Dプリンタなどの中空部品成形技術が抱える問題を解消する新規中空加工技術の確立を目指している。その概要としては、磁気浮上を利用して磁性体や超伝導体を一定間隔離して浮上させトラップし、さらに回転運動を加え回転工具とすることで被加工物を切削する技術である。本報では樹脂などを用いて本加工技術の原理検証を行ったので、その内容について報告する。

DOI： 10.11522/pscjspe.2016s.0_971

ポリシング前後におけるスラリー中の研磨微粒子径に関する研究

永井利幸, 八尋新, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2016S ( 0 ) 371 - 372 2016.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (scientific journal)

CMPでは，複数の加工材料に対して最適なスラリーやポリシングパッドを適用させる必要がある．これらの部材を最適化するためには，材料除去メカニズムに基づき，スラリー中微粒子の種類や微粒子径，材質，薬液を選定することが重要である．そこで本研究では，サファイア，SiO2などの複数の基板に対して動的光散乱法（DLS）を用いて微粒子径の変化について評価したので報告する．

DOI： 10.11522/pscjspe.2016s.0_371

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale:the apparatus development

Khajornrungruang Panart, Shirakawa Hiroaki, Suzuki Keisuke, Sakai Koya

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2016S ( 0 ) 5 - 6 2016.01

I-11 Optimization of mixed colloidal silica and fullerenol slurry in Chemical Mechanical Polishing of Sapphire Reviewed

BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUAN PANART, MURAKAWA WATARU, SATOU TOKIHITO, SUZUKI KEISUKE

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2016.69 ( 0 ) 361 - 362 2016.01

Language：English Publishing type：Research paper (other academic)

This research studies the method to optimization of polishing slurry which colloidal silica based (SiO_2 slurry) containing C_<60>(OH)_n n=ca.10 for Chemical Mechanical Polishing (CMP) process by concentration dependence on the C_<60>(OH)_n solute between 0-0.05 wt% and varying size of abrasive particle in colloidal silica slurry between 20-55 nm. We focussed on relationship between the effect of abrasive particle size and polishing performance such as Material Removl Rate (MRR) and surface roughness of sapphire substartes. This paper consists of two parts, the first section in order of slurry preparation and polishing condition setting up for CMP process. The last section are the MRR value calculating and abrasive particle diameter size before and after CMP process measuring for optimization of mixed colloidal silica and fullerenol slurry in CMP of sapphire. These results indicate that diameter of the fine particle composed by colloidal silica slurry and C_<60>(OH)_n is a dominant parametrs to determid the MRR values against the apphire CMP.

DOI： 10.1299/jsmekyushu.2016.69.361

Other Link： https://www.jstage.jst.go.jp/article/jsmekyushu/2016.69/0/2016.69_361/_pdf

Study on evaluation method for polishing pad surface topography based on optical fourier transform Reviewed

205 - 208 2015.01

Study on polishing methods for the hard-to-work material using unconventional nano carbon particle

Murakawa Wataru, Suzuki Keisuke, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2014 ( 0 ) 19 - 20 2014.01

Language：Japanese Publishing type：Research paper (other academic)

Improvement of polishing performance against the hard-to-work material is required to realize high throughput manufacturing process of the wafers. Recently, Doi has reported new polishing technology of the high efficiency polishing methods of the materials assisted by plasma. In this method, it is difficult to use conventional polishing device because of microwave resistance. We develop new nano carbon particle formed by UV laser irradiation against fullerenol and diamond particles for the polishing method and will report our experimental results.

DOI： 10.11522/pscjspe.2014A.0_19

Other Link： https://ci.nii.ac.jp/naid/130005479359

Study on material removal mechanism for SiO2-CMP:Development of quantitative evaluation method on the adhesion behavior

Takano Yuichi, Fukuda Kosuke, Khajornrungruang Panart, Kimura Keiichi, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2014 ( 0 ) 279 - 280 2014.01

C31 Study on the functional fine particles with the fullerenol molecules for sapphire CMP

Murakawa Wataru, Oisi Takahumi, Khajornrungruang Panart, Suzuki Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2014 ( 0 ) 177 - 178 2014.01

Language：English Publishing type：Research paper (other academic)

Material Removal Rate of sapphire CMP using silica slurry with the fullerenol increase as the higher concentration of the fullerenol in the slurry. The surface roughness of the sapphire substrate gives the influence against the MRR of sapphire CMP. Raman spectra indicate that molecule structure did not change during CMP process. The structure of fine particle by silica particle and fullerenol in the liquid characterize using DLS method. As results, two layers fullerenol molecules are adsorbed on the silica particle. And we discuss on the fine particle with the fullerenol based on our results.

DOI： 10.1299/jsmemmt.2014.10.177

Other Link： https://ci.nii.ac.jp/naid/110009939353

C30 Study on the material removal mechanism during chemical mechanical polishing Reviewed

Nagai Toshiyuki, Yahiro Shin, KHAJORNRUNGRUANG Panart, Suzuki Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2014 ( 0 ) 175 - 176 2014.01

Language：English Publishing type：Research paper (scientific journal)

The material removal mechanisms on the SiO_2-CMP have been studied to develop new slurries and polishing pads for the advanced ULSI devices. We focus on the chemical reacted layer at the surface of SiO_2 film because formation of the layer is effected by pH of the slurry. Relationship between the MRR (Material removal rate) and chemical reacted layer was suggested by the results of the CMP tests and SEM observations at various pH conditions from 7.5 to 12.5. The size of the SiO_2 fine particles increase as the higher pH reason because the surface of the SiO_2 fine particles might be changed during the CMP. In our report, we discuss the material removal mechanism based on the experimental result of the SEM observation on the SiO_2 fine particles.

DOI： 10.1299/jsmemmt.2014.10.175