Updated on 2024/06/28

写真a

 
KHAJORNRUNGRUANG Panart
 
Scopus Paper Info  
Total Paper Count: 0  Total Citation Count: 0  h-index: 7

Citation count denotes the number of citations in papers published for a particular year.

Affiliation
Faculty of Computer Science and Systems Engineering Department of Intelligent and Control Systems
Job
Associate Professor
Laboratory
680-4 Kawazu, Iizuka-shi, Fukuoka
Fax
+81-948-29-7900
External link

Research Interests

  • Visualization in Nanoscale

  • Optical Applied Measurement

  • Chemical Mechanical Polishing

Research Areas

  • Nanotechnology/Materials / Nano/micro-systems

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Manufacturing and production engineering

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Measurement engineering

  • Nanotechnology/Materials / Optical engineering and photon science

Undergraduate Education

  • 2000.03   Osaka University   Faculty of Engineering   Department of Mechanical Engineering   Graduated   Japan

Post Graduate Education

  • 2002.03   Osaka University   Graduate School, Division of Engineering   Master's Course   Completed   Japan

Degree

  • Osaka University  -  Doctor of Engineering   2005.03

Biography in Kyutech

  • 2019.04
     

    Kyushu Institute of Technology   Faculty of Computer Science and Systems Engineering   Department of Intelligent and Control Systems   Associate Professor  

  • 2016.09
    -
    2019.03
     

    Kyushu Institute of Technology   Faculty of Computer Science and Systems Engineering   Department of Mechanical Information Science and Technology   Associate Professor  

  • 2014.11
    -
    2016.08
     

    Kyushu Institute of Technology   Faculty of Computer Science and Systems Engineering   Department of Mechanical Information Science and Technology   Assistant Professor  

  • 2007.04
    -
    2014.10
     

    Kyushu Institute of Technology   Advanced Mold and Die Technology Center   Assistant Professor  

  • 2006.04
    -
    2007.03
     

    Kyushu Institute of Technology   Advanced Mold and Die Technology Center   Research Assistant  

  • 2005.04
    -
    2006.03
     

    Kyushu Institute of Technology   The Strategy Office   Research Assistant  

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Biography before Kyutech

  • 2013.03 - 2014.03   Clarkson Univerisity (USA)   the Center for Advanced Materials Processing (CAMP)   Specially Appointed Associate Professor   United States

Academic Society Memberships

  • 2014.04 - 2020.03   The Optical Society of Japan   Japan

  • 2012.03 - 2020.07   euspen   United Kingdom

  • 2011.04   Affiliate, JSPE   Japan

  • 2009.04   砥粒加工学会   Japan

  • 2008.09   Planarization and CMP Technical Committee, JSPE   Japan

  • 2008.04   Intelligent Nano-Measure, JSPE   Japan

  • 2006.04   日本機械学会   Japan

  • 2005.04   精密工学会   Japan

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Research Career

  • 3D Dynamical Nano-Particle Direct Observatory in Nano-scale Interfacial

    Evanescent Field, Nano-Particle, Interfacial, Visualization, Optics, Laser, Dynamic

    研究期間: 2008.04  - 

  • Study on Edge Tip Nano-position Measurement by Optical Evanescent Field

    研究期間: 2015.10  - 

  • On-Machine sub-micrometer Measurement of Micro Cutting Tool using Laser Diffraction

    Measurement, Machining, Diffraction, On-Machine, Tool, Applied Optics

    研究期間: 2005.10  -  2017.03

  • Chemical Mechanical Polishing

    Semiconductor, Polishing, Nano-Particle

    研究期間: 2005.04  - 

Papers

  • Observation of the formation of anisotropic silver microstructures by evanescent wave and electron microscopy Reviewed

    Angshuman Pal, Panart Khajornrungruang, Christopher Netzband, Sriveda Alety, S. V. Babu

    Nanotechnology   27 ( 7 )   075708 (1) - 075708 (10)   2016.02

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    Language:English   Publishing type:Research paper (scientific journal)

    DOI: 10.1088/0957-4484/27/7/075708

    Kyutacar

    Scopus

    Other Link: http://iopscience.iop.org/0957-4484

  • Real time imaging of the growth of silver ribbons by evanescent wave microscopy Reviewed

    Angshuman Pal, Panart Khajornrungruang, S. V. Babu

    RSC Advances   5   71830 - 71834   2015.08

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    Language:English   Publishing type:Research paper (scientific journal)

    DOI: 10.1039/c5ra13979a

    Scopus

  • Light scattering model for individual sub-100-nm particle size determination in an evanescent field Invited Reviewed International journal

    Khajornrungruang P., Korkmaz S., Angshuman P., Suzuki K., Kimura K., Babu S.V.

    Japanese Journal of Applied Physics   55 ( 6S3 )   06JG02-1 - 06JG02-2   2016.06

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    Authorship:Lead author, Corresponding author   Language:English   Publishing type:Research paper (scientific journal)

    DOI: 10.7567/JJAP.55.06JG02

    Scopus

    CiNii Article

    Other Link: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85065706261&origin=inward

  • Spatial Fourier Transform Analysis of Polishing Pad Surface Topography Reviewed

    Panart Khajornrungruang, Keiichi Kimura, Takahisa Okuzono, Keisuke Suzuki, and Takashi Kushida

    Japanese Journal of Applied Physics   51 ( 5 )   2012.05

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (scientific journal)

    DOI: 10.1143/JJAP.51.05EF04

    Scopus

    CiNii Article

    Other Link: http://iopscience.iop.org/1347-4065/

  • Direct observation of removal of SiO2 nano-particles from silica surfaces: an evanescent field microscopy study and shear flow acting moment Reviewed International journal

    Japanese Journal of Applied Physics   62   2023.07

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (scientific journal)

    DOI: 10.35848/1347-4065/acde87

    DOI: 10.35848/1347-4065/acde87

  • Observation of Moving Nano-Particles in the Vicinity of a Substrate Wall Using Near Field Light (Evanescent Field) Invited Reviewed

    KHAJORNRUNGRUANG Panart

    Journal of the Japan Society for Precision Engineering ( The Japan Society for Precision Engineering )   90 ( 2 )   184 - 188   2024.02

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    Authorship:Lead author, Last author, Corresponding author   Language:Japanese   Publishing type:Research paper (scientific journal)

    DOI: 10.2493/jjspe.90.184

    CiNii Research

    Other Link: https://www.jstage.jst.go.jp/article/jjspe/90/2/90_184/_pdf

  • Study on a Novel Peeling of Nano-Particle (PNP) Process for Localized Material Removal on a 4H-SiC Surface by Controllable Magnetic Field Invited Reviewed International journal

    Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Kutomi Shotaro

    International Journal of Automation Technology ( Fuji Technology Press Ltd. )   17 ( 4 )   410 - 421   2023.07

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    Language:English   Publishing type:Research paper (scientific journal)

    <p>This study proposes a novel process called peeling of nano-particle (PNP) to remove material locally on a hard material surface, such as silicon carbide (SiC), diamond, and gallium nitride (GaN), using the magnetic nano-particles in an aqueous solution controlled by magnetic fields. By the concept of the PNP process, magnetic fields are generated by two solenoid coils, which are sandwiched between the hard material sample, to pull the magnetic nano-particles to adhere to and then peel the material from the sample surface. In this experiment, iron (II, III) oxide (Fe<sub>3</sub>O<sub>4</sub>) particles with a diameter size in the range of 50–100 nm were dispersed in water, and the pH value was adjusted to 10 by potassium hydroxide (KOH). The particles were magnetically controlled on the silicon carbide (4H-SiC) surface by the magnetic fields at approximately 17 mT. To confirm the contact phenomenon of the Fe<sub>3</sub>O<sub>4</sub> particles on the 4H-SiC surface during the PNP process, an optical system was developed by applying evanescent field microscopy to limit the observation range to approximately 300 nm from the 4H-SiC surface. According to the experimental observed results, the control phenomenon of two examples of Fe<sub>3</sub>O<sub>4</sub> particles could be observed through their scattering light, which relates to the magnetic field generating sequence wherein the particles were magnetically pulled in and out of the 4H-SiC surface in the limit range of the evanescent field. During the particle pull to the surface, particles were able to be tracked in the <i>X</i>–<i>Y</i> directions during the approach to the 4H-SiC surface. The Brownian motion ranges in all directions of the particles decreased when the particles approached close to the surface due to the pulling magnetic field. Moreover, the magnetic field enforced the magnetic moment of the particle and limited their rotation.</p>

    DOI: 10.20965/ijat.2023.p0410

    CiNii Research

  • Study on action forces on nano-particle to flat surface using localized remote magnetic field

    Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Goto Daiki

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2023S ( 0 )   384 - 385   2023.03

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (other academic)

    <p>By peeling of nano-particle (PNP) process, the magnetic nano-particles in an aqueous solution are employed to be locally magnetically controlled for adhering to a substrate surface and removing the material. In order to remove the material on the surface, the touching phenomenon of particle on surface needs to be confirmed. In this study, the touching phenomenon of nano-particle on the substrate surface was experimentally observed in situ the PNP process by our developed optical system applying multi-wavelength evanescent fields. The action forces, such as DLVO force and magnetic force, on the particle were measured by the height Z of the particle from the substrate surface. Fe<sub>3</sub>O<sub>4</sub> particles with the sized range 50-100nm dispersed in the KOH solution (pH value of 10) were employed to be magnetically pulled to approach a silica glass surface by the controllable magnetic field generated by a solenoid coil. During the magnetic field generating, the height Z of nano-particle were measured at the closest approximately 10 nm, in which the DLVO force at measured height Z approximately 0.5-0.9 pN by calculation. To pull the particle touch on the glass surface, the pulling magnetic force on the particle size in range 50-100 nm should be higher than 1 pN approximately.</p>

    DOI: 10.11522/pscjspe.2023s.0_384

    CiNii Research

  • Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

    Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2022S ( 0 )   126 - 126   2022.03

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2022s.0_126

    CiNii Research

  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale:the apparatus development

    Khajornrungruang Panart, Shirakawa Hiroaki, Suzuki Keisuke, Sakai Koya

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2016S ( 0 )   5 - 6   2016.01

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    Authorship:Lead author, Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    This report proposes a new method to three-dimensionally track each single nano-particle that has been interacting with a surface in nanoscale processing phenomena by using dual wavelength of evanescent field.

    DOI: 10.11522/pscjspe.2016s.0_5

    CiNii Article

    CiNii Research

  • Experimental In-Situ Observatory on Brownian Motion Behavior of 105 nm Sized Silica Particles During Chemical Mechanical Polishing of 4H-SiC by an Evanescent Field Reviewed International journal

    Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Inthiam Jiraphan

    International Journal of Automation Technology ( Fuji Technology Press Ltd. )   18 ( 1 )   47 - 57   2024.01

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (scientific journal)

    <p>The experimentally observing optical systems for on-machine measurement have been developed to study on nano-polishing phenomena during the chemical mechanical polishing process, which is a wet process in semiconductor manufacturing. The developed optical system employs an evanescent field to selectively enhance exclusively the observatory of phenomena occurring on the surface being polished, offering a lateral resolving power of approximately 400 nm, in the slurry concentration of up to 5 wt% based on the numerical aperture of the objective lens. In addition, there is also the observability of 105 nm and down to 55 nm-sized silica particles without requiring additive fluorescence agents in or around the nano-particles, even when these particles are moving on surfaces such as silica glass or hard materials (silicon carbide: 4H-SiC). Consequently, the motion behavior of nano-particles disjoining with polishing pad asperity was explored and discussed, in this paper. Experimental results revealed that the polishing pad spatially constrains the movement of particles between the pad and the substrate surface, guiding them toward the surface being polished. During pad sliding, fluidically dragged nano-particles exhibit slower movement than the polishing pad sliding speed while retaining the Brownian motion. Furthermore, 105 nm-sized silica particles did not continuously approach to attach onto the SiC surface; the nano-particles approached in steps with reduced Brownian motion in all directions before attaching. This behavior can be attributed to the effects of van der Waals attraction and electrostatic repulsion forces between the particle and the substrate surfaces.</p>

    DOI: 10.20965/ijat.2024.p0047

    CiNii Research

    Other Link: https://ndlsearch.ndl.go.jp/books/R000000004-I033252388

  • フラーレン構造体を用いた新規研磨微粒子に関する研究

    轟木 裕太, 森井 将希, 判谷 太輔, 鈴木 恵友, 西澤 秀明, Khajornrungruang Panart, 井浦 寛陽

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2023S ( 0 )   788 - 789   2023.03

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    Language:Japanese   Publishing type:Research paper (other academic)

    <p>SiC研磨における新規研磨微粒子の開発を行った。ナノシリカ微粒子上に水酸化フラーレンを吸着させた水酸化フラーレンハイブリッド型高速研磨技術について提案する。ここでは紫外線イオンによるポリマー化の影響についても検討している。</p>

    DOI: 10.11522/pscjspe.2023s.0_788

    CiNii Research

  • ダイヤフラムを用いた音波援用加工法に関する研究

    山本 颯真, 西澤 秀明, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2023S ( 0 )   794 - 795   2023.03

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    Language:Japanese   Publishing type:Research paper (other academic)

    <p>本研究では、加振器による音波を用いてダイヤフラムとダイヤフラム上の研磨砥粒を振動させることにより、被加工物表面にダイヤフラム上の微細パターンを転写する新規音波加工技術を提案する。現在までに転写性を確認するため、絹パッドを貼付したダイヤフラムを加振させることで、Cuウェーハに絹パッドのパターンが転写することを確認した.</p>

    DOI: 10.11522/pscjspe.2023s.0_794

    CiNii Research

  • Observation of fluid field near surface region using Schlieren visualization in evanescent field

    Ohta Yuki, Permpatdechakul Thitipat, Goto Daiki, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2023S ( 0 )   400 - 401   2023.03

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2023s.0_400

    CiNii Research

  • Identification of Nano-bubbles from Nano-particles in Fluid Field by Optical Observation

    Fujishima Hibiki, Kutomi Shotaro, Goto Daiki, Terayama Yutaka, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2023S ( 0 )   422 - 423   2023.03

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2023s.0_422

    CiNii Research

  • Study on Measurement of Sub-100 nm Particles on Micro-Porous Surfaces by Optical Interferometry

    Kutomi Shotaro, Khajornrungruang Panart, Goto Daiki, Ohta Yuki

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2023S ( 0 )   424 - 425   2023.03

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2023s.0_424

    CiNii Research

  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale

    Goto Daiki, Khajornrungruang Panart, Blattler Aran, Permpatdechakul Thitipat, Ohta Yuki

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2023S ( 0 )   374 - 375   2023.03

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2023s.0_374

    CiNii Research

  • Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

    Arima Yu, Fujishima Hibiki, Terayama Yutaka, Khajornrungruang Panart, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2023S ( 0 )   786 - 787   2023.03

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    <p>Preventing the reattachment of nano-particles on the substrate surface is indispensable in the wafer cleaning process. In this paper, transportability of different sized nano-particles were observed, in the shear flow occurring near the surface region that duplicated cleaning process in lab-scale, by using the evanescent field. Sub-100 nm particles affected less flow effect and smaller inertia were less likely to be transported. In case of low speeds of inertial flow, most sub-100 nm particles still remain near the surface.</p>

    DOI: 10.11522/pscjspe.2023s.0_786

    CiNii Research

  • Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

    TERAYAMA Yutaka, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke, FUJISHIMA Hibiki, HAMADA Satomi, WADA Yutaka, HIYAMA Hirokuni

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2023.29 ( 0 )   17D08   2023.01

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    <p>We report the instantaneous physical evidence of detachment of residual φ80 nm Au particle due to the cavitation effect approaching during enforcing 1.1 MHz waves, which was clarified by using both of evanescent light field and dark field with duplicated the non-contact cleaning process of the surface to be cleaned.</p>

    DOI: 10.1299/jsmekanto.2023.29.17d08

    CiNii Research

  • Highly accurate flow rate measuring device for intravenous drip

    Meguro Akira, Uchimura Mamoru, Panart Khajornrungruang, Ito Takahiro, Murakami Sunao

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2022A ( 0 )   61 - 62   2022.08

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    Language:Japanese   Publishing type:Research paper (other academic)

    <p>Flow rate control is essential for safety and time management in intravenous drip therapy. The main control method is to adjust the drop velocity. However, due to the influence of surfactants contained in some drugs, a drop may fall below the specified volume, and therefore, much effort and expense are required to improve the accuracy.In this paper, we report on the use of light to measure the volume of a droplet, and the successful miniaturization of a device and highly accurate flow rate measurement by devising an optical path. It is expected to contribute to the improvement of the performance of drip infusion systems.</p>

    DOI: 10.11522/pscjspe.2022a.0_61

    CiNii Research

  • Real Time Nanoscale Cleaning Phenomenon Observation During Enforcing MHz Wave By Evanescent Field Reviewed International journal

    Terayama Y., Khajornrungruang P., Suzuki K., Mori R., Hamada S., Wada Y., Hiyama H.

    ECS Transactions   108 ( 4 )   17 - 23   2022.01

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (international conference proceedings)

    DOI: 10.1149/10804.0017ecst

    Scopus

    Other Link: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85132389297&origin=inward

  • Proposal of a novel peeling of nano-particle (PNP) process for localized material removal on a hard material surface by controllable magnetic fields Reviewed

    Permpatdechakul T., Khajornrungruang P., Suzuki K., Kutomi S.

    European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022   279 - 280   2022.01

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (international conference proceedings)

    Scopus

    Other Link: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85145554749&origin=inward

  • Absolute longitudinal distance measurement verification of a standard polystyrene nanoparticle near a surface in water by means of multi-wavelength evanescent field Reviewed

    Blattler A., Khajornrungruang P., Suzuki K., Baba A., Goto D.

    European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022   385 - 388   2022.01

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (international conference proceedings)

    Scopus

    Other Link: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85145608142&origin=inward

  • Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

    KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, UTSUMI Haruki, HAMADA Satomi, WADA Yuutaka, HIYAMA Hirokuni

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2022.28 ( 0 )   15H06   2022.01

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    Authorship:Lead author, Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    <p>Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, the residual nanoparticles from polishing slurry on the wafer are usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been studying these phenomena by visualizing the nanoparticle motion on a surface in nanoscale wet cleaning process that are duplicated in lab-scale. This report focuses on the flow velocity distribution occurring on a surface that was obtained by duplicating the water flow in a micro fluid cell on a silica glass surface. We found that the flow, which is nearer than few micrometers from the surface being cleaned, has less shear flow velocity. Therefore, there should be some external force or energy, such as PVA brush or cavitation from ultrasonic, to remove residue particles in cleaning process.</p>

    DOI: 10.1299/jsmekanto.2022.28.15h06

    CiNii Research

  • A novel method for 3d nanoscale tracking of 100 nm polystyrene particles in multi-wavelength evanescent fields microscopy – absolute difference height verification – Invited Reviewed

    Blattler A., Khajornrungruang P., Suzuki K., Saenna S.

    International Journal of Automation Technology   15 ( 6 )   831 - 841   2021.11

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    Language:English   Publishing type:Research paper (scientific journal)

    DOI: 10.20965/ijat.2021.p0831

    Scopus

    CiNii Article

    Other Link: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85118859497&origin=inward

  • Computational analysis of nano abrasive motion on SiC surface

    Saenna Soraya, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Permpatdechakul Thitipat

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2021A ( 0 )   126 - 127   2021.09

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (other academic)

    <p>The motion of nano-silica abrasive particle before attaching to the SiC surface being polished was analyzed numerically based on Brownian motion with DLVO theory, and then was compared with the results observed by evanescent light field localized on the SiC surface. We found that, when approximately 100 nm-sized silica particles are moving in close proximity within 100 nm from the SiC substrate surface, the nanoparticles would stay intermittently with slightly oscillating behavior before attaching to the surface.</p>

    DOI: 10.11522/pscjspe.2021a.0_126

    CiNii Research

  • Compact and highly accurate flow rate measuring device for intravenous drip

    Uchimura Mamoru, Khajornrungruang Panart, Ito Takahiro, Murakami Sunao

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2021A ( 0 )   383 - 384   2021.09

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2021a.0_383

    CiNii Research

  • Study on Nanoscale Observatory in Polishing Phenomena applying Optical Evanescent Field

    Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Baba Akiyoshi

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2021A ( 0 )   102 - 103   2021.09

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (other academic)

    <p>The nanoscale polishing phenomena between substrate surface, 105 nm-sized SiO<sub>2</sub> particles slurry, and polishing pad during CMP process were experimentally observed and evaluated to identify the main factors which effectively polish a 4H-SiC substrate. The nanoscale polishing phenomena were observed in-situ by our developed compact apparatus applied an optical evanescent field. The observation is able to detect the scattering light from either the nano-abrasive particles or the pad asperities when they react to the surface to being polishing. The nanoparticle motion phenomena, which two conditions (i)only nanoparticles (without pad) and (ii)nanoparticles with pad sliding, on 4H-SiC substrate were observed. According to the observed results, the observed scattering light of nanoparticle on 4H-SiC was the ellipse shape compared with the observing on SiO<sub>2</sub> substrate. Furthermore, we could observe the particles moved nearer and then adhered on the surface. Less particle’s Brownian motion when the particle moved nearer to the surface. In case of nanoparticle with pad sliding, we could observe only the scattering light of pad sliding because the scattering light intensity of particle is quite lower than pad. Therefore, approached nanoparticle to 4H-SiC surface phenomena might be one possible role to explain higher polishing rate CMP parameter.</p>

    DOI: 10.11522/pscjspe.2021a.0_102

    CiNii Research

  • Study on the observation of the behavior of nano fine particles using transparency resin sheet with low refractive index

    Matsumoto Ryunosuke, Suzuki Keisuke, Hirota Ren, Kijoronrunrunog Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2021A ( 0 )   110 - 111   2021.09

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    Authorship:Last author   Language:Japanese   Publishing type:Research paper (other academic)

    <p>In this study, the behavior of polishing particles was observed to clarify the material removal mechanism in CMP. A transparent pad with a low refractive index was fabricated by thermal imprinting using a transparent resin with the same refractive index as that of the slurry. In addition, we observed the behavior of the abrasive particles during polishing and discussed the relationship between the behavior of the abrasive particles and the step relaxation during polishing.</p>

    DOI: 10.11522/pscjspe.2021a.0_110

    CiNii Research

  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale

    Blattler Aran, Khajornrungruang Panart, Suzuki Keisuke, Baba Akiyoshi

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2021A ( 0 )   588 - 589   2021.09

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    <p>An abrasive nanoparticle behavior in chemical mechanical polishing (CMP) process is a three-dimensional (3D) motion near a substrate or reference surface. The height position is a longitudinal distance between the reference surface and nanoparticle, which is a challenge for measuring the height position in a wet condition. Our previous report could estimate the relative height of polystyrene 100 nm particles by applying multi-wavelength evanescent fields, but the absolute height was not confirmed yet. Therefore, in this report, we proposed a design concept for absolute height verification by using the developed nano-step height patterns. The nano-step height was approximately less than hundred nanometers from the reference surface. The nano-step height made from an optical resin that has a refractive index close to water to decrease the scattering light during observing nanoparticles in water. Polystyrene 100 nm particles on the nano-step height were used to estimate the absolute height of nanoparticle. The proposed concept could be used to verify the nanoparticle's absolute height in water, which can be applied to clarify the nanoparticle phenomena during the CMP process in the near future.</p>

    DOI: 10.11522/pscjspe.2021a.0_588

    CiNii Research

  • Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

    Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2021A ( 0 )   113 - 114   2021.09

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    DOI: 10.11522/pscjspe.2021a.0_113

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  • 3D trajectories and diffusion of single ceria particles near a glass surface and their removal Reviewed

    Seo J., Gowda A., Khajornrungruang P., Hamada S., Babu S.V.

    Journal of Materials Research   36 ( 1 )   258 - 267   2021.01

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    DOI: 10.1557/s43578-020-00067-4

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  • 近接場光を応用した工具刃先計測の数値シミュレーションによる散乱光特性の評価:第2報 : 工具材への金属モデルの適用

    甲斐 雅貴, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2021 ( 0 )   635 - 636   2021.01

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    <p>本稿では、近接場光を応用した工具刃先計測手法の確立のための援用シミュレーションの高精度化を目的とし、Drude-Lorentzモデルの導入を試みた.これにより従来のDrudeモデルのみを用いたものと比較し,波長により変化する反射率を考慮した解析が可能となった.また,更なる改善のために解析時のセルサイズによる影響を調査した.最後に工具刃先計測の散乱光シミュレーションを行い,得られた光散乱光特性を報告する.</p>

    DOI: 10.11522/pscjspe.2021S.0_635

    CiNii Article

    CiNii Research

    Other Link: https://ci.nii.ac.jp/naid/130008084162

  • Study on the SUAM Double Magnet System for Polishing Reviewed

    Nakasaki Tatsuya, Kinoshita Yushi, Khajornrungruang Panart, Otabe Edmund Soji, Suzuki Keisuke

    International Journal of Automation Technology   15 ( 4 )   503 - 511   2021.01

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    DOI: 10.20965/ijat.2021.p0503

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  • Study on polishing method using magnetic levitation tool in superconductive-assisted machining Invited Reviewed

    Nakashima H., Nakasaki T., Tanaka T., Kinoshita Y., Tanaka Y., Khajornrungruang P., Otabe E.S., Suzuki K.

    International Journal of Automation Technology   15 ( 2 )   234 - 242   2021.01

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    DOI: 10.20965/IJAT.2021.P0234

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  • Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field:(Particle Removal and Re-adhesion Characteristics on Scrubbing)

    KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, UTSUMI Haruki, HAMADA Satomi, WADA Yutaka, HIYAMA Hirokuni

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2021 ( 0 )   10A02   2021.01

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    <p>Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, these residual nanoparticles from polishing slurry on the wafer are usually inspected before-and-after cleaning process, not during the wet cleaning process. Accordingly, these cleaning phenomena mechanism on the surface have already not clearly known. Therefore, we have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light that is generated by an optically internal reflection. This report introduces some of observed physical characteristical phenomena during duplicated scrub cleaning process of 10 and 30 nm gold particles by PVA brushes without and with skin layer, which have different contact area ratio on the surface being cleaned.</p>

    DOI: 10.1299/jsmekanto.2021.27.10A02

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    Other Link: https://ci.nii.ac.jp/naid/130008091970

  • Brownian motion simulation of SiO<sub>2</sub> abrasive nanoparticle on SiC substrate surface Reviewed

    SAENNA Soraya, KHAJORNRUNGRUANG Panart, BLATTLER Aran, PERMPATDECHAKUL Thitipat, SUZUKI Keisuke, BAKIER Mohammed A.

    Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers )   2021.10 ( 0 )   178-171   2021.01

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    <p>Chemical-Mechanical Polishing (CMP) process has emerged as the method of choice for planarization in the semiconductor industry. The interaction force between the surface being polished and the abrasive nanoparticles plays a significant role in flattening the substrate surface in the CMP process. For example, when the SiO<sub>2</sub> nanoparticle is distant from the SiC substrate surface, the interaction force between the surface and the nanoparticles is presented. This force could be analysed using Derjaguin and Landau and Verwey and Overbeek (DLVO) theory and particle Brownian motion. According to the simulation results, we found that very fine abrasive nanoparticle such as smaller than approximately 10 nm is comparatively approach to the surface being polished more certainly.</p>

    DOI: 10.1299/jsmelem.2021.10.178-171

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  • Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:3rd report: Detachment and Reattachment Behaviors of 20 nm Gold Single-particles during Enforcing Ultrasonic

    Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2021 ( 0 )   314 - 315   2021.01

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    DOI: 10.11522/pscjspe.2021S.0_314

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    Other Link: https://ci.nii.ac.jp/naid/130008083994

  • Real-time visualization of the cleaning of ceria particles from silicon dioxide films using PVA brush scrubbing Reviewed

    Ranaweera C.K., Khajornrungruang P., Hamada S., Gowda A., Vegi H., Seo J., Babu S.V.

    ECS Journal of Solid State Science and Technology   10 ( 8 )   2021.01

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    DOI: 10.1149/2162-8777/ac1c55

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  • Study on material removal mechanism for Cu-CMP on a patterned silicon wafer

    Bakier M.A.Y.A., Matsumoto R., Fuchiwaki M., Khajornrungruang P., Suzuki K.

    10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021   243 - 245   2021.01

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  • Brownian motion simulation of SiO<inf>2</inf> abrasive nanoparticle on SiC substrate surface Reviewed

    Saenna S., Khajornrungruang P., Blattler A., Permpatdechakul T., Suzuki K., Bakier M.A.

    10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021   353 - 357   2021.01

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  • Investigation on the Abrasive Phenomenon of Colloidal SiO<sub>2</sub> Particles and Water-soluble C<sub>60</sub> Inclusion Complex Particles in the CMP Process of the 4H-SiC Substrate Wafer Reviewed International journal

    Tsai Yueh-Hsun, Suzuki Keisuke, Chen Chao-Chang A., Khajornrnrungruang Panart

    Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers )   2021.10 ( 0 )   094-114   2021.01

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    <p>This study used a water-soluble inclusion complex, fullerene/β-cyclodextrins(C<sub>60</sub>/β-CDs), as additive abrasive with conventional SiO<sub>2</sub> slurry for the chemical mechanical polishing/planarization(CMP) of the silicon carbide substrate wafer. The hydrodynamic size(<i>d<sub>H</sub></i>) of C<sub>60</sub>/β-CDs suspension was measured by the dynamic light scattering(DLS) method; the appearance of a C<sub>60</sub>/β-CDs inclusion complex is observed by TEM. The C<sub>60</sub>/β-CDs hybrid SiO<sub>2</sub>-based slurry performed a higher removal rate than conventional SiO<sub>2</sub> slurry, and the polished surface showed a lower depression and roughness, too.</p>

    DOI: 10.1299/jsmelem.2021.10.094-114

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  • Study on Polishing Method Using Double Magnet System by Superconductive Assisted Machining Method Reviewed International journal

    Keisuke Suzuki, Tatsuya Nakasaki, Hidetaka Nakashima, Panart Kajornrunruan, Misaki Onomata, Yushi Kinoshita, Ruizhe Zhang, Edmund Soji Otabe

    JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing   2020.09

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    DOI: 10.1115/lemp2020-8553

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    Other Link: http://asmedigitalcollection.asme.org/lemp/proceedings-pdf/doi/10.1115/LEMP2020-8553/6619658/v001t03a009-lemp2020-8553.pdf

  • High-speed three-dimensional tracking of individual 100 nm polystyrene standard particles in multi-wavelength evanescent fields Invited Reviewed

    Aran Blattler, Panart Khajornrungruang, Keisuke Suzuki, Thitipat Permpatdechakul

    Measurement Science and Technology   31 ( 9 )   2020.09

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    DOI: 10.1088/1361-6501/ab87ec

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  • Advanced chemical-mechanical planarization for 4H-SiC substrate by water-soluble inclusion complexes of fullerene Reviewed

    Tsai Y.H., Chen C.C.A., Suzuki K., Khajornrungruang P., Chiu S.F., Hua C.T.

    Japanese Journal of Applied Physics   59 ( SL )   2020.07

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    DOI: 10.35848/1347-4065/ab8c9b

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  • Trajectories, diffusion, and interactions of single ceria particles on a glass surface observed by evanescent wave microscopy Reviewed

    Seo J., Gowda A., Khajornrungruang P., Hamada S., Song T., Babu S.

    Journal of Materials Research   35 ( 3 )   321 - 331   2020.02

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    DOI: 10.1557/jmr.2020.6

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  • Study on novel nano fine particles reacted with fullerene for hard to process material

    Hisayoshi Fuya, Suzuki Keisuke, Tsai Yueh-Hsun, Khajornrungruang Panart, Yasunaga Takuo, Takazaki Hiroko, Ouchi Masayoshi

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2020 ( 0 )   486 - 487   2020.01

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    DOI: 10.11522/pscjspe.2020S.0_486

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    Other Link: https://ci.nii.ac.jp/naid/130007896718

  • 局在光によるナノ研磨現象観測に関する研究:第1報:開発した小型装置による実験的評価

    パームパッデーチャークン ティティパット, カチョーンルンルアン パナート, 鈴木 恵友, ブラットラー アラン, 寺山 裕

    精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering )   2020 ( 0 )   658 - 659   2020.01

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    <p>The nanoscale polishing phenomena between the substrate surface and polishing pad during process, such as CMP process, were observed and evaluated, in this report. The concept of observation method is applied the generated evanescent field to limit the observable region only on the surface being polished, and the detectable scattering light from the nanoparticles and polishing pad when they move close to the surface in a range of evanescent field. The detected scattering light intensity could be used for evaluating the phenomena. According to the observed results, there should have been more than two different phenomena in polishing; the particles adhering on the polishing pad, and the individual movement particles during moving. However, the phenomena being able to perform polishing, could not clearly identify yet.</p>

    DOI: 10.11522/pscjspe.2020S.0_658

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    Other Link: https://ci.nii.ac.jp/naid/130007896847

  • 作用表面上におけるナノスケール現象の化学的実時間観測に関する研究:第1報:ラマン分光光度計の開発

    ド バン タン, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering )   2020 ( 0 )   622 - 623   2020.01

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    <p>This paper reports development of an optical apparatus for Real-time observation during chemical reactions in Nano-scale process on surface such as CMP (Chemical-Mechanical polishing) and catalysis by applying in evanescent field. Beside using evanescent field to observe Nano-particles in physical aspects, the developed Raman spectroscopy apparatus aims to observe chemical aspects during reactions on processing surface. Changes in Raman scattering spectrum is expected to understand chemical reactions on the processing surface. In this report, the 532 nm wavelength laser source will be used to generate evanescent field. A rotation stage of diffraction grating and a translation stage will used to optimize the Raman spectrum data.</p>

    DOI: 10.11522/pscjspe.2020S.0_622

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    Other Link: https://ci.nii.ac.jp/naid/130007896772

  • ナノスケールにおける加工現象可視化に関する研究:第6報:単一ナノ粒子の三次元目変位の検証

    ブラットラー アラン, カチョーンルンルアン パナート, 鈴木 恵友, パームパッデーチャークン ティティパット

    精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering )   2020 ( 0 )   588 - 589   2020.01

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    <p>The nanoscale phenomena, such as chemical mechanical polishing (CMP) process, present near the surface. A three-dimensional nanoparticle tracking could explain the phenomena that happen in the polishing process. From our previous report, we have investigated the three-dimensional motion of an individual standard nanoparticle by using optical method, but the height Z on the third dimension was not accurately verified. In this report, the sub-100 nm individual nanoparticles were fixed on the tip which the tip was connected to the piezo actuator for controlling the height Z displacement. The multi-wavelength evanescent fields with optical microscopy system is also applied in the experiment for three-dimensional nanoparticle tracking. The scattering light from nanoparticle will exponentially increase when the nanoparticle on the tip was downward moved close to the reference surface. Finally, The height Z uncertainty could be measured approximately ±25 nm and the penetration height measurability were 200 nm far from the reference surface. We could three-dimensionally track the individual standard nanoparticle in recording speed higher than 50 frames per second for exposure time less than 10 milliseconds.</p>

    DOI: 10.11522/pscjspe.2020S.0_588

    CiNii Article

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    Other Link: https://ci.nii.ac.jp/naid/130007896683

  • Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

    KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, HAMADA Satomi, WADA Yuutaka, HIYAMA HIYAMA

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2020 ( 0 )   17E02   2020.01

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    <p>Cleaning phenomena in semiconductor manufacturing is about the nano-contamination being repelled out from, or adhering to, the wafer surface. However, residual contamination on the wafer has been usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light generated by internal reflection. This article introduces some of observed physical phenomena during duplicated cleaning process in both contact cleaning by a PVA brush and non-contact cleaning by mega-sonic wave.</p>

    DOI: 10.1299/jsmekanto.2020.17E02

    CiNii Article

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    Other Link: https://ci.nii.ac.jp/naid/130007994424

  • Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:2nd report : Non-contact Removal of Abrasive Nano-particles during Enforcing Mega sonic

    Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Permpatdechakul Thitipat, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2020 ( 0 )   660 - 661   2020.01

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    DOI: 10.11522/pscjspe.2020S.0_660

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    Other Link: https://ci.nii.ac.jp/naid/130007896839

  • Three-dimensional tracking and height verification of polystyrene particles with piezo actuator positioning by means of multi-wavelength evanescent fields Reviewed

    Blattler A., Khajornrungruang P., Suzuki K., Permpatdechakul T.

    Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020   53 - 56   2020.01

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  • 3D trajectories and diffusion of single ceria particles near a glass surface and their removal Reviewed

    Seo J., Gowda A., Khajornrungruang P., Hamada S., Babu S.V.

    Journal of Materials Research   2020.01

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    DOI: 10.1557/jmr.2020.246

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  • Hydropower plant generator system model using labVIEW Reviewed

    2019.07

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    DOI: 10.1109/ICEAST.2019.8802533

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  • Study on Relationship of the Material Removal Amount and the Increase in Abrasive Nanoparticle Size during Si-CMP Reviewed

    2019.03

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    DOI: 10.1109/ESIT.2018.8665198

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  • Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field Reviewed

    Terayama Yutaka, Kusatsu Kohei, Morita Rintaro, Khajornrungruang Panart, Wada Yutaka, Hamada Satomi, Hiyama Hirokuni

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2019S ( 0 )   138 - 139   2019.03

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    DOI: 10.11522/pscjspe.2019s.0_138

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  • Characteristic Evaluation of Scattering Light from Cutting edge in Evanescent Field by Using Numerical Simulation Method

    Aramaki Hirochika, Khajornrungruang Panart, Suzuki Keisuke, Taira Kanako

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2019S ( 0 )   904 - 905   2019.03

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    DOI: 10.11522/pscjspe.2019s.0_904

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  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale

    Blattler Aran, Khajornrungruang Panart, Suzuki Keisuke, Permpatdechakul Thitipat

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2019S ( 0 )   459 - 460   2019.03

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    <p>The nanoparticle is popularly used for chemical mechanical polishing process (CMP) in semiconductor industry. There are many unknown phenomena in nanoparticles moving during polishing process. Therefore, we have been studying the phenomena by using optical method on 3D position tracking of nanoparticle in real-time measurement. In this report, the gold 50 nm standard particles would be observed to determine the 3D motion tracking of individual nanoparticle. According to our previous studies, the single wavelength of evanescent light field is hard to determine the 3D spatial position of each nanoparticle. Thus, the multi-wavelength of scattering light is applied in the experiment. The scattering light will occur when the particle moving near to the reference surface. Finally, the 3D position tracking results of standard nanoparticle will be investigated and discussed by the exponential relationships between the detected scattering light and the measured depth Z values.</p>

    DOI: 10.11522/pscjspe.2019s.0_459

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  • Study on processing method using superconductive assisted machining method

    NAKASHIMA Hidetaka, NAKASAKI Tatsuya, TANAKA Yuki, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

    The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers )   2019 ( 0 )   2019.01

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    In recent years, superconductive assisted machining method (SUAM) using a magnetic levitation tool utilizing a superconducting phenomenon such as pinning effect has been developed to reduce tool interference on the conventinal procceing method. Measurement of the force by the magnetic levitation tool is evauated in the air to determind polishing conditions. In our study, polishing test were performed not only on aluminum plate but also stainless steel plate using fixed and loose abrasives. As a result, the superconductive assisted machining method was applicable to stainless steel material.

    DOI: 10.1299/jsmemmt.2019.13.D38

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    Other Link: https://ci.nii.ac.jp/naid/130007836391

  • 点滴流量精密計測の研究:Z値による画像処理とレンズ収差の影響

    高市 峻佑, カチョーンルンルアン パナート, 伊藤 高廣, 村上 直

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2019 ( 0 )   476 - 477   2019.01

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    <p>病院などで使用されている点滴装置は,流量を一定に保つために正確な流量測定が必要である.特に,抗がん剤などの副作用がある薬液を使用する場合には,より正確性が求められている.現在使用されている点滴測定装置は,液滴の濃度が高いと精度が悪化するというデメリットがあるため,液滴の種類によらず測定できる測定手法が求められている.本研究では,画像処理を使用した体積推定により,液滴の体積を測ることを目的とした.</p>

    DOI: 10.11522/pscjspe.2019A.0_476

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130007800991

  • Study on Real Time Phenomenon Observation of Nano-Particle Adhesion and Removal by Evanescent Light

    MORITA Rintarou, Khajornrungruang Panart, TERAYAMA Yutaka, KUSATSU Kohei, HIYAMA Hirokuni, WADA Yuutaka, HAMADA Satomi

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2019 ( 0 )   18A02   2019.01

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    <p>The study on removal mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. An optical method has been applied to visualize only the nano-particles moving near to a surface by an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. The removal phenomena of the SiO<sub>2</sub> particles (105 nm) on the BK7 glass surfaces were observed by our developed experimental setup. The SiO<sub>2</sub> particles removal with ultrasonic (approx. 1 MHz) was demonstrated.</p>

    DOI: 10.1299/jsmekanto.2019.25.18A02

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    Other Link: https://ci.nii.ac.jp/naid/130007712645

  • The Performance Evaluation of Developed Apparatus for Observing the Nanoparticles Phenomena During CMP Process by Applying Evanescent Field

    Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Taira Kanako

    日本機械学会九州支部講演論文集 ( The Japan Society of Mechanical Engineers )   2019 ( 0 )   A42   2019.01

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    <p>In this paper, the performance evaluation of developed in-situ apparatus for real-time observation were studied. The apparatus could observe the nanoparticles phenomena on surface between substrate and polishing pad that is essential to improve the Material Removal Rate (MRR) of the substrate during Chemical Mechanical Polishing (CMP) process. We propose the single wavelength by applying an evanescent field in order to observe the nanoparticles phenomena. The experimental condition were separated into two experiments, as different size (sub 10 nm and 105 nm) silica slurry ( 5 wt% with pH 10.5) with pure water (pH 10.5). According to the experimental result, the our apparatus could detect the scattering light intensity of pure water and silica slurry during polishing process. The silica slurry are higher scattering light intensity than pure water, and sub 10 nm silica slurry is highest intensity.</p>

    DOI: 10.1299/jsmekyushu.2019.72.A42

    CiNii Article

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    Other Link: https://ci.nii.ac.jp/naid/130007801889

  • Study on Organic Fibers in The Polishing Pad for Sapphire Chemical Mechanical Polishing

    Chansatarpornkul Sansuwan, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集   2019 ( 0 )   18 - 19   2019.01

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    DOI: 10.11522/pscjspe.2019A.0_18

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130007800812

  • Real time nanoscale cleaning phenomenon observation during PVA brush scrubbing by evanescent field Reviewed

    Terayama Y., Khajornrungruang P., Suzuki K., Kusatsu K., Hamada S., Wada Y., Hiyama H.

    ECS Transactions   92 ( 2 )   191 - 197   2019.01

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    DOI: 10.1149/09202.0191ecst

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  • FDTD Simulation for Analysing Scattering Light Characteristic of Moving Nano-particle in Evanescent Field

    Khajornrungruang PANART, SUZUKI Keisuke, TAIRA Kanako, ARAMAKI Hirochika

    The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers )   2019 ( 0 )   D18   2019.01

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    In surface fabrication process, such as the polishing in semiconductor substrate, there are many nano-particles moving on or nearby the surface to be polished. We have been establishing an optical method to observe and to track the 3-dimensional position of each dynamical moving nano-particle on time by applying an evanescent light field. In this report, the scattering light characteristic from a moving nano-particle in an evanescent field generated by internal reflection on a silica glass surface was analysed by FDTD (Finite Difference Time Domain) method on MATLAB. We discuss the scattering light from a particle moving perpendicularly to a surface in an interval time as one recorded frame in practical observation.

    DOI: 10.1299/jsmemmt.2019.13.D18

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    Other Link: https://ci.nii.ac.jp/naid/130007836425

  • Research on high speed polishing technology using electrode embedded type low refractive transparent pad Reviewed

    Kato Yuya, Ryunosuke Matsumoto, Suzuki Keisuke, Panart Khajornrungruang

    The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers )   2019 ( 0 )   2019.01

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    The manufacturing process of the transparent pad was developed by the thermal imprint method equipped with a special jig for controlling the thickness, pattern and electrode structure. Particle behavior is controlled by the electric field using a wire mesh inserted into a low index transparent polishing pad. As a result, the movement of hybrid particles of diamond particles and silica particles can be observed in an electric field using a digital microscope. Furthermore, in the polishing experiment, it was possible to obtain a higher amount of material removal in the presence of the electric field than in the absence of the electric field.

    DOI: 10.1299/jsmemmt.2019.13.D39

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130007836392

  • Visualization of Slurry Flow between Polishing Pad and Wafer in CMP (4th Report)

    Fukuda Akira, Sekiduka Noriaki, Yamamoto Hiroki, Suzuki Keisuke, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2018A ( 0 )   295 - 296   2018.08

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    DOI: 10.11522/pscjspe.2018a.0_295

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  • Study on the Optimization of Hybrid fine particles on Chemical Mechanical Polishing of Hard to process materials

    Suzuki Keisuke, Bun-Athuek Natthaphon, Takazaki Hiroko, Yasunaga Takuo, Yoshimoto Yutaka, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2018A ( 0 )   312 - 313   2018.08

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    <p>We repot on the hybrid fine particles using core silica particles adsorbed on the ultra fine nano particles such as nano silica particles (ca.4nm diameter) and fullerenol for Chemical Mechanical Polishing of Hard to process materials. In our study, chemical reactivity and mechanical action from the hybrid particles were investigated using the several diameters of the core silica particles. At the case of adsorption of the nano silica particles and fullerenol, chemical reactivity become dominant parameter under the small size region although the nano particle is coated on the surface of the core silica particles. These results expect that both parameters as chemical reactivity and mechanical action can be control by the sizes of core particles and coating condition of the nano silica particles. We also optimize the structure of the hybrid silica particles at the case of the nano silica particles and/or fullerenol to meet the high performance CMP of hard to process materials and discuss about these results.</p>

    DOI: 10.11522/pscjspe.2018a.0_312

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  • Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire Reviewed

    57 ( 7 )   2018.07

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    DOI: 10.7567/JJAP.57.07MD03

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  • Study on Non-Contact Micro Tool Tip Nano-Position Detection by Means of Evanescent Field Penetration Depth Reviewed

    Panart Khajornrungruang, Keisuke Suzuki, Tomoki Inoue

    2018.06

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    Italy   Venice  

  • Analytical on mixed colloidal silica particle in slurry of sapphire Chemical Mechanical Polishing Reviewed

    BUN-ATHUEK NATTHAPHON, YOSHIMOTO YUTAKA, SAKAI KOYA, KHAJORNRUNGRUANG PANART, SUZUKI KEISUKE

    LEM21   2017 ( 0 )   2018.05

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    DOI: 10.1299/jsmelem.2017.9.173

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    Other Link: https://ci.nii.ac.jp/naid/130006744679

  • Development of new polishing pad with a semispherical shape formed by materials with different wear rates

    ONIKI Takahiro, KATO Yuya, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke, TASHIRO Yasunori, MATSUO Masaaki

    Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology )   62 ( 5 )   264 - 266   2018.05

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    We have developed a polishing pad using materials with different wear rates to achieve highly efficient polishing of difficult-to-process material substrates. Nylon fibers with good mechanical properties are arranged with other materials, followed by dressing to form protrusions on the polishing pad surface. Stable polishing performance can be expected if the orientation and arrangement of the nylon fibers can be controlled. A sapphire substrate was polished using the prototype polishing pad developed in this research. The results indicated 30% improvement in material removal rate compared to the ready-made pad.

    DOI: 10.11420/jsat.62.264

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  • Study of Electroosmotic Micro-Flow Enhanced Abrasives Distribution in Nanoparticle Contained Slurry for Copper Chemical Mechanical Planarization Reviewed

    Tsai Yueh-Hsun, Suzuki Keisuke, Chang Chao-Chung, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2018S ( 0 )   781 - 782   2018.03

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    <p>Chemical mechanical planarization is one of the crucial steps for the manufacturing process of semiconductor. CMP process with good adaptability can lead to high productivity, low defect, and coping with the ever-changing materials. In CMP process, slurry plays a big role in material removal. Among the composition of slurry, the abrasive predominates in the removal rate and surface quality. Therefore, this study develops the application of water-soluble nanoparticles, such as fullerene, as abrasives for the copper CMP process. By electroosmotic phenomenon, a kind of electro kinetic force, it generates the micro-flow field for abrasive during CMP process. The increasing disturbance of flow enhances the uniformity of abrasive distribution and polishing efficiency. The electrode embedded polishing platen which causes the electroosmotic flow on polishing pad is revealed and simulated by multi-physics fields coupling software, COMSOL Multiphysics. Finally, comparing with the results of simulation and flow visualization with fluorescent powders, the optimal and reasonable design is discussed.</p>

    DOI: 10.11522/pscjspe.2018s.0_781

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  • Accurate measurement of flow rate of continuous fluid

    Takeuchi Ryosuke, Takaichi Shunsuke, Murakami Sunao, Ito Takahiro, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2018S ( 0 )   873 - 874   2018.03

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    DOI: 10.11522/pscjspe.2018s.0_873

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  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale-4th: Estimation of longitudinal Resolution

    Shirakawa Hiroaki, Blatter Aran, Takemoto Ryo, Khajornrungruang Panart, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2018S ( 0 )   129 - 130   2018.03

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    DOI: 10.11522/pscjspe.2018s.0_129

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  • Study on non-contact micro tool tip nano-position detection by means of evanescent field penetration depth Reviewed

    139 - 140   2018.01

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  • Study on polishing method using magnetic levitation tool by superconducting Reviewed

    TANAKA Yuki, NAKASHIMA Hidetaka, HIRAMATU Yuta, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

    Journal of the Japan Society for Abrasive Technology   62 ( 4 )   219 - 220   2018.01

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    DOI: 10.11420/jsat.62.219

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    Other Link: https://ci.nii.ac.jp/naid/130007492417

  • Study on polishing processing using Superconductive Assisted Machining method(SUAM)

    TANAKA Yuki, NAKASHIMA Hidetaka, ONOMATA Misaki, Khajornrungruang P, OTABE Soji, SUZUKI Keisuke

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2018.71 ( 0 )   F36   2018.01

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  • Study on fabrication method of low refractive transparent pad by thermal transfer

    Kato Yuya, Suzuki Keisuke, Khajornrungruang Panart, Yamaguchi Yuta, Tsai Yueh-Hsun

    The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers )   2018.12 ( 0 )   D06   2018.01

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    Fabrication process of the pad has been developed by imprint method with special zig to control of the thickness and patter and electrode structure. Movement of the fine particle is controlled by electrical field using copper wire electrode inserted in the low refractive index – transparency polishing pad. As results, we can be observe the movement of the diamond particle between the pattern structures under the pad by electrical field using digital microscope.

    DOI: 10.1299/jsmemmt.2018.12.d06

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    Other Link: https://www.jstage.jst.go.jp/article/jsmemmt/2018.12/0/2018.12_D06/_pdf

  • Observation of Nano-particle Adhesion and Desorption Phenomenon Near to Silicon Nitride and Oxide Film Surface in an Evanescent Field

    TERAYAMA Yutaka, NAKANO Asato, Khajornrungruang Panart, SUZUKI Keisuke, WADA Yutaka, HAMADA Satomi

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2018.24 ( 0 )   OS0105   2018.01

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    <p>The study on adhesion and desorption mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. This report proposes an optical method to visualize only the nano-particles moving near to Si<sub>3</sub>N<sub>4</sub> and SiO<sub>2</sub> film surfaces by applying an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. Adhesion and desorption phenomena of the polystyrene latex standard particles (50±1 nm) and the SiO<sub>2</sub> particles (55 nm) moving near to the Si<sub>3</sub>N<sub>4</sub> and SiO<sub>2</sub> film surfaces were observed by our developed experimental setup. Furthermore, desorption phenomenon of SiO<sub>2</sub> particles (105 nm) with the flow occurred by polyvinyl alcohol (PVA) sponge brush sliding was also demonstrated.</p>

    DOI: 10.1299/jsmekanto.2018.24.os0105

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    Other Link: https://www.jstage.jst.go.jp/article/jsmekanto/2018.24/0/2018.24_OS0105/_pdf

  • Analytical on mixed colloidal silica particle in slurry of sapphire chemical mechanical polishing Reviewed

    2017.11

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  • In situ measurement method for film thickness using transparency resin sheet with low refractive index under wet condition on chemical mechanical polishing Reviewed

    56 ( 7 )   2017.07

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    DOI: 10.7567/JJAP.56.07KH02

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  • Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire Reviewed

    56 ( 7 )   2017.07

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    DOI: 10.7567/JJAP.56.07KB01

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  • Micro tool diameter monitoring by means of laser diffraction for on-machine measurement Reviewed

    11 ( 5 )   736 - 741   2017.01

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    DOI: 10.20965/ijat.2017.p0736

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  • Non-contact Micro Tool Tip Position Detection Method by Evanescent Light Field

    Khajornrungruang PANART, INOUE Tomoki, SUZUKI Keisuke

    The Proceedings of Mechanical Engineering Congress, Japan ( The Japan Society of Mechanical Engineers )   2017 ( 0 )   S1330103   2017.01

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    <p>Non-contact tool setter for rotating micro tools has been needed because the position of tool tip during rotation is different from the position when the tool is not rotating. Furthermore, precision of tool position measurement is definitely required in nanoscale due to the miniaturization of micro rotating tool size down to smaller than 50<i>μ</i>m. An evanescent light field is applied to detect a micro tool tip position in nanoscale without contacting between micro tool and detector. In this report, micro tools with diameter of <i>φ</i> 50<i>μ</i>m were approached to and/or departed from a glass reference plane surface by a nano-controled piezo actuator to verify our detection method. Consequently, the tool tips were detected in the evanescent field during 300 nm range from the reference surface, implying that the tool tip can be detected in the precision of less than ±150 nm by only observing the scattering light from the evanescent light field without contacting.</p>

    DOI: 10.1299/jsmemecj.2017.s1330103

    CiNii Article

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    Other Link: https://www.jstage.jst.go.jp/article/jsmemecj/2017/0/2017_S1330103/_pdf

  • Study on processing technology using magnetic levitation tool by superconducting

    Tanaka Yuki, Suzuki Keisuke, Khajornrungruang Panart, Otabe Soji, Nakashima Hidetaka

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2017A ( 0 )   765 - 766   2017.01

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    DOI: 10.11522/pscjspe.2017a.0_765

    CiNii Article

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  • Study on processing technology using magnetic levitation tool by superconducting

    TANAKA Yuki, SUZUKI Keisuke, Khajornrungruang P

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2017.70 ( 0 )   907   2017.01

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  • 低屈折率の透明樹脂パッドを用いたCMPにおけるモニタリング技術に関する研究

    鬼木 喬玄, 鈴木 恵友, カチョーンルンルアン パナート

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2017S ( 0 )   523 - 524   2017.01

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    水と同等の屈折率を有する透明な樹脂パッドを用いて、スラリー中の微粒子観察やシリコン酸化膜の膜測など、CMPにおけるモニタリング技術に関する研究を行っている。今回は低屈折率の透明樹脂パッドを用いたモニタリング技術のコンセプトと、その足がかりとなる実験データについて報告する。

    DOI: 10.11522/pscjspe.2017s.0_523

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  • ナノスケールにおける加工現象可視化に関する研究 Reviewed

    白川 裕晃, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2017A ( 0 )   985 - 986   2017.01

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    ナノスケールにおける加工現象として,ナノ粒子を用いたポリシング加工がある.本研究は,ポリシング加工のナノ粒子の挙動を観察し,ナノ粒子による加工現象を解明することを目的とする.そこで本研究では,表面上近傍に局在するエバネッセント光を用いた実時間観測を行っている.既知のナノ単粒子に多波長エバネッセント光を当て,その散乱光の強度を調べたので,ここに報告する.

    DOI: 10.11522/pscjspe.2017a.0_985

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  • Study on evaluation method for surface topography of polishing pad based on optical Fourier transform Reviewed

    2016.02

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  • I-11 サファイアCMPにおけるコロイダルシリカと水酸化フラーレンの混合スラリーの最適化

    BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUAN PANART, MURAKAWA WATARU, SATOU TOKIHITO, SUZUKI KEISUKE

    日本機械学会九州支部講演論文集   2016 ( 0 )   361 - 362   2016.01

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    DOI: 10.1299/jsmekyushu.2016.69.361

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  • Study on fine particles observation using Transparency micro-patterned pad during CMP

    ONIKI Takahiro, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart

    The Proceedings of Mechanical Engineering Congress, Japan ( The Japan Society of Mechanical Engineers )   2016 ( 0 )   S1330203   2016.01

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    <p>Transparency micro-patterned pad is used to observe fine particles by an epi-illumination microscope. The material of transparency micro-patterned pad is resin which has almost same as the refractive index of water. Therefore, it has characteristic that the micro pattern could disappear in the observation image by filling water. Epi-illumination microscope has illumination system and the detection system on the same side. In this study, we succeeded to observe the diamond particles with a diameter of 1μm on the glass substrate at 1000 frame/s in dark-field illumination. This results show that the fine particles could be observed simplicity, and also suggest the possibility that the fine particles observation on opaque substrate using the epi-illumination microscope.</p>

    DOI: 10.1299/jsmemecj.2016.s1330203

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    Other Link: https://www.jstage.jst.go.jp/article/jsmemecj/2016/0/2016_S1330203/_pdf

  • 超伝導バルクを利用した磁気浮上工具による中空加工技術に関する研究

    日高 裕, 上原 和晃, カチョーンルンルアン パナート, 小田部 荘司, 鈴木 恵友

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2016S ( 0 )   971 - 972   2016.01

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    本研究では超電導現象である磁気浮上を利用し、金型や3Dプリンタなどの中空部品成形技術が抱える問題を解消する新規中空加工技術の確立を目指している。その概要としては、磁気浮上を利用して磁性体や超伝導体を一定間隔離して浮上させトラップし、さらに回転運動を加え回転工具とすることで被加工物を切削する技術である。本報では樹脂などを用いて本加工技術の原理検証を行ったので、その内容について報告する。

    DOI: 10.11522/pscjspe.2016s.0_971

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  • ポリシング前後におけるスラリー中の研磨微粒子径に関する研究

    永井 利幸, 八尋 新, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2016S ( 0 )   371 - 372   2016.01

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    CMPでは,複数の加工材料に対して最適なスラリーやポリシングパッドを適用させる必要がある.これらの部材を最適化するためには,材料除去メカニズムに基づき,スラリー中微粒子の種類や微粒子径,材質,薬液を選定することが重要である.そこで本研究では,サファイア,SiO2などの複数の基板に対して動的光散乱法(DLS)を用いて微粒子径の変化について評価したので報告する.

    DOI: 10.11522/pscjspe.2016s.0_371

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  • Non-contact micro cutting tool diameter measurement using laser diffraction Reviewed

    2015.10

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    Language:English   Publishing type:Research paper (international conference proceedings)

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  • Study on dynamic observation method for fine particles during Chemical Mechanical Polishing using optical transparency micro-patterned pad Reviewed

    2015.10

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  • Non-Contact Micro Cutting Tool Diameter Measurement using Laser Diffraction Reviewed

    Panart Khajornrungruang, Keiichi Kimura, Hiroshi Suzuki, Keisuke Suzuki

    Proceedings of the 8th International Conference on Leading Edge Manufacturing in 21st Century (LEM21)   Accepted   2015.10

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    日本   Kyoto   2015.10.18  -  2015.10.22

  • Determination of Individual Sub 100 nm Nano-Particle Size inan Evanescent Field using Scattering Light Intensity Reviewed

    Panart Khajornrungruang, Sevim Korkmaz, Angshuman Pal, Keisuke Suzuki, Keiichi Kimura, S. V. Babu

    Advanced Metallization Conference 2015   2015.09

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    Korea   Seoul   2015.09.16  -  2015.09.18

  • Study on evaluation method for polishing pad surface topography based on optical fourier transform Reviewed

    Khajornrungruang P., Suzuki K., Kushida T., Tajiri T., Matsuo H., Mochizuki Y., Hiyama H., Kimura K.

    ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014   205 - 208   2015.01

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    日本   神戸   2014.11.19  -  2014.11.21

    DOI: 10.1109/ICPT.2014.7017281

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    Other Link: http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6996093

  • 1516 Non-Contact Micro Cutting Tool Diameter Measurement using Laser Diffraction Reviewed

    2015 ( 0 )   _1516 - 1_-_1516-4_   2015.01

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    DOI: 10.1299/jsmelem.2015.8._1516-1_

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110010045303

  • 2108 Study on dynamic observation method for fine particles during Chemical Mechanical Polishing using optical transparency micro-patterned pad Reviewed

    2015 ( 0 )   _2108 - 1_-_2108-5_   2015.01

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    DOI: 10.1299/jsmelem.2015.8._2108-1_

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110010045337

  • Study on sub 50 nm sized particle dynamic observation in water using evanescent field with mobile apparatus Reviewed

    73 - 77   2014.11

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    USA   Boston, Massachusetts   2014.11.09  -  2014.11.14

  • Study on dynamic observation of sub-50 nm sized particles in water using evanescent field with a compact and mobile apparatus Reviewed

    73 - 77   2014.01

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  • 「寄書」見えない可視光

    カチョーンルンルアン パナート

    Voice of CMP, No. 25 ( 精密工学会 プラナリゼーションCMPとその応用技術専門委員会 )   2013.12

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  • Nano-Sized Particles Detection and Analysis in Solutions using Evanescent Field Invited

    2013.09

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    USA   Lake Placid, New York   2013.08.11  -  2013.08.14

  • Study on fine particles behavior in slurry flow between wafer and polishing pad as a material removal process in CMP Invited Reviewed

    345 - 350   2013.01

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    France   Grenoble   2012.10.15  -  2012.10.17

    Other Link: http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6353748

  • 高速加工における小径工具の高精度オンマシン計測

    カチョーンルンルアン パナート、木村景一、鈴木裕

    機械技術 ( 日刊工業新聞社 )   60 ( 7 )   38 - 41   2012.07

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Article, review, commentary, editorial, etc. (trade magazine, newspaper, online media)

  • Micro Tool Cutting Edge Profile Measurement using Laser Diffraction Method

    Die and Mould Technology   27 ( 7 )   124   2012.07

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Research paper (scientific journal)

  • On-machine measurement of a distance between high speed rotation tool tip and workpiece by laser diffraction Reviewed

    Panart Khajornrungruang, Keiichi Kimura, Keisuke Suzuki

    251 - 254   2012.06

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    Sweden   Stockholm  

  • High precision tool cutting edge monitoring using laser diffraction for on-machine measurement Invited Reviewed

    6 ( 2 )   163 - 167   2012.03

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  • High Precision Tool Cutting Edge Monitoring Using Laser Diffraction for On-Machine Measurement Reviewed

    Panart Khajornrungruang, Keiichi Kimura, Yasuhiro Takaya, Keisuke Suzuki

    International Journal of Automation Technology   6 ( 2 )   163 - 167   2012.03

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  • On-machine measurement of a distance between high speed rotation tool tip and workpiece by laser diffraction Reviewed

    1   251 - 254   2012.01

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  • Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP Invited Reviewed

    Kimura K., Suzuki K., Khajornrungruang P.

    ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings   345 - 350   2012.01

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  • Study on Sapphire CMP Slurry using Water-soluble Fullerenol as Fine Particles Reviewed

    Keiichi Kimura,Panart Khajornrungruang,Eiichiro Okamoto

    Proc of International Conference on Planarization/CMP Technology   287 - 292   2011.11

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    2011.11.09  -  2011.11.11

  • Spatial Fourier Transform Analysis of Polishing Pad Surface Topography Reviewed

    2011.09

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  • Performance of water-soluble fullerene as novel functional fine particles for sapphire CMP Reviewed

    2011.09

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  • Slurry Supplying Method for Large Quartz Glass Substrate Polishing Reviewed

    Panart Khajornrungruang,Keiichi Kimura,Ryuji Yui,Nagisa Wada,Keisuke Suzuki

    Japanese Journals of Applied Physics   50 ( 5 )   2011.05

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    DOI: 10.1143/JJAP.50.05EC03

    Scopus

    CiNii Article

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  • Investigation on slurry flow and temperature in polishing process of quartz glass substrate Invited Reviewed

    5 ( 2 )   195 - 200   2011.03

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  • Evaluation method applying Fourier transform analysis for conditioned polishing pad surface topography Invited Reviewed

    5 ( 2 )   173 - 178   2011.03

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  • Evaluation Method Applying Fourier Transform Analysis for Conditioned Polishing Pad Surface Topography Reviewed

    Keiichi Kimura,Panart Khajornrungruang,Takahisa Okuzono,Keisuke Suzuki

    International Journal of Automation Technology   5 ( 2 )   173 - 178   2011.03

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  • Investigation on Slurry Flow and Temperature in Polishing Process of Quartz Glass Substrate Reviewed

    Panart Khajornrungruang,Nagisa Wada,Keiichi Kimura,Ryuji Yui,Keisuke Suzuki

    International Journal of Automation Technology   5 ( 2 )   195 - 200   2011.03

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  • Study on Sapphire Chemical Mechanical Polishing using mixed abrasive slurry with fullerenol Reviewed

    294 - 295   2010.12

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  • Investigation on slurry flow and temperature in polishing process of quartz glass substrate Reviewed

    559 - 562   2010.12

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  • Slurry supplying method for large quartz glass substrate polishing Reviewed

    276 - 277   2010.12

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  • Evaluation method for conditioned polishing pad surface topography applying Fourier transform analysis Reviewed

    388 - 391   2010.12

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  • Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching Reviewed

    Khajornrungruang P., Kimura K., Baba A., Yasuda K. and Tanaka A.

    Asian International Journal of Science and Technology in Production and Manufacturing Engineering   3 ( 3 )   29 - 34   2010.12

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  • Study on Wafer and Polishing Pad Surface Contact with Stationary and Dynamic Behavior Reviewed

    Keiichi Kimura,Panart Khajornrungruang,Eiichiro Okamoto

    International Conference on Planarization/CMP Technology   2010.11

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    2010.11  -  2010.11

  • Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching Reviewed

    Khajornrungruang P.,Kimura K.,Baba A.,Yasuda K,Tanaka A.

    Global Congress on Manufacturing and Management(GCMM2010)   253 - 258   2010.11

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    2010.11  -  2010.11

  • Investigation of Slurry Flow in Chemical Mechanical Polishing Process of the Quartz Glass Substrate used for Flat Panel Display Photomask Reviewed

    Kimura K.,Khajornrungruang P.,Wada N.

    Global Congress on Manufacturing and Management(GCMM2010)   2010.11

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    2010.11  -  2010.11

  • Study on Sapphire Chemical Mechanical Polishing using Mixed Abrasive Slurry with Fullerenol Reviewed

    K. Suzuki,T. Saitou,T. Korezawa,P. Khajornrungruang,K. Kimura

    Advanced Metallization Conference 2010   154 - 154   2010.10

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    2010.10  -  2010.10

  • Slurry Supplying Method for Large Quartz Glass Substrate Polishing Reviewed

    P. Khajornrungruang,R. Yui,N. Wada,K. Suzuki,K. Kimura

    Advanced Metallization Conference 2010   136 - 136   2010.10

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    2010.10  -  2010.10

  • Evaluation Method for Conditioned Polishing Pad Surface Topography applying Fourier Transform Analysis Reviewed

    Keiichi KIMURA,Panart KHAJORNRUNGRUANG,Takahisa OKUZONO

    International Symposium on Measurement and Quality Control   2010.09

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    2010.09  -  2010.09

  • Investigation on Slurry Flow and Temperature in Polishing Process of Quartz Glass Substrate Reviewed

    Panart KHAJORNRUNGRUANG,Nagisa WADA,Ryuji YUI,Keiichi KIMURA

    International Symposium on Measurement and Quality Control   2010.09

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    2010.09  -  2010.09

  • Development of Periodically Arrayed Micro Pyramid Asperity on Polishing Pad Surface for CMP process using Lithography Reviewed

    Panart Khajornrungruang,Keiichi Kimura,Akiyoshi Baba,Naoaki Takahashi,Yuichi Hashiyama and Keisuke Yasuda

    Asian Symposium for Precision Engineering and Nanotechnology 2009 (ASPEN 2009)   2009.11

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    2009.11.11  -  2009.11.13

  • Study on Material Removal Model in Oxide CMP process Reviewed

    Yuuichi Hashiyama,Panart Khajornrungruang,Keiichi Kimura

    Asian Symposium for Precision Engineering and Nanotechnology 2009 (ASPEN 2009)   2009.11

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    2009.11.11  -  2009.11.13

  • Cu-CMP Assisted with Ultra Violet Light Irradiation Directly to Wafer Surface Reviewed

    Panart Khajornrungruang,Keiichi Kimura and Nobutaka Sumomogi

    2009 International Conference on Planarization/CMP Technology (ICPT 2009)   247 - 251   2009.11

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    2009.11  -  2009.11

  • Development of Arrayed Micro Pattern on Polishing Pad Surface Applied with Anisotropic Etching Reviewed

    Keisuke Yasuda,Keiichi Kimura,Akiyoshi Baba,Panart Khajornrungruang,Akiho Tanaka

    2009 International Conference on Planarization/CMP Technology (ICPT 2009)   461 - 466   2009.11

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    2009.11  -  2009.11

  • Study on Slurry Flow in CMP Process for Large Quadrilateral Quartz Glass Substrate Reviewed

    Nagisa Wada,Panart Khajornrungruang,Keiichi Kimura

    2009 International Conference on Planarization/CMP Technology (ICPT 2009)   455 - 460   2009.11

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    2009.11  -  2009.11

  • Study of functionality of fine particles in slurry for oxide CMP process Reviewed

    Yuuichi Hashiyama,Panart Khajornrungruang,Keiichi Kimura

    2009 International Conference on Planarization/CMP Technology (ICPT 2009)   370 - 374   2009.11

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    2009.11  -  2009.11

  • Evaluation Method for Surface Topography of Conditioned Polishing Pad based on Fourier Transform Reviewed

    Takahisa Okuzono,Panart Khajornrungruang,Yoshikazu Idei and Keiichi Kimura

    2009 International Conference on Planarization/CMP Technology (ICPT 2009)   449 - 454   2009.11

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    2009.11  -  2009.11

  • 角形石英ガラス研磨におけるスラリー流れに関する研究 Reviewed

    橋山雄一,木村景一,カチョーンルンルアン・パナート

    砥粒加工学会   53 ( 9 )   578 - 582   2009.09

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    主要雑誌

  • Study on slurry flow in quadrilateral silica glass polishing Reviewed

    HASHIYAMA Yuuichi, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

    Journal of the Japan Society for Abrasive Technology   53 ( 9 )   578 - 582   2009.09

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    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/10025103361

  • Study on slurry flow in quadrilateral silica grass polishing Reviewed

    HASHIYAMA Yuuichi, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

    Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology )   53 ( 9 )   578 - 582   2009.01

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    In liquid crystal display panel production, the silica glass photo mask in the photolithography process is becoming larger, and planarity improvement of the silica glass photo mask is required. Planarization of the mask surface requires polishing. However, the polishing of large-sized silica glass involves nonuniform slurry flow under the glass. In this study, we visualized the slurry flow in polishing of a square of silica glass to realize uniform slurry flow. Furthermore, we visualized the slurry flow with various grooved polishing pads and examined the slurry flow between the silica glass and pad surface.

    DOI: 10.11420/jsat.53.578

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130004494500

  • Study on CMP polishing characteristic with Ultraviolet light irradiation

    Sumomogi Nobutaka, Kimura Keiichi, Panart Khajornrungruang

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2009 ( 0 )   305 - 306   2009.01

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    DOI: 10.11522/pscjspe.2009A.0.305.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130004659081

  • Study on effects of ultraviolet irradiation in Cu-CMP:Observation and investigation of reactions during ultraviolet irradiation of Cu wafer

    Murali Rao, Sumomogi Nobutaka, Kimura Keiichi, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2009 ( 0 )   1015 - 1016   2009.01

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    DOI: 10.11522/pscjspe.2009S.0.1015.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005029419

  • レーザー回折を用いた工具切れ刃位置のオンマシン計測の研究:2波長レーザによる測定精度向上への試み

    吉廣 俊志, 木村 景一, KHAJORNRUNGRUANG PANART

    精密工学会学術講演会講演論文集 ( 公益社団法人 精密工学会 )   2009 ( 0 )   815 - 816   2009.01

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    近年の工業製品の高度機能化に伴い,工作機械による加工精度のみならず,加工工具そのものの小型化及び高精度化,さらには機上での工具管理が重要な課題となっている.本研究では,レーザの回折現象を用いた非接触かつ高精度な工具測定方法及び小型で機上に搭載できる装置の研究開発を行っている.本稿では,波長の異なる2つのレーザ光を用い,2個の同時測定データから工具位置測定のさらなる高精度化を試みたので報告する.

    DOI: 10.11522/pscjspe.2009S.0.815.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005029877

  • 21107 Study on material removal model in CMP process : 3nd report-Investigation of material removal phenomenon with fine particle in slurry

    Hashiyama Yuuichi, Kimura Keiichi, Khajornrungruang Panart

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2009 ( 0 )   461 - 462   2009.01

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    The material removal phenomenon in CMP process is not clarified yet. Therefore, the appropriate material removal model has not established. In this study, the interaction among wafer surface, polishing pad surface and fine particles in slurry was observed and material removal mechanism was investigated. In this report. the property of SiO_2 film in alkalinity solution was investigated with AFM indentation. In pH8.5 solution. SiO_2 film in KOH solution is softer than SiO_2 film in NH_4OH. In pH10 solution, a property of SiO_2 film in KOH solution is quite simillar to a property of SiO, film in NH_4OH solution. This fact suggests that in pH10 solution SiO_2 film changes soft film, the a chemical reaction layer in KOH solution is the same as a chemical layer solution in NH_4OH.

    DOI: 10.1299/jsmekanto.2009.15.461

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007722430

  • S1303-1-4 On-Machine Tool Measurement Precision Improvement using dual wavelength laser diffraction

    Khajornrungruang Panart, Kimura Keiichi, Yoshihiro Shunji

    The proceedings of the JSME annual meeting ( The Japan Society of Mechanical Engineers )   2009 ( 0 )   273 - 274   2009.01

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    In these days, ultra precision, high complexity and high efficiency of fine-fabrication using cutting tool are required. Not only performance of machine tool but also downsizing of high accurate working tool itself has been an important issue to realize the requirements. In this study, on-machine tool measurement technology using laser diffraction which is able to manage micro tool and able to post in the machine tool has been establishing. In this article, the on-machine tool measurement device applying dual wavelength is developed. We use the developed tool measurement device, installable size for machining center, to evaluate fundamental measurement performance.

    DOI: 10.1299/jsmemecjo.2009.4.0_273

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007861922

  • Study on CMP Micro Patterned Pad Fabricated by MEMS Technology(2nd Report)

    Takahashi Naoaki, Kimura Keiiti, Khajornrungruang Panart, Yasuda Keisuke, Baba Akiyoshi

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2009 ( 0 )   1027 - 1028   2009.01

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    DOI: 10.11522/pscjspe.2009S.0.1027.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005029425

  • H13 Study on observation methods for contact configuration between polishing pad and wafer under wet condition in CMP

    Okamoto Eiichiro, Kimura Keiichi, Khajornrungruang Panart

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2009 ( 0 )   247 - 248   2009.01

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    DOI: 10.1299/jsmekyushu.2009.62.247

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110008011368

  • H12 Study on slurry flow in CMP process for large quadrilateral quartz glass substrate

    Wada Nagisa, Kimura Keiichi, Khajomrungruang Panart

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2009 ( 0 )   245 - 246   2009.01

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    DOI: 10.1299/jsmekyushu.2009.62.245

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110008011367

  • H11 Polishing characteristic on Cu-CMP with Ultraviolet light irradiation

    Sumomogi Nobutaka, Kimura Keiichi, Khajornrungruan Panart, Appalasamy Murari Rao

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2009 ( 0 )   243 - 244   2009.01

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    DOI: 10.1299/jsmekyushu.2009.62.243

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110008011366

  • Mechanical property of copper complexing film and interaction between SiO<sub>2</sub> particle in slurry and the film

    Imamura Akira, Kimura Keiichi, Panart Khajornrungruang, Hashiyama Yuichi, Hiyama Hirokuni, Mochizuki Yoshihiro

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2009 ( 0 )   1021 - 1022   2009.01

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    DOI: 10.11522/pscjspe.2009S.0.1021.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005029422

  • Study on Temperature Rise at Wafer and Polishing pad surfacein Chemical Mechanical Polishing (2nd report)

    Ueno Kazuki, Kimura Keiichi, Khajornrungruang Panart, Koi Yuto

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2009 ( 0 )   1041 - 1042   2009.01

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    DOI: 10.11522/pscjspe.2009S.0.1041.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005029433

  • Cu-CMP with Ultraviolet Light Irradiation in Deionized Water Reviewed

    Panart Khajornrungruang,Keiichi Kimura and Nobutaka Sumomogi

    2008 International Conference on Planarization/CMP Technology (ICPT 2008)   120 - 124   2008.11

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    Language:English   Publishing type:Research paper (scientific journal)

    Taiwan   2008.11.10  -  2008.11.12

  • ヨーロッパ精密工学会 第10回記念国際会議(euspen 2008)報告 Invited Reviewed

    パナート カチョーンルンルアン

    精密工学会誌 = Journal of the Japan Society of Precision Engineering ( 公益社団法人 精密工学会 )   74 ( 8 )   2008.08

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    Authorship:Lead author   Language:Japanese   Publishing type:Article, review, commentary, editorial, etc. (scientific journal)

    DOI: 10.2493/jjspe.74.810

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/10021814486

  • ヨーロッパ精密工学会 第10回記念国際会議(euspen 2008)報告

    パナート カチョーンルンルアン

    精密工学会誌 ( 三美印刷株式会社 )   78 ( 8 )   810   2008.08

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Article, review, commentary, editorial, etc. (scientific journal)

  • On-machine Tool Measurement of Tool Tip Position using Laser Diffraction Reviewed

    Panart Khajornrungruang,Keiichi Kimura

    International Conference of European Society for Precision Engineering and Nanotechnology (euspen2008)   2008.05

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (international conference proceedings)

    Switzerland   2008.05.18  -  2008.05.22

  • Study on material removal model in oxide CMP process

    Hashiyama Yuuichi, Kimura Keiichi, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2008 ( 0 )   851 - 852   2008.01

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    This study is focused on the material removal mechanism in chemical mechanical polishing (CMP) process. The material removal phenomena in CMP process has not been clarified yet. In this study, the interaction among wafer surface, polishing pad surface and fine particles in slurry was observed with AFM and material removal mechanism was investigated. Especially in this paper, we researched about the interaction between the oxide wafer surface and fine particles. The property of SiO2 film in solution and adhesive removal phenomena with a fine particle were investigated with AFM indentation. We propose novel materials removal model based on these experiments.

    DOI: 10.11522/pscjspe.2008A.0.851.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130004658870

  • Ultraviolet Light Irradiation Polishing for Cu-CMP (1st report):Ultraviolet Light Effect in Deionized Water

    Khajornrungruang Panart, Kimura Keiichi, Sumomogi Nobutaka, Mori Chikara

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2008 ( 0 )   835 - 836   2008.01

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    Authorship:Lead author   Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2008A.0.835.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130004658861

  • A study on film formation at Cu wafer surface in chemical solution

    Imamura Akira, Kimura Keiichi, Khajornrungruang Panart, Hashiyama Yuichi, Sumiyoshi Hirohumi, Hiyama Hirokuni, Mochizuki Yoshihiro

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2008 ( 0 )   201 - 202   2008.01

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    Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2008S.0.201.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005028966

  • 21415 A study on material removal model in CMP process : 2nd report-Investigation of material removal phenomenon using AFM

    Hashiyama Yuuichi, Kimura Keiichi, Khajonrungruang Panart

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2008 ( 0 )   409 - 410   2008.01

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    The material removal phenomenon in CMP process is not clarified yet. Therefore, the appropriate material removal model has not established. In this study, the interaction among wafer surface, polishing pad surface and fine particles in slurry was observed and material removal mechanism was investigated. At first, the property of SiO_2 film in solution was investigated with AFM indentation. Next, the AFM tip after indentation was observed with SEM-EDX system. In pH7〜pH 10 solution, SiO_2 film changed to soft material, and small adherent which was SiO_2 was observed in pH7 solution. This fact suggests that fine particles in slurry adhere materials from SiO_2 film with chemical adherent force.

    DOI: 10.1299/jsmekanto.2008.14.409

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007705394

  • On-machine tool measurement of tool tip position using laser diffraction Reviewed

    Khajornrungruang P., Kimura K.

    Proceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008   2   362 - 365   2008.01

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    Authorship:Lead author   Language:English   Publishing type:Research paper (international conference proceedings)

    Scopus

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  • Study on CMP Micro Patterned Pad Fabricated by MEMS Technology (1st Report):Fabrication of Micro Pyramid Pattern Pad

    Takahashi Naoaki, Kimura Keiichi, Khajornrungruan Panart, Yasuda Keisuke, Baba Akiyoshi

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2008 ( 0 )   843 - 844   2008.01

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    Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2008A.0.843.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130004658865

  • K14 Study of Fabricated Micro Pattern Pad using CMP MEMS Technology : Characteristic Evaluation of Micro Pattern Pad Surface

    Takahashi Naoaki, Kimura Keiichi, Panart Khajornrungruan

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2008 ( 0 )   355 - 356   2008.01

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    DOI: 10.1299/jsmekyushu.2008.61.355

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007709388

  • K13 Study on Temperature Change of Wafer and Polishing pad in Chemical Mechanical Polishing

    Ueno Kazuki, Wada Nagisa, Kimura Keiichi, Panart Khajornrungruang

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2008 ( 0 )   353 - 354   2008.01

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    DOI: 10.1299/jsmekyushu.2008.61.353

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007709387

  • K12 Influence on UV irradiation on to single crystal SiC. surface

    Matsumoto Tadashi, Kimura Keiichi, Panart Khajornrungruang

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2008 ( 0 )   351 - 352   2008.01

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    DOI: 10.1299/jsmekyushu.2008.61.351

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007709386

  • K11 Study on UV-Polishing of PCD using ArF Excimer Laser

    Koutake Yoshihiro, Kimura Keiichi, Panart Khajornrungruang

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2008 ( 0 )   349 - 350   2008.01

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    DOI: 10.1299/jsmekyushu.2008.61.349

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007709365

  • Contact between Polishing Pad and Wafer in Chemical Mechanical Polishing.

    Sumomogi Nobutaka, Kimura Keiichi, Khajornrungruang Panart, Ueno Kazuki

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2008 ( 0 )   183 - 184   2008.01

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    Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2008S.0.183.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005028956

  • Study on Temperature rise at Wafer and Polishing pad surface in Chemical Mechanical Polishing (1st report)

    Ueno Kazuki, Kimura Keiichi, Khajornrungruang Panart, Koi Yuto, Wada Nagisa

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2008 ( 0 )   839 - 840   2008.01

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    Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.11522/pscjspe.2008A.0.839.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130004658863

  • A Computational Study on Slurry Flow between a Wafer and CMP Pad with Grooves Reviewed

    Katsuya Nagayama, Hirofumi Morishita, Keiichi Kimura, Kazuhiro Tanaka, Panart Khajornrungruang and Yousuke Inatsu

    TOWARDS SYNTHESIS OF MICRO-/NANO-SYSTEMS   277 - 280   2007.10

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    Language:English   Publishing type:Research paper (scientific journal)

    DOI: 10.1007/1-84628-559-3_47

  • Study on Material Removal Phenomena in CMP Process Reviewed

    2007.10

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    Other Link: http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=5760397

  • 高精度金型加工のためのオンマシンマイクロ工具計測

    パナート・カチョーンルンルアン

    型技術 ( 日刊工業新聞社 )   22 ( 9 )   25 - 29   2007.08

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    Authorship:Corresponding author   Language:Japanese   Publishing type:Article, review, commentary, editorial, etc. (trade magazine, newspaper, online media)

  • Study on Polishing Characteristics in High Temperature Chemical Mechanical Polishing for SiC Ceramics Reviewed

    Panart Khajornrungruang,Hidenori Matano,Tadashi Matsumoto and Keiichi Kimura

    International Journal for Manufacturing Science and Technology   9 ( 1 )   29 - 34   2007.06

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    Authorship:Corresponding author   Language:English   Publishing type:Research paper (scientific journal)

  • Study on Material Removal Phenomena in CMP Process Reviewed

    Keiichi Kimura,Yuichi Hashiyama,Panart Khajornrungruang,Hirokuni Hiyama and Yoshihiro Mochizuki

    2007 International Conference on Planarization/CMP Technology (ICPT 2007)   2007.04

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    ドイツ   2007.04  -  2007.04

  • Development of On-machine Micro Tool Measurement Device using Laser Diffraction

    Khajornrung-ruang Panart, Kimura Keiichi, Miyoshi Takashi, Takaya Yasuhiro, Ueda Masahiro

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2007 ( 0 )   305 - 306   2007.01

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    According to advanced functionality in a wide variety of equipments in these days, ultra precision, high complexity and high efficiency of fine-fabrications are required. Not only performance of machining center but also downsizing of cutting tool and the on-machine tool measurement have been an important issue to realize these fabrications. In this article, on-machine tool measurement technique using laser diffraction, which is applicable for on-machine measurement has been establishing and developing. The developed on-machine measurement device dimension is 150 mm&times;200 mm&times;135 mm, installable into machining center. Next, tool measuring experiments are carried out in order to evaluate tool-measurement performance of the developed device. Experimental results imply the measurement uncertainty(2&sigma;) is less than 100 nm and the tool tip displacement error is less than 200 nm. Hence, it is considered that the measurement precision of the developed on-machine device is sufficient for tool measurement inside the next generation of machining center.

    DOI: 10.11522/pscjspe.2007S.0.305.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005028443

  • 21711 A study on material removal model in CMP process

    Hashiyama Yuuichi, Kimura Keiichi, Khajomrungruang Panart

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2007 ( 0 )   237 - 238   2007.01

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    The material removal mechanism on Chemical Mechanical Polishing is not clarified yet. Accordingly, it is difficult to build up a systematic CMP process simulation system. In order to develop CMP process simulation system, it is necessary to establish "material removal model" among wafer surface, polishing pad surface and fine particles in slurry. In the study, we are proposing material removal model for SiO_2 layer. Chemical adsorption between fine particles and wafer and between fine particles and polishing pad is an important factor for the material removal mechanism.

    DOI: 10.1299/jsmekanto.2007.13.237

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007083467

  • H44 Influence on UV irradiation on to single crystal SiC

    Matsumoto Tadashi, Kimura Keiichi, Khajornrungruang Panart

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2007 ( 0 )   301 - 302   2007.01

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    Language:Japanese   Publishing type:Research paper (other academic)

    DOI: 10.1299/jsmekyushu.2007.60.301

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007113054

  • H43 Study on Ultraviolet irradiation polishing for Cu-CMP

    Kuzuma Hayato, Kimura Keiichi, Khajornrungruang Panart

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2007 ( 0 )   299 - 300   2007.01

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    DOI: 10.1299/jsmekyushu.2007.60.299

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007112972

  • H42 CMPにおけるスラリーフロー可視化に関する研究 : ポリシングパッド溝パターン設計の指針(H4 加工・生産システム4(CMPとその応用))

    稲津 陽介, 木村 景一, カチョーンルンルアン パナート, 松永 健助

    日本機械学会九州支部講演論文集 ( 一般社団法人 日本機械学会 )   2007 ( 0 )   297 - 298   2007.01

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    CMPにおいてポリシングパッド-ウェハ聞のスラリーの迅速な供給・排出およびポリシングパッド-ウェハ間のスラリーの流量分布が研磨特性に重大な影響を与える.ポリシングパッド-ウェハ間のスラリーフローの制御を行うため,ポリシングパッド上に形成する溝パターンの適切な設計方法が重要となる.本報告では同心円状溝パターン,放射状溝パターンの溝寸法を変化させて,ポリシングパッド-石英ガラス問のスラリーフロー可視化実験を行い,パッド溝パターン設計法の指針について考察した.

    DOI: 10.1299/jsmekyushu.2007.60.297

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007112971

  • H41 Fundamental Study on High Temperature Chemical Mechanical Polishing for SiC Ceramics

    MATANO Hidenori, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

    The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers )   2007 ( 0 )   295 - 296   2007.01

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    DOI: 10.1299/jsmekyushu.2007.60.295

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110007112970

  • Study on groove pattern layout for slurry flow control in CMP process Reviewed

    Kimura K., Nagayama K., Morishita H., Inatsu Y., Khajornrungruang P.

    Advanced Metallization Conference (AMC)   2006   571 - 576   2006.12

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    Language:English   Publishing type:Research paper (international conference proceedings)

    Scopus

    Other Link: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=33947218913&origin=inward

  • A lodestar on pad groove pattern design with slurry flow analysis and visualization experiments in CMP process Reviewed

    K. Kimura,K. Nagayama,Y. Inatsu,P. Khajornrungruang

    2006 International Conference on Planarization/CMP Technology (2006 ICPT)   2006.10

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    USA   2006.10.12  -  2006.10.13

  • Study on groove pattern layout for slurry flow control in CMP process Reviewed

    K. Kimura,K. Nagayama,H. Morishita,Y. Inatsu,P. Khajornrungruang

    Advanced Metallization Conference 2006 (ADMETA 2006)   ( CMP 5-16 )   2006.09

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    2006.09.25  -  2006.09.27

  • A Computational Study on Slurry Flow between a Wafer and CMP Pad with Grooves Reviewed

    Katsuya Nagayama,Hirofumi Morishita,Keiichi Kimura,Kazuhiro Tanaka,Panart Khajornrungruang,Yousuke Inatsu

    The 11th International Conference on Precision Engineering (ICPE)   277 - 280   2006.09

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    2006.09.16  -  2006.09.18

  • 小径工具切れ刃プロファイルの光回折オンマシン計測に関する研究(第2報,極小径工具(φ300μm)摩耗の測定評価) Reviewed

    カチョーンルンルアン パナート,三好隆志,木村景一,高谷裕浩,原田孝,砂金総一郎

    日本機械学会論文集(C編)   72 ( 718 )   1730 - 1737   2006.06

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    主要雑誌 代表的研究業績

  • On-Machine Cutting Edge Profile Measurement for Micro Milling Tool (2nd Report, Micro Endmill (.PHI.300.MU.m) Wear Measurement and Evaluation):2nd Report, Micro Endmill (&phi;300&mu;m) Wear Measurement and Evaluation Reviewed

    KHAJORNRUNGRUANG Panart, MIYOSHI Takashi, TAKAYA Yasuhiro, HARADA Takashi, ISAGO Soichiro

    TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C ( The Japan Society of Mechanical Engineers )   72 ( 6 )   1730 - 1737   2006.06

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    The extremely precise level of cutting work's demand has been increasing, recently. Therefore, the establishment of a supreme measurement technology for micro endmills during operating on ultra-precision machining center plays an important role in many micro fabrication industries. The &ldquo;Diffraction Gauge Method&rdquo;, a novel measuring technique based on far-field laser diffraction, has been proposed to measure cutting-edge profiles of micro tools (&phi;<500&mu;m) with repeatability of better than 100 nm even though on-machine surroundings. In this paper, cutting-edge profile measurement of worn micro endmills (&phi;300&mu;m), which operated side-milling on graphite work material, is carried out. Agreement of the measured profiles with SEM image confirms the high accuracy of the measurement technique. Subsequently, the tool wear evaluations in various cutting lengths of micro endmills before and after cutting notify the relationship between increase in tool wears and cutting length. These experimental results verify the validity of our novel micro endmill measurement technique, which can be applied into ultra-precision machining center in the near future.

    DOI: 10.1299/kikaic.72.1730

    Scopus

    CiNii Article

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  • Study on Polishing Characteristics in High Temperature Chemical Mechanical Polishing for SiC Ceramics (Selected paper) Reviewed

    Panart Khajornrungruang,Hidenori Matano,Tadashi Matsumoto and Keiichi Kimura

    2006 International Conference on Micro/Nano Fabrication Technologies   MNPX ( 12 )   1 - 6   2006.05

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    タイ   Bangkok   2006.05.10  -  2006.05.12

  • Study on UV irradiation CMP process

    Kuzuma Hayato, Fukuda Jyunya, Kimura Keiiti, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2006 ( 0 )   523 - 524   2006.01

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    DOI: 10.11522/pscjspe.2006S.0.523.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005027458

  • Micro Endmill Cutting&ndash;edge Profile Measurement for On&ndash;machine Monitoring using Laser Diffraction

    Khajornrungruang Panart, Kimura Keiichi, Miyoshi Takashi, Takaya Yasuhiro

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2006 ( 0 )   1103 - 1104   2006.01

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    Recently, much more micro&ndash;shaped milling work, such as die/mold and parts machining, with supreme precision has been required. Therefore, establishment of the high precision measurement technology for tool cutting&ndash;edge profile during operation is indispensable. The aim of our study is to develop a measurement technique, which is based on the far&ndash;field laser diffraction, in order to evaluate cutting&ndash;edge profiles of micro endmill as sub&ndash;micrometer precision. In addition, the technique is applicable for on&ndash;machine measurement due to simplicity and long working distance of the optical system. In this article, the measurements of poly&ndash;crystalline diamond (PCD) micro endmill diameters are curried out. The measured results show the validity of measurement method and the measurement repeatability.

    DOI: 10.11522/pscjspe.2006S.0.1103.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005027134

  • 20102 An attempt on polishing pad surface modeling in Chemical Mechanical Polishing

    Hashiyama Yuuichi, Kimura Keiichi, Panart Khajomrungruang

    The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers )   2006 ( 0 )   25 - 26   2006.01

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    The material removal mechanism of Chemical Mechanical Polishing has a lot of unidentified aspects which are not yet clarified. Moreover, it is very difficult to build up the systematic simulation system on the mechanism. It is indispensable to model the contact mechanism among abrasive particles, surface of wafer and surface of polishing pad in order to construct a simulation system in CMP. However, the conventional modeling of polishing pad surface is not appropriate for the simulation. In this research, by observing the surface of the polishing pad, a model of the polishing pad surface was proposed. Further, the relationship was considered between the surface structure of polishing pad and material removal mechanism.

    DOI: 10.1299/jsmekanto.2006.12.25

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110006638491

  • Study on Chemical Mechanical Polishing for SiC Ceramics

    Matano Hidenori, Kimura Keiiti, Khajornrungruang Panart, Matumoto Tadashi

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2006 ( 0 )   559 - 560   2006.01

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    DOI: 10.11522/pscjspe.2006S.0.559.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005027478

  • Study on slurry flow visualization in CMP process

    Inatu Yousuke, Koutake Yoshihiro, Kimura Keiiti, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2006 ( 0 )   537 - 538   2006.01

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    DOI: 10.11522/pscjspe.2006S.0.537.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130005027466

  • 316 Development of On-machine Micro Tool Measurement Device using Laser Diffraction : Fundamental Characteristics of Measurement Device

    KHAJORNRUNGRUANG Panart, Kimura Keiichi, MIYOSHI Takashi, TAKAYA Yasuhiro, Ueda Masahiro

    The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers )   2006 ( 0 )   131 - 132   2006.01

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    According to advanced functionality in a wide variety of equipments in these days, ultra precision, high complexity and high efficiency of fine-fabrication is required. Not only performance of machine tool but also downsizing of high accurate working tool itself has been an important issue to realize above conditions. In this study, on-machine tool measurement technology using laser diffraction which is able to manage micro tool and able to post in the machine tool has been establishing. In this article, the on-machine tool measurement device is developed. The developed on-machine device is carried out a response measurement experiment of hundreds nano-displacement using piezo stage then the fundamental characteristics of the developed measurement device is verified.

    DOI: 10.1299/jsmemmt.2006.6.131

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110006638933

  • On-machine tool measurement for cutting-edge profile of micro endmill using laser diffraction Reviewed

    Khajornrungruang P., Miyoshi T., Takaya Y., Harada T., Isago S.

    LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century   351 - 356   2005.12

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    Authorship:Lead author   Language:English   Publishing type:Research paper (international conference proceedings)

    Scopus

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  • On-Machine Tool Measurement for Cutting-Edge Profile of Micro Endmill using Laser Diffraction Reviewed

    P. Khajornrungruang,T. Miyoshi,Y. Takaya,T. Harada and S. Isago

    Proceedings of International Conference on Leading Edge Manufacturing in 21st Century (LEM21)   ( 05-204 )   351 - 356   2005.10

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    日本   Nagoya   2005.10.19  -  2005.10.22

  • 2624 3D Cutting edge profile measurement of micro endmill by means of laser diffraction gauge method

    TAKAYA Yasuhiro, KHAJORNRUNGRUANG Panart, HAYASHI Terutake, MIYOSHI Takashi

    The proceedings of the JSME annual meeting ( The Japan Society of Mechanical Engineers )   2005 ( 0 )   85 - 86   2005.01

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    The aim of this study is to develop a new measuring technique bsed on laser diffraction such as Fraunhofer diffraction theory which is called the diffraction gauge method. This method makes it possible to evaluate a three-dimensional cutting-edge profile of a micro-endmill with precision of better than 100nm even though on-machine measurement. The measurement resolution was experimentally achived to be 15nm for a helical endmill and repeatability of ±50nm with valid accuracy for new tool. In this paper, in order to verify that the diffraction gauge method is of practical use such as on-machine measurement, the three-dimensional cutting edge profile measurements of a worn tool with the diameter of 0.3mm, which has performed side milling on graphite with 40000 rpm rotational speed, is discussed. The experimantal results show that the diffraction gauge method has enough high performance to be able to evaluate wear quantity of a worn micro endmill.

    DOI: 10.1299/jsmemecjo.2005.4.0_85

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/110006190914

  • Study on chemical mechanical polishing for SiC ceramics

    Kimura Keiichi, Kahjornrungruang Panart, Matano Hidenori, Matsumoto Tadashi

    Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering )   2005 ( 0 )   335 - 336   2005.01

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    SiC ceramics have broad application area due to its high temperarture strength, high heat conductivity and chemical stability. Recently, not only sintered but single crystal SiC are developed and it is expected the application for glass lens mold die material and semicondictor base plate. For the applications, it is required to develop important technology for obtaining defect free surfaces and reasonable cost for finishing. CMP process, as forming chemical reaction layer on material surface and remove, is considered to fulfill the requirements. In the report, polishing in high temperature is tried on SiC polishing to achieve the requirements.

    DOI: 10.11522/pscjspe.2005A.0.335.0

    CiNii Article

    Other Link: https://ci.nii.ac.jp/naid/130004656915

  • 小径工具切れ刃プロファイルの光回折オンマシン計測に関する研究(第1報,光回折ゲージ法の提案とその検証実験) Reviewed

    Panart KHAJORNRUNGRUANG、三好隆志、高谷裕浩、原田孝、砂金総一郎

    日本機械学会論文集(C編)   70 ( 700 )   3556 - 3563   2004.12

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    Language:Japanese   Publishing type:Research paper (scientific journal)

  • On-machine cutting edge profile measurement for micro milling tool (1st report, laser diffraction gauge method and its verifications) Reviewed

    Khajornrungruang P., Miyoshi T., Takaya Y., Harada T., Isago S.

    Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C   70 ( 12 )   3556 - 3563   2004.12

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    Authorship:Lead author   Language:English   Publishing type:Research paper (scientific journal)

    A new optical measuring method of cutting edge profiles with a few nanometerresolutions for micro milling tool is proposed. The edge profile is scaled by the width between the first order maxima in a diffraction pattern, which relates to the spacing of a slit-type aperture formed between a reference knife-edge and a tool cutting-edge. The technique is applicable for on-machine measurement due to simplicity and long working distance of the optical system. In this paper, first, the theoretical analysis reveals the measurement resolution, and then the proposal of laser diffraction gauge method is mentioned. Next, the calibratability and the practicability of our technique are affirmed with fundamental experiments. Furthermore, experimental verifications are carried out for commercial tools such as straight-flute and helical-flute of micro endmills. Subsequently, excellent agreement of the profiles, which are measured with our developed experimental systems, with an image from scanning ion microscope verifies that the proposed method is efficient to accurately measure cutting-edge profiles.

    DOI: 10.1299/kikaic.70.3556

    Scopus

    Other Link: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=15544383092&origin=inward

  • 光回折ゲージ法による小径工具切れ刃プロファイル計測に関する研究

    高谷裕浩、K. パナート、三好隆志、河兌坪、原田孝、砂金総一郎

    型技術   19 ( 8 )   120 - 121   2004.07

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  • Laser diffraction edge profile method of micro cutting tool for on-machine measurement Reviewed

    Panart Khajornrungruang,Takashi Miyoshi,Yasuhiro Takaya,Satoru Takahashi,Takashi Harada and Soichiro Isago

    113 - 118   2003.11

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    日本   Niigata   2003.11  -  2003.11

  • Novel edge profile measurement of micro cutting tool by laser diffraction Reviewed

    Panart Khajornrungruang,Takashi Miyoshi,Yasuhiro Takaya,Satoru Takahashi,Takashi Harada and Soichiro Isago

    Proceedings of the 4th European Society for Precision Engineering and Nanotechnology (euspen) International Topical Conference   463 - 466   2003.05

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    Language:English   Publishing type:Research paper (international conference proceedings)

    Germany   2003.05  -  2003.05

  • レーザ回折法による小径工具切れ刃先端の3次元プロファイル計測

    高谷裕浩、K. パナート、三好隆志、高橋哲、原田孝、砂金総一郎

    型技術   17 ( 8 )   106 - 107   2002.07

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    代表的研究業績

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Publications (Books)

  • 半導体製造プロセスを支える洗浄・クリーン化・汚染制御技術

    羽深等、清家善之、白水好美、有馬健太、カチョーンルンルアン パナート、岩本花子、前田主悦、山崎克弘、向井義雄、長谷川浩史、松井淳、金洪杰(Joint author ,  第4章2節 エバネッセント光によるウェット条件下でのナノスケール現象の可視化技術と半導体洗浄プロセスへの応用)

    サイエンス&テクノロジー  2022.11  ( ISBN:978-4864282949

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    Total pages:123   Language:Japanese

Conference Prsentations (Oral, Poster)

  • 層間絶縁膜CMPプロセスにおけるスラリー中の微粒子の挙動観察

    出井良和

    2009年度 日本機械学会九州支部第63期総会・講演会  日本機械学会

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    Event date: 2010.03.15   Language:Japanese  

  • Dynamical Observation of Slurry Fine Particle in CMP Process

    Proceedings of JSPE Kyushu Region Conference 2009 

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    Event date: 2009.12.12 - 2009.12.13   Language:Japanese  

  • Proposal of Optical Measurement Method for 3D Single Nanoparticle Position Near a Surface

    Panart Khajornrungruang

    the 21th International Symposium on Chemical-Mechanical Planarization  Clarkson University and NYSTAR

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    Event date: 2017.08.13 - 2018.08.16   Language:English  

  • 水酸化フラーレン含有加工液を用いた紫外光照射CMPに関する研究

    李木宣孝

    2009年度精密工学会九州支部地方講演会 

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    Event date: 2009.12   Language:Japanese  

  • Observation role of fine particles in dielectric material CMP applying evanescent field

    Panart Khajornrungruang

    Center for Advanced Materials Processing's Annual Technical Meeting 2013  Clarkson University, NYSTAR

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    Event date: 2013.05.15 - 2013.05.17   Language:English  

  • Characteristic Evaluation of Scattering Light from Cutting edge in Evanescent Field by Using Numerical Simulation Method

    Aramaki Hirochika, Khajornrungruang Panart, Suzuki Keisuke, Taira Kanako

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2019.01   Language:Japanese  

    CiNii Article

  • ナノスケールにおける加工現象可視化に関する研究:第5報:標準粒子の三次元挙動観測の試み

    ブラッドラー アラン, カチョーンルンルアン パナート, 鈴木 恵友, パームパッデーチャークン ティティパッド

    精密工学会学術講演会講演論文集 

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    Event date: 2019.01   Language:English  

    <p>The nanoparticle is popularly used for chemical mechanical polishing process (CMP) in semiconductor industry. There are many unknown phenomena in nanoparticles moving during polishing process. Therefore, we have been studying the phenomena by using optical method on 3D position tracking of nanoparticle in real-time measurement. In this report, the gold 50 nm standard particles would be observed to determine the 3D motion tracking of individual nanoparticle. According to our previous studies, the single wavelength of evanescent light field is hard to determine the 3D spatial position of each nanoparticle. Thus, the multi-wavelength of scattering light is applied in the experiment. The scattering light will occur when the particle moving near to the reference surface. Finally, the 3D position tracking results of standard nanoparticle will be investigated and discussed by the exponential relationships between the detected scattering light and the measured depth Z values.</p>

    CiNii Article

  • Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:Identification of Nano-particles during PVA brush Scrubbing

    Terayama Yutaka, Kusatsu Kohei, Morita Rintaro, Khajornrungruang Panart, Wada Yutaka, Hamada Satomi, Hiyama Hirokuni

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2019.01   Language:Japanese  

    CiNii Article

  • Study on the Optimization of Hybrid fine particles on Chemical Mechanical Polishing of Hard to process materials:Chemical reactivity and Mechanical action

    Suzuki Keisuke, Bun-Athuek Natthaphon, Takazaki Hiroko, Yasunaga Takuo, Yoshimoto Yutaka, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Study on hybrid fine particles with nano particles for hard to process materials

    UEDA Tatsunori, SAKAI Koya, YOSHIMOTO Hiroshi, BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUANG PANART, SUZUKI Keisuke

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Observation of Nano-particle Adhesion and Desorption Phenomenon Near to Silicon Nitride and Oxide Film Surface in an Evanescent Field

    TERAYAMA Yutaka, NAKANO Asato, Khajornrungruang Panart, SUZUKI Keisuke, WADA Yutaka, HAMADA Satomi

    The Proceedings of Conference of Kanto Branch 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Study on fabrication method of low refractive transparent pad by thermal transfer

    Kato Yuya, Suzuki Keisuke, Khajornrungruang Panart, Yamaguchi Yuta, Tsai Yueh-Hsun

    The Proceedings of The Manufacturing & Machine Tool Conference 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Study on polishing processing using Superconductive Assisted Machining method(SUAM):~Using free abrasive grains~

    TANAKA Yuki, NAKASHIMA Hidetaka, ONOMATA Misaki, Khajornrungruang P, OTABE Soji, SUZUKI Keisuke

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Accurate measurement of flow rate of continuous fluid

    Takeuchi Ryosuke, Takaichi Shunsuke, Murakami Sunao, Ito Takahiro, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale-4th: Estimation of longitudinal Resolution

    Shirakawa Hiroaki, Blatter Aran, Takemoto Ryo, Khajornrungruang Panart, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Study of Electroosmotic Micro-Flow Enhanced Abrasives Distribution in Nanoparticle Contained Slurry for Copper Chemical Mechanical Planarization

    蔡 岳勳, 鈴木 恵友, 陳 彰, Khajornrungruang Panart

    精密工学会学術講演会講演論文集 

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    Event date: 2018.01   Language:English  

    <p>Chemical mechanical planarization is one of the crucial steps for the manufacturing process of semiconductor. CMP process with good adaptability can lead to high productivity, low defect, and coping with the ever-changing materials. In CMP process, slurry plays a big role in material removal. Among the composition of slurry, the abrasive predominates in the removal rate and surface quality. Therefore, this study develops the application of water-soluble nanoparticles, such as fullerene, as abrasives for the copper CMP process. By electroosmotic phenomenon, a kind of electro kinetic force, it generates the micro-flow field for abrasive during CMP process. The increasing disturbance of flow enhances the uniformity of abrasive distribution and polishing efficiency. The electrode embedded polishing platen which causes the electroosmotic flow on polishing pad is revealed and simulated by multi-physics fields coupling software, COMSOL Multiphysics. Finally, comparing with the results of simulation and flow visualization with fluorescent powders, the optimal and reasonable design is discussed.</p>

    CiNii Article

  • Study on the nano combined fine particles in the CMP

    SAKAI Koya, UEDA Tatsunori, YOSHIMOTO Hiroshi, SUZUKI Keisuke, BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUANG PANART

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • Visualization of Slurry Flow between Polishing Pad and Wafer in CMP (4th Report):Difference due to pad conditioning conditions

    Fukuda Akira, Sekiduka Noriaki, Yamamoto Hiroki, Suzuki Keisuke, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2018.01   Language:Japanese  

    CiNii Article

  • ナノスケールにおける加工現象可視化に関する研究

    白川 裕晃, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 

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    Event date: 2017.01   Language:Japanese  

    ナノスケールにおける加工現象として,ナノ粒子を用いたポリシング加工がある.本研究は,ポリシング加工のナノ粒子の挙動を観察し,ナノ粒子による加工現象を解明することを目的とする.そこで本研究では,表面上近傍に局在するエバネッセント光を用いた実時間観測を行っている.既知のナノ単粒子に多波長エバネッセント光を当て,その散乱光の強度を調べたので,ここに報告する.

    CiNii Article

  • Non-contact Micro Tool Tip Position Detection Method by Evanescent Light Field

    Khajornrungruang PANART, INOUE Tomoki, SUZUKI Keisuke

    The Proceedings of Mechanical Engineering Congress, Japan 

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    Event date: 2017.01   Language:Japanese  

    CiNii Article

  • Study on processing technology using magnetic levitation tool by superconducting

    Tanaka Yuki, Suzuki Keisuke, Khajornrungruang Panart, Otabe Soji, Nakashima Hidetaka

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2017.01   Language:Japanese  

    CiNii Article

  • 低屈折率の透明樹脂パッドを用いたCMPにおけるモニタリング技術に関する研究

    鬼木 喬玄, 鈴木 恵友, カチョーンルンルアン パナート

    精密工学会学術講演会講演論文集 

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    Event date: 2017.01   Language:Japanese  

    水と同等の屈折率を有する透明な樹脂パッドを用いて、スラリー中の微粒子観察やシリコン酸化膜の膜測など、CMPにおけるモニタリング技術に関する研究を行っている。今回は低屈折率の透明樹脂パッドを用いたモニタリング技術のコンセプトと、その足がかりとなる実験データについて報告する。

    CiNii Article

  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale:the apparatus development

    Khajornrungruang Panart, Shirakawa Hiroaki, Suzuki Keisuke, Sakai Koya

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2016.01   Language:Japanese  

    CiNii Article

  • ポリシング前後におけるスラリー中の研磨微粒子径に関する研究

    永井 利幸, 八尋 新, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 

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    Event date: 2016.01   Language:Japanese  

    CMPでは,複数の加工材料に対して最適なスラリーやポリシングパッドを適用させる必要がある.これらの部材を最適化するためには,材料除去メカニズムに基づき,スラリー中微粒子の種類や微粒子径,材質,薬液を選定することが重要である.そこで本研究では,サファイア,SiO2などの複数の基板に対して動的光散乱法(DLS)を用いて微粒子径の変化について評価したので報告する.

    CiNii Article

  • Study on fine particles observation using Transparency micro-patterned pad during CMP

    ONIKI Takahiro, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart

    The Proceedings of Mechanical Engineering Congress, Japan 

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    Event date: 2016.01   Language:Japanese  

    CiNii Article

  • 超伝導バルクを利用した磁気浮上工具による中空加工技術に関する研究

    日高 裕, 上原 和晃, カチョーンルンルアン パナート, 小田部 荘司, 鈴木 恵友

    精密工学会学術講演会講演論文集 

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    Event date: 2016.01   Language:Japanese  

    本研究では超電導現象である磁気浮上を利用し、金型や3Dプリンタなどの中空部品成形技術が抱える問題を解消する新規中空加工技術の確立を目指している。その概要としては、磁気浮上を利用して磁性体や超伝導体を一定間隔離して浮上させトラップし、さらに回転運動を加え回転工具とすることで被加工物を切削する技術である。本報では樹脂などを用いて本加工技術の原理検証を行ったので、その内容について報告する。

    CiNii Article

  • Imaging of Siver Nanoparticles and Ribbons by Evanescent Wave Scattering

    Angshuman Pal

    Center for Advanced Materials Processing's Annual Technical Meeting 2015  Clarkson University, NYSTAR

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    Event date: 2015.05.20 - 2015.05.22   Language:English  

  • 10106 Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform

    TAJIRI Takahiro, SUZUKI Keisuke, Khajornrungruang Panart, MATSUO Hisanori

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    Event date: 2015.03.20   Language:Japanese  

    CiNii Article

  • Observation of the fine particles with the hydroxylated fullerene during CMP

    Murakawa Wataru, Oniki Takahiro, Khajornrungruang Panart, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2015.01   Language:Japanese  

    CiNii Article

  • Study on material removal phenomena during CMP:Behavior of the fine particles using transparency pad

    Oniki Takahiro, Suzuki Keisuke, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2015.01   Language:Japanese  

    CiNii Article

  • Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale: the apparatus development

    Khajornrungruang Panart, Babu Suryadevara, Kimura Keiichi, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2015.01   Language:Japanese  

    CiNii Article

  • 822 Improvement of tool measurement precision with optical diffraction method by a shaped laser beam

    YU Jojima, KEISUKE Suzuki, KHAJORNGRUANG Panart

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2015.01   Language:Japanese  

    CiNii Article

  • 826 Phenomenon analysis of polishing processing by nanoparticles observation using evanescent light

    IMAI Yuta, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2015.01   Language:Japanese  

    CiNii Article

  • 824 Study on magnetic field assisted machining technology using superconducting grains.

    Hidaka Yutaka, Suzuki Keisuke, Soejima Kazuki, Panart Khajornrungruang, Matsuda Masakazu, Otabe Edmund Soji

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2015.01   Language:Japanese  

    CiNii Article

  • 823 Study on Modeling of CMP Material Removal

    YAHIRO Shin, NAGAI Toshiyuki, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2015.01   Language:Japanese  

    CiNii Article

  • Gap Measurement Between Substrate and Polishing Pad

    Panart Khajornrungruang

    the 19th International Symposium on Chemical-Mechanical Planarization  Clarkson University and NYSTAR

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    Event date: 2014.08.10 - 2014.08.13   Language:English  

  • C30 Study on the material removal mechanism during chemical mechanical polishing

    Nagai Toshiyuki, Yahiro Shin, KHAJORNRUNGRUANG Panart, Suzuki Keisuke

    The Proceedings of The Manufacturing & Machine Tool Conference 

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    Event date: 2014.01   Language:Japanese  

    CiNii Article

  • Study on polishing methods for the hard-to-work material using unconventional nano carbon particle

    Murakawa Wataru, Suzuki Keisuke, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2014.01   Language:Japanese  

    CiNii Article

  • Study on material removal mechanism for SiO<sub>2</sub>-CMP

    Takano Yuichi, Fukuda Kosuke, Khajornrungruang Panart, Kimura Keiichi, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2014.01   Language:Japanese  

    CiNii Article

  • C31 Study on the functional fine particles with the fullerenol molecules for sapphire CMP

    Murakawa Wataru, Oisi Takahumi, Khajornrungruang Panart, Suzuki Keisuke

    The Proceedings of The Manufacturing & Machine Tool Conference 

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    Event date: 2014.01   Language:Japanese  

    CiNii Article

  • Nano-Sized Particle Identification using Evanescent Field

    Panart Khajornrungruang

    Center for Advanced Materials Processing's Fall Meeting 2013  Clarkson University

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    Event date: 2013.10.14 - 2013.10.15   Language:English  

  • Study on CMP Micro Patterned pad Fabricated by MEMS Technology:Fabrication of Micro Patterned Pad using Ni plated mold

    Isono Shintaro, Suzuki Keisuke, Ito Takahiro, Khajornrungruang Panart, Urabe Masakazu, Kimura Keiichi, Tashiro Yasunori, Oniki Takahiro

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2013.01   Language:Japanese  

    CiNii Article

  • 1001 Study on the efficiency of the SiO2-CMP using microbubble

    Nagaoka Atsushi, Panart Khajornrungruang, Kimura Keiichi, Suzuki Keisuke

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2013.01   Language:Japanese  

    CiNii Article

  • 水酸化フラーレンを利用したサファイアCMP高効率研磨手法に関する研究

    河北 誠也, 山城 天心, 木村 景一, カチョーンルンルアン パナート, 鈴木 恵友

    精密工学会学術講演会講演論文集 

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    Event date: 2013.01   Language:Japanese  

    サファイアCMPプロセスは,耐薬品性,耐摩耗性に優れておりポリシングレートが低いため,長時間必要となる.これまでサファイア基板のポリシング高効率化としては,シリカスラリーに水酸化フラーレンを混合する手法が報告されている.しかしながら,ここでは加工条件について最適化されていない.そこで本研究では,ポリシングパッドの最適化により表面粗さの改善と高効率研磨を試みたので報告する.

    CiNii Article

  • Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform (4th report)

    Kushida Takashi, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke, Tajiri Takahiro

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2013.01   Language:Japanese  

    CiNii Article

  • Study on Variable Rotation Polishing in CMP Process (1st report)

    Phaisalpanumas Pipat, Keiichi Kimura, Keisuke Suzuki, Khajornrungruang Panart

    精密工学会学術講演会講演論文集 

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    Event date: 2013.01   Language:English  

    In this study, a novel Variable Rotation Polishing method would be proposed in order to increase the unsteady slurry flow in CMP process for increasing the polishing efficiency and for flowing slurry into the center of wafer sufficiently when the wafer becomes larger and also in case of saving the slurry. We developed a control unit to control platen variable rotation speed and rotation direction and rotation angle. This paper investigates the efficiency of variable rotation in CMP process. Consequently, material removals of all conditions in case of Variable Rotation Polishing were higher than only forward rotation.

    CiNii Article

  • Study on material removal mechanism for SiO<sub>2</sub>-CMP

    Takano Yuichi, Suzuki Keisuke, Panart Khajornrungruang, Kimura Keiichi

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2013.01   Language:Japanese  

    CiNii Article

  • 21211 Study on mechanism of polishing pad surface dressing

    KOREZAWA Tatsuya, KIMURA Keichi, SUZUKI Keisuke, Panart KHJAOMNRUNGRUANG, HIYAMA Hirokuni, MATSUO Hisanori

    The Proceedings of Conference of Kanto Branch 

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    Event date: 2013.01   Language:Japanese  

    CiNii Article

  • 21210 Study on slurry degradation factors during Cu-CMP

    FUKAGAWA Hironobu, SUZUKI Keisuke, KIMURA Kenchi, Kajornrungraung Panart, HIYAMA Hirokuni

    The Proceedings of Conference of Kanto Branch 

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    Event date: 2013.01   Language:Japanese  

    CiNii Article

  • 水酸化フラーレ ン混合スラリー によるサファイ アCMPに関する研究̶材料除去メカニズムの検討̶

    齊藤貴志

    2012年度精密工学会全国春季大会 

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    Event date: 2012.03   Language:Japanese  

  • Study on measurement of micro tool using of laser light

    Yashima Hirokazu, Kimura Keiichi, Panart Khajornrungruang, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2012.01   Language:Japanese  

    CiNii Article

  • 1721 Observation and analysis on dynamic behavior between a wafer and a polishing pad

    KIMURA Keiichi, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke, YAMANE Yasushi

    The Proceedings of Conference of Kanto Branch 

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    Event date: 2012.01   Language:Japanese  

    CiNii Article

  • Study on phenomenon on polishing surface in Oxide-CMP applying Evanescent field

    Idei Yoshikazu, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke, Sakoda Suguru

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2012.01   Language:Japanese  

    CiNii Article

  • Study on Sapphire CMP slurries using fullerenol as fine particles

    Saito Takashi, Suzuki Keisuke, Panart Khajornrungruang, Karasudani Erika, Kimura Keiichi

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2012.01   Language:Japanese  

    CiNii Article

  • Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform (2nd report)

    Kushida Takashi, Kimura Keiichi, Panart Khajornrungruang, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2012.01   Language:Japanese  

    CiNii Article

  • 光学的フーリエ変換に基づくCMP用ポリシングパッドの表面形状評価に関する研究(第三報)

    櫛田 高志, 木村 景一, カチョーンルンルアン パナート, 鈴木 恵友, 田尻 貴寛

    精密工学会学術講演会講演論文集 

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    Event date: 2012.01   Language:Japanese  

    CMPプロセスではポリシングの進行に伴いポリシングパッド表面が劣化し加工性能が低下することが問題視されている.しかしポリシングパッドの表面形状は複雑かつ微細な凹凸が混在しているため有効な表面形状の評価法は確立されていない.そこで我々はポリシングパッド表面形状評価法として,光学的フーリエ変換に基づいた手法を提案している.本報告では撮像素子を大型化して測定空間波長領域を拡大したので、実験的に検証を行った.

    CiNii Article

  • Study on material removal mechanism for SiO<sub>2</sub>-CMP

    Takano Yuichi, Suzuki Keisuke, Khajornrungruang Panart, Kimura Keiichi

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2012.01   Language:Japanese  

    CiNii Article

  • CMP用マイクロパターンパッドの開発

    磯野 慎太郎, 木村 景一, 鈴木 恵友, カチョーンルンルアン パナート, 占部 正和

    精密工学会学術講演会講演論文集 

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    Event date: 2012.01   Language:Japanese  

    CMPで使用されているポリシングパッドの表面形状は,研磨能力を決定する重要な要素である.そこで,ポリシングパッド表面上に任意の形状とパターンを形成したマイクロパターンパッドを製作し,研磨実験を行うことで研磨性能との関係性を明らかにする.その結果をもとに,より研磨性能の優れたマイクロパターンパッドの開発を行う.本稿では研磨に適用可能なサイズのマイクロパターンパッドを製作したので報告する.

    CiNii Article

  • CMPにおけるポリシング界面の摩擦およびスラリー流れの現象解析

    由井 隆司, 木村 景一, 鈴木 恵友, パナート カチョーンルンルアン, 有本 翔太

    精密工学会学術講演会講演論文集 

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    Event date: 2012.01   Language:Japanese  

    現在CMPは、プレストンの経験則に従って研磨条件を設定している。CMPにおけるポリシング界面には、ウェハ‐ポリシングパッド間の摩擦、ウェハ面下のスラリー流れ、被研磨面に発生する熱など未解明な現象が多く存在している。これら現象を体系的に解析し、研磨条件を最適化する必要がある。そこで本研究では、ポリシング界面の摩擦およびスラリー流れの現象解析を行ったので報告する。

    CiNii Article

  • 904 Study on method for analyzing of polishing pad surface based on light diffraction pattern

    Takahashi Suguru, Panart Khajornrungruang, Kimura Keiichi, Suzuki Keisuke

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2012.01   Language:Japanese  

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  • 903 Study on relationship between change of slurry component and polishing rate in Cu CMP

    Fukagawa Hironobu, Suzuki Keisuke, Kimura Keiichi, Panart Khajornrungruang, Fukuda Akira, Wada Yutaka, Hiyama Hirokuni, Fukunaga Akira

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2012.01   Language:Japanese  

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  • 608 Study on Variable Rotation Polishing in CMP Process

    Pipat PHAISALPANUMAS, KIMURA Keiichi, SUZUKI Keisuke, Panart KHAJORNRUNGRUANG

    日本機械学会九州支部講演論文集 

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    Event date: 2012.01   Language:English  

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  • 606 Study on dressing mechanism R)r the polishing pad surface

    KOREZAWA Tatsuya, Kimura Keiichi, Suzuki Keisuke, Panart Khajornrungruang, Matsuo Hisanori, wada Yutaka, Hiyama Hirokuni, Fukunaga Akira

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2012.01   Language:Japanese  

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  • 1722 Study on material removal mechanism in SiO_2-CMP : Adsorption characteristics of abrasive particles in SiO_2-CMP

    TANAKA Akiho, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart, TAKANO Yuichi, KIMURA Keiichi

    The Proceedings of Conference of Kanto Branch 

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    Event date: 2012.01   Language:Japanese  

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  • Correlation Between Spatial Fourier Transformed Topography of Polishing Pad Surface and Its Material Removal Rate

    Panart Khajornrugnruang

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • Effect of Fullerenol as Fine Particles in Sapphire CMP Slurry

    Takashi Saito

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • Study on The Measurement of Slurry Layer Thickness using Laser Diode

    Yasushi Yamane

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • Study on Behavior of Fine Particles on Polishing Surface in SiO2 CMP

    Yoshikazu Idei

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • Study on The Material Removal Mechanism of SiO2-CMP

    Akiho Tanaka

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • Investigation on Relationship Between Friction and Polishing Rate with In-situ Dressing

    Ryuji Yui

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • Study on Evaluation Method for Surface Topography of Polishing Pad Based on Optical Fourier Transform

    Takashi Kushida

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • Measurements of Slurry Film Thickness during CMP

    HIronobu Fukagawa

    ICPT 2011 

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    Event date: 2011.11   Language:English  

  • サファイア CMP における水酸化 フラーレン混合 スラリーに関する研究 ̶コロイタルシリカスラリーをヘースとした研磨特性の検証

    齊藤貴志

    2011年度精密工学会全国秋季大会 

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    Event date: 2011.09   Language:Japanese  

  • エハネッセントを応用したSiO2 膜CMPにおける研磨微粒子の挙動に関する研究

    出井良和

    2011年度精密工学会全国秋季大会 

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    Event date: 2011.09   Language:Japanese  

  • 光学的フーリエ変換に基ついたCMP用ホリシンクハットの表面形状評価に関する研究

    櫛田高志

    2011年度精密工学会全国秋季大会 

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    Event date: 2011.09   Language:Japanese  

  • 摩擦力評価法によるCMP性能に関する研究

    鈴木恵友

    2011年砥粒加工学会学術講演会(ABTEC2011) 

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    Event date: 2011.09   Language:Japanese  

  • ポリシングパッド表面トポグラフィーの空間的FFT解析

    カチョーンルンルアン パナート

    2011年砥粒加工学会学術講演会(ABTEC2011) 

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    Event date: 2011.09   Language:Japanese  

  • Performance of Water-Soluble Fullerenol as Novel Functional Fine Particles for Polishing Nanosurfaces

    Keisuke Suzuki

    The 16th International Symposium on Chemical-Mechanical Planarization (CAMP) 

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    Event date: 2011.08   Language:English  

  • 7. MEMS技術を応用したCMP用マイクロハターンハットの研究 ̶PEEK材を使用した耐摩耗性パットの評価

    安田佳祐

    2011年度精密工学会全国春季大会 

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    Event date: 2011.03   Language:Japanese  

  • FFT解析に基ついたホリシンクハットの表面形状評価とその研 磨性能に関する研究

    奥園貴久

    2011年度精密工学会全国春季大会 

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    Event date: 2011.03   Language:Japanese  

  • K42 Study on thickness measurement method of slurry layer betWeen Polishing pad and wafer in CMP process

    YAMANE Yasushi, Kimura Keiichi, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2011.01   Language:Japanese  

    CiNii Article

  • K24 Study on friction between wafer and polishing pad in CMP process

    Yui Ryuji, Kimura Keiichi, Suzuki Keisuke, Khajornrungruang Panart

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2011.01   Language:Japanese  

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  • 220402 Observation of fine particles motion during CMP process by evanescent field

    IDEI Yoshikazu, KIMURA Keiichi, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart, Johyama Jyunki

    The Proceedings of Conference of Kanto Branch 

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    Event date: 2011.01   Language:Japanese  

    CiNii Article

  • Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform

    Kushida Takashi, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2011.01   Language:Japanese  

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  • Study on Sapphire CMP slurries using fullerenol as fine particles

    Saito Takashi, Suzuki Keisuke, Panart Khajornrungruang, Karasudani Erika, Kimura Keiichi

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2011.01   Language:Japanese  

    CiNii Article

  • Study on fine particle behavior in SiO<sub>2</sub> film CMP using evanescent field

    Idei Yoshikazu, Kimura Keiichi, Suzuki Keisuke, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2011.01   Language:Japanese  

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  • MEMS技術を応用したCMP用マイクロパターンパッドの研究

    安田 佳祐, 木村 景一, 鈴木 恵友, カチョーンルンルアン パナート, 磯野 慎太郎

    精密工学会学術講演会講演論文集 

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    Event date: 2011.01   Language:Japanese  

    CMP技術に使用されるポリシングパッドの表面形状はコンディショニングによりランダムで複雑であり,その表面形状が研磨に及ぼす影響は未だ解明されていない.そこでマイクロメートルオーダーの表面形状を設計したポリシングパッドを製作し,研磨を行うことで最適な表面形状を追求する.本研究では設計した表面形状を研磨中より長く保つ必要がある.そこで本報告ではPEEK材を用い,耐摩耗性の向上を図る.

    CiNii Article

  • K44 Study on Material removal mechanism in CMP using Atomic Force Microscope

    TANAKA Akiho, KIMURA Keiichi, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart, TAKAHASHI Suguru

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2011.01   Language:Japanese  

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  • K22 Study on Al203-CMP using mixed fullerene hydroxide slurry

    Saito Takashi, Kimura Keiichi, Suzuki Keisuke, Khajornrungruang Panart

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2011.01   Language:Japanese  

    CiNii Article

  • Evaluation of Conditioned Polishing Pad Surface Topography based on Fourier Transform Analysis and its Polishing Characteristic

    Okuzono Takahisa, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke, Kushida Takashi

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2011.01   Language:Japanese  

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  • FFTを用いた研磨パッドの表面トポグラフィー解析

    カチョーンルンルアン パナート

    可視化情報学会全国講演会 

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    Event date: 2010.10   Language:Japanese  

  • CMPプロセス中のウェハ面内における温度測定およびスラリー流れの可視化

    由井隆司

    可視化情報学会全国講演会 

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    Event date: 2010.10   Language:Japanese  

  • SiO2系膜のCMPにおける材料除去メカニスムの研究―第1報スラリー中のSiO2微粒子の材料除去作用―

    木村景一

    2010年度精密工学会全国秋季大会 

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    Event date: 2010.09   Language:Japanese  

  • レーザ回折光による高速回転中の工具先端と被加工物間の距離計測

    カチョーンルンルアン パナート

    2010年度精密工学会全国秋季大会 

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    Event date: 2010.09   Language:Japanese  

  • An Attempt on Conditioned Polishing Pad Surface Evaluation with FFT Analysis

    Keiichi Kimura

    The 15th International Symposium on Chemical-Mechanical Planarization (CAMP) 

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    Event date: 2010.08   Language:English  

  • 20305 Study on material removal model in CMP process : 4th report : Study on functionality of fine particles in slurry for oxide CMP process

    Hashiyama Yuuichi, Kimura Keiichi, Khajornrungruang Panart

    The Proceedings of Conference of Kanto Branch 

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    Event date: 2010.01   Language:Japanese  

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  • Study on Slurry Flow in CMP Process for Large Quadrilateral Quartz Glass Substrate

    Wada Nagisa, Kimura Keiichi, Khajornrungruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2010.01   Language:Japanese  

    CiNii Article

  • Gap Measurement between High Speed Rotating Tool Tip and Workpiece by Laser Diffraction

    Khajornrungruang Panart, Kimura Keiichi, Suzuki Keisuke

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2010.01   Language:Japanese  

    CiNii Article

  • Study on FFT Analysis for Surface Topography of Conditioned Polishing Pad for CMP

    Okuzono Takahisa, Kimura Keiichi, Panart Khajornrungruang

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2010.01   Language:Japanese  

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  • Study on kinetic contact between polishing pad and wafer during CMP

    Okamoto Eiichiro, Kimura Keiichi, Khajornrugruang Panart

    Proceedings of JSPE Semestrial Meeting 

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    Event date: 2010.01   Language:Japanese  

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  • 309 The observation of particle motion in the slurry in ILD-CMP process

    Idei Yoshikazu, Kimura Keiichi, Khajomrungruang Panart

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2010.01   Language:Japanese  

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  • 307 Study on Micro Pattern Pad Applied with MEMS Technology : Comparison of Polishing Rates with Two Types Polishing Pads

    Yasuda Keisuke, Kimura keiichi, Khajornrungruang Panart, Tanaka Akiho

    The Proceedings of Conference of Kyushu Branch 

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    Event date: 2010.01   Language:Japanese  

    CiNii Article

  • Development of Arrayed Micro Pattern on Polishing Pad Surface Applied with Anisotropic Etching

    Keisuke Yasuda

    ICPT 2009 

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    Event date: 2009.11   Language:English  

  • Study on Slurry Flow in CMP Process for Large Quadrilateral Quartz Glass Substrate

    Nagisa Wada

    ICPT 2009 

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    Event date: 2009.11   Language:English  

  • Evaluation Method for Surface Topography of Conditioned Polishing Pad based on Fourier Transform

    Takahisa Okuzono

    ICPT 2009 

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    Event date: 2009.11   Language:English  

  • Study on Functionality of Fine Particles in Slurry for Oxide CMP Process

    Yuuichi Hashiyama

    ICPT 2009 

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    Event date: 2009.11   Language:English  

  • Cu表面のCMP加工における材料除去メカニズムの研究-Cu表面膜の成長速度および物性の検証-

    2007年 精密工学会九州支部 長崎地方講演会 

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    Event date: 2007.12   Language:Japanese  

  • MEMS技術を用いたCMPマイクロパターンパッドの研究-パッド表面のマイクロパターンの提案とその製作法-

    2007年 精密工学会九州支部 長崎地方講演会 

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    Event date: 2007.12   Language:Japanese  

  • レーザ回折を用いたマイクロ工具オンマシン計測ユニットの試作―ユニットの測定性能の評価―

    2007年度精密工学会春季大会学術講演会後援論文集 

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    Event date: 2007.03.20 - 2007.03.22   Language:Japanese  

  • CMPプロセスにおける材料除去モデルの研究

    日本機械学会関東支部第13期総会講演会講演論文集 

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    Event date: 2007.03.16 - 2007.03.17   Language:Japanese  

  • SiC単結晶に対する紫外光照射の及ぼす影響

    日本機械学会九州支部第60期総会講演論文集 

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    Event date: 2007.03.16   Language:Japanese  

  • 紫外光照射Cu-CMPの研究

    日本機械学会九州支部第60期総会講演論文集 

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    Event date: 2007.03.16   Language:Japanese  

  • CMPにおけるスラリープロー可視化に関する研究~ポリシングパッド溝パターン設計の指針~

    日本機械学会九州支部第60期総会講演論文集 

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    Event date: 2007.03.16   Language:Japanese  

  • SiCセラミックスの高温CMP加工に関する基礎的研究

    日本機械学会九州支部第60期総会講演論文集 

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    Event date: 2007.03.16   Language:Japanese  

  • SiC単結晶の紫外光照射CMP加工の研究

    2006年度精密工学会九州支部「福岡地方講演会」論文集 

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    Event date: 2006.12   Language:Japanese  

  • 紫外光照射CMPの研究 -紫外光照射による加工特性-

    2006年度精密工学会九州支部「福岡地方講演会」論文集 

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    Event date: 2006.12   Language:Japanese  

  • 単結晶SiC高温CMP加工の研究

    2006年度精密工学会九州支部「福岡地方講演会」論文集 

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    Event date: 2006.12   Language:Japanese  

  • CMPプロセスにおける材料除去モデルの研究

    2006年度精密工学会九州支部「福岡地方講演会」論文集 

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    Event date: 2006.12   Language:Japanese  

  • CMPにおけるスラリーフロー可視化実験に関する研究~ポリシングパッド溝パターンの影響~

    2006年度精密工学会九州支部「福岡地方講演会」論文集 

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    Event date: 2006.12   Language:Japanese  

  • ArFエキシマレーザによるダイヤモンドの紫外光照射CMPの研究

    2006年度精密工学会九州支部「福岡地方講演会」論文集 

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    Event date: 2006.12   Language:Japanese  

  • 光回折を用いたマイクロ工具オンマシン計測ユニットの試作(計測ユニットの基本特性)

    第6回 生産加工・工作機械部門講演会 

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    Event date: 2006.11.24   Language:Japanese  

  • Material Removal Phenomena on Cu Wafer with Ultraviolet Light Irradiation Polishing

    11th International Symposium on Chemical-Mechanical Planarization 

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    Event date: 2006.09.13 - 2006.09.16   Language:Japanese  

  • CMPにおけるポリシングパッド表面のモデル化の試み

    日本機械学会関東支部第12期総会講演会講演論文集 

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    Event date: 2006.03.10 - 2006.03.11   Language:Japanese  

  • CMPにおけるスラリーフロー可視化に関する研究

    2006年度精密工学会春季大会学術講演会講演論文集 

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    Event date: 2006.03   Language:Japanese  

  • 紫外光照射CMPの研究―第1報 紫外光照射による加工特性―

    2006年度精密工学会春季大会学術講演会講演論文集 

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    Event date: 2006.03   Language:Japanese  

  • マイクロ工具切れ刃プロファイルの光回折オンマシン計測法に関する研究

    2006年度精密工学会春季大会学術講演会後援論文集 

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    Event date: 2006.03   Language:Japanese  

  • SiCセラミックスの超精密CMP加工の研究―第2報 高温ポリシングの特性―

    2006年度精密工学会春季大会 学術講演会講演論文集 

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    Event date: 2006.03   Language:Japanese  

  • SiCセラミックスの高温CMP加工の研究

    2005年度 精密工学会九州支部 鹿児島地方講演会 

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    Event date: 2005.11   Language:Japanese  

  • CMPにおけるプロセスシミュレーションの研究

    2005年度精密工学会九州支部 鹿児島地方講演会講演論文集 

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    Event date: 2005.11   Language:Japanese  

  • CMPにおけるスラリーフロー可視化に関する研究

    2005年度 精密工学会九州支部 鹿児島地方講演会 

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    Event date: 2005.11   Language:Japanese  

  • 紫外光照射ポリシングの研究

    2005年度 精密工学会九州支部 鹿児島地方講演会 

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    Event date: 2005.11   Language:Japanese  

  • レーザ回折を利用した極小径エンドミルの3次元切れ刃プロファイル計測

    年次大会講演論文集 : JSME annual meeting 

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    Event date: 2005.09.19 - 2005.09.22   Language:Japanese  

  • SiCセラミックスの超精密CMP加工の研究-第1報 高温ポリシングの試み-

    2005年度精密工学会秋季大会学術講演会論文集 

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    Event date: 2005.09   Language:Japanese  

  • 極小径工具切れ刃プロファイルの光回折オンマシン計測に関する研究 : 摩耗切れ刃の検証実験

    第5回 生産加工・工作機械部門講演会 

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    Event date: 2004.11   Language:Japanese  

  • 極小径工具切れ刃プロファイルの光回折オンマシン計測法の開発

    2004年度砥粒加工学会学術講演会論文集 

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    Event date: 2004.04   Language:Japanese  

  • 小径工具切れ刃プロファイルの光回折オンマシン計測法に関する研究(第2報)工具回転振れの誤差解析

    2004年度精密工学会春季大会学術講演会講演論文集 

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    Event date: 2004.03   Language:Japanese  

  • 小径工具切れ刃プロファイルの光回折オンマシン計測法に関する研究(第1報)三次元切れ刃プロファイル測定装置の試作

    2003年度精密工学会春季大会学術講演会講演論文集 

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    Event date: 2003.03   Language:Japanese  

  • 小径工具切れ刃プロファイルの光回折オンマシン計測に関する研究 : 光回折ゲージ法の提案

    第4回生産加工・工作機械部門講演会 

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    Event date: 2002.11.21 - 2002.11.22   Language:Japanese  

  • 光回折による小径工具切れ刃断面プロファイル計測法に関する研究(第1報)ねじれ刃の精度に及ぼす影響

    2002年度精密工学会春季大会学術講演会講演論文集 

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    Event date: 2002.03   Language:Japanese  

  • 光回折による小径工具切れ刃の断面プロファイル計測法に関する研究 : 理論解析と基礎実験

    第3回 生産加工・工作機械部門講演会 

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    Event date: 2001.11.21 - 2001.11.22   Language:Japanese  

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Industrial Property

  • 超近接距離の検知方法及びそれを用いた超近接スイッチ

    カチョーンルンルアン パナート、鈴木恵友、井上 智輝

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    Application no:2016-239439  Date applied:2016.12.09

  • 半導体基板の表面皮膜の厚さ測定方法

    鬼木 喬玄、中利明、松尾正昭、田代康典、鈴木恵友、カチョーンルンルアン パナート

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    Application no:2016-202457  Date applied:2016.10.14

  • 微粒子の3D位置特定装置及び特定方法

    カチョーンルンルアン パナート、鈴木恵友、白川裕晃、堺航也

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    Application no:2016-47872  Date applied:2016.03.11

  • 液滴量測定装置及び測定方法

    伊藤高廣、カチョーンルンルアン パナート、村上直、鈴木恵友

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    Application no:2015-199979  Date applied:2015.10.08

  • 研磨パッドの表面性状測定方法および装置

    松尾尚典、望月宣宏、鈴木恵友、田尻貴寛、カチョーンルンルアン パナート

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    Application no:2014-265694  Date applied:2014.12.26

  • 精密研磨方法

    中利明、田代康典、鬼木喬玄、高田正人、鈴木恵友、伊藤高廣、カチョーンルンルアン パナート

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    Application no:2013-139863  Date applied:2013.07.03

  • 研磨パッドの表面性状測定方法

    松尾尚典、木村景一、鈴木恵友、カチョーンルンルアン パナート、櫛田高志

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    Application no:2013-49684  Date applied:2013.03.12

  • 研磨パッドの表面性状測定装置

    松尾尚典、木村景一、鈴木恵友、カチョーンルンルアン パナート、櫛田高志

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    Application no:2013-49685  Date applied:2013.03.12

  • 研磨パッド成形金型の製造方法、その方法で製造される研磨パッド成形金型、及びその金型で製造した研磨パッド

    田代康典、高田正人、中利明、松尾正昭、伊藤高廣、鈴木恵友、木村景一、カチョーンルンルアン パナート

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    Application no:2012-147422  Date applied:2012.06.29

  • 研磨パッド成形金型の製造方法、その方法で製造される研磨パッド成形金型、及びその金型で製造した研磨パッド

    田代康典、高田正人、中利明、松尾正昭、伊藤高廣、鈴木恵友、木村景一、カチョーンルンルアン パナート

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    Application no:2012-147442  Date applied:2012.06.29

  • ポリシングパッド及びその製造方法

    鈴木恵友、木村景一、伊藤高廣、カチョーンルンルアン パナート、安田佳祐、磯野 慎太郎

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    Application no:2011-188471  Date applied:2011.08.31

  • 研磨剤

    鈴木恵友、木村景一、カチョーンルンルアン パナート、齋藤貴志、是澤龍哉

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    Application no:2011-117617  Date applied:2011.05.26

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Lectures

  • Moving Sub-100 nm Particle on Surface Observatory in Wet Process by Evanescent Wave

    the 25st International Symposium on Chemical-Mechanical Planarization   2023.08  Clarkson University and Empire State Development Division of Science, Technology and Innovation (NYSTAR)

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    Language:English   Presentation type:Others   Venue:Lake Placid, NY  

  • Concept of Spatial Fourier Transform Analysis for Polishing Pad Surface 3D Topography

    the 22st International Symposium on Chemical-Mechanical Planarization   2018.08  Clarkson University and Empire State Development Division of Science, Technology and Innovation (NYSTAR)

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    Presentation type:Others   Venue:Lake Placid, NY  

  • Light Scattering Model for Individual Sub-100-nm Particle Size Determination in an Evanescent Field and its Verification with Compact Apparatus

    the 20st International Symposium on Chemical-Mechanical Planarization   2016.08  Clarkson University and Empire State Development Division of Science, Technology and Innovation (NYSTAR)

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    Presentation type:Others   Venue:Lake Placid, NY  

  • 高速加工 における高速回転小径工具の機上計測

    第323回 講習会「機械加工における計測の基礎と最新動向」  2012.12  日本機械学会関西支部

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    Presentation type:Others  

  • Study on material removal mechanism in CMP process for SiO2 film

    Proceedings of JSPE Semestrial Meeting  2010.01 

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    Event date: 2010.01   Language:Japanese   Presentation type:Keynote lecture  

    CiNii Article

Honors and Awards

  • 工作機械技術振興財団奨励賞

    公益財団法人 工作機械技術振興財団   2013.06

    田尻貴寛, 木村景一, カチョーン ルンルアン・パナート, 鈴木恵友, 松尾尚典

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    Country:Japan

Grants-in-Aid for Scientific Research

  • ナノスケール加工現象における作用単粒子の三次元空間追跡法及び粒径計測法の確立

    Grant number:16K06015  2016.04 - 2019.03   基盤研究(C)

  • 機上ポリシング加工現象観察装置の開発およびその現象解析

    Grant number:25870514  2013.04 - 2015.03   若手研究(B)

  • Study on electro plating and etching for metal interconnect in integrated circuit assisted with ArF excimer laser

    Grant number:20760086  2008.04 - 2010.03   Grant-in-Aid for Young Scientists(B)

Contracts

  • (AS2311249B)レーザー次回折光を用いた超微細穴加工工具の高精度化及び計測システムの開発

    2011.10 - 2014.09

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    Grant type:Consigned research

  • パルスレーザ光を用いた回転工具形状測定装置ならびにシステム

    2011.07 - 2012.03

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    Grant type:Consigned research

    「知財活用促進ハイウェイ」大学特許価値向上支援

  • レーザ回折光を利用したオンマシン工具計測装置の開発

    2007.08 - 2008.03

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    Grant type:Consigned research

Other External Funds

  • レーザ一次回折光を用いた超微細穴加工工具の高精度化及び計測システムの開発

    2011.10 - 2012.09

    (独)科学技術振興機構 A-STEP シーズ顕在化  

  • パルスレーザ光を用いた回転工具形状測定装置ならびにシステム

    2011.07 - 2012.03

    (独)科学技術振興機構 知財活用促進ハイウェイ  

Career of Research abroad

  • Visualization of Sub 100 nm Particles on Interfacial by Evanescent Wave Scattering

    Clarkson University  Project Year:  2013.03.27 - 2014.03.26

Charge of off-campus class subject

  • Institution:北九州高専

Activities of Academic societies and Committees

  • 日本機械学会 生産加工・工作機械部門   国際会議 LEM21 実行委員  

    2020.10 - 2021.11

  • 日本機械学会 生産加工・工作機械部門   コンピュータ支援ものづくり体験 実行委員  

    2016.07 - 2019.07

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    コンピュータ支援ものづくり体験

  • The Optical Society of Japan  

    2014.04 - 2020.03

  • 精密工学会   2012年度精密工学会秋季大会 実行委員・国際シンポジウム委員  

    2011.12 - 2012.09

  • 精密工学会   アフィリエイト  

    2011.04

  • Planarization and CMP Technical Committee, JSPE   Organizing Committee of ICPT2009  

    2009.04 - 2009.12

  • Intelligent Nano-Measure, JSPE  

    2008.04

  • 日本機械学会   日本機械学会九州支部福岡東地区長 補助  

    2008.04 - 2009.03

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Social activity outside the university

  • 学内展示会 顕微鏡のなかの望遠鏡

    Role(s):Planner, Organizing member, Demonstrator

    本学  ISGフェスタ  2023.10

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    Audience: Schoolchildren, Junior students, High school students, Guardians

    Type:Other

  • 電子メカスマートフォンの秘密-電子機器、クリーンデバイス、医療への適用-

    Role(s):Lecturer

    九州工業大学  福岡県立若松高等学校  2021.10.26

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    Audience: High school students

    Type:Visiting lecture

  • 電子メカスマートフォンの秘密-電子機器、クリーンデバイス、医療への適用-

    Role(s):Lecturer

    九州工業大学  大分県立中津北高等学校  2021.10.15

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    Audience: High school students

    Type:Visiting lecture

  • 虫めがねで原子は見えるの?

    Role(s):Lecturer, Demonstrator

    2021.03

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    Audience: Junior students, High school students

    Type:Visiting lecture

    熊本学園大学付属高等学校 1~2年

  • 学内展示会 顕微鏡のなかの望遠鏡

    Role(s):Planner, Organizing member, Demonstrator

    本学  オープンキャンパス  2017.07

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    Audience: Schoolchildren, Junior students, High school students, Guardians

    Type:Other

  • 未来に挑戦 マイクロ加工技術

    2015.09.19

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    Audience: High school students

    Type:Visiting lecture

    熊本学園大学付属高等学校 1~2年

  • 未来に挑戦 マイクロ加工技術

    2014.10.18

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    Audience: High school students

    Type:Visiting lecture

    熊本学園大学付属高等学校 1~2年

  • 未来に挑戦 マイクロ加工技術

    Role(s):Lecturer, Demonstrator

    2012.04.01 - 2021.03

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    Audience: Junior students, High school students

    Type:Visiting lecture

  • 情報工学部主催のISGフェスタ 電気自動車の展示

    2012.04

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    Type:Seminar, workshop

  • 情報工学部主催のオープンキャンパス 電気自動車の展示

    2012.04

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    Type:University open house

  • 理数教育支援センター主催の高校の大学訪問 電気自動車の体験学習

    Role(s):Lecturer, Organizing member, Demonstrator

    2012.04 - 2018.03

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    Audience: High school students

    Type:Seminar, workshop

  • 超精密の世界 -身の回りの超精密-

    2011.10.07

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    Audience: High school students

    Type:Visiting lecture

    福岡県立八幡中央高等学校 1~2年

  • 超精密の世界 -身の回りの超精密-

    2011.09.28

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    Audience: High school students

    Type:Visiting lecture

    熊本県立阿蘇中央高等学校 1~2年

  • 超精密の不思議 -身の回りにある超精密-

    2010.12

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    Type:Visiting lecture

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PR

  • (PR for students)

    九州工業大学の公式 YouTube