口頭発表・ポスター発表等 - 渡邉 晃彦
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Real-Time Monitoring for Improvement of Reliability of Power Devices
Akihiko Watanabe
6th International Symposium on Applied Engineereing and Sciences (SAES2018)
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内部劣化および熱・電気特性の同時観測による複合型故障解析装置の実証
廣吉慎吾
電気学会、電子デバイス・半導体電力変換合同研究会「パワーデバイス・パワーエレクトロニクスとその実装技術」
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A power cycling degradation inspector of power semiconductor devices
A. Watanabe
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF2018)
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Device destruction during AC stree of a thin-film SOI power nMOSFET
M.Nomura
International Symposium on Applied Engineereing and Sciences (SAES2017)
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TOパッケージダイオードのリアルタイムモニタリング評価
諸岡幸一郎
先進パワー半導体分科会 第4回講演会
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Real-time imaging of temperature distribution inside a power device under a power cycling test
A. Watanabe
28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF2017)
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Temperature Distribution Imaging inside Power Devices by Real-Time Simulation by Real-Time Simulation
A. Watanabe
2017 International Conference on Solid State Devices and Materials (SSDM2017)
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AC Hot carrier effect and PBTI of a thin-film SOI Power n-MOSFET at high temperature
M. Nomura
2017 International Conference on Solid State Devices and Materials (SSDM2017)
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An observation system for temperature distribution on power semiconductor
K. Ezaki
International Symposium on Applied Engineereing and Sciences (SAES2016)
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Real-time 2D imaging system of temperature distribution inside a power device
R. Nagao
International Symposium on Applied Engineereing and Sciences (SAES2016)
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Combined real-time monitoring system for failure prediction of power devices
A. Watanabe
International Symposium on Applied Engineereing and Sciences (SAES2016)
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Failure analysis of power devices based on real-time monitoring
A. Watanabe
26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF2015)
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Real-time Temperature Monitoring System inside Package of Power Devices
N. Hirata
International Symposium on Applied Engineereing and Sciences (SAES2014)
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Current imbalance measurement among chips in IGBT module with ultra-small PCB probe
H. Yamaguchi
International Symposium on Applied Engineereing and Sciences (SAES2014)
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Current distribution imaging system for power devices using tiny ferrite core sensor
H. Tomonaga
International Symposium on Applied Engineereing and Sciences (SAES2014)
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Numerical design method of multi-turn coil for wireless power transfer circuit based on electrical circuit simulation
M. Koga
International Symposium on Applied Engineereing and Sciences (SAES2014)
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IGBTモジュール高信頼化に向けたチップ間電流不均衡計測技術の開発
山口治之
電気学会、電子デバイス・半導体電力変換合同研究会「パワーデバイス・パワーエレクトロニクスとその実装技術」
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High Speed Real-time Temperature Monitoring System inside Power Devices Package Using Infrared Radiation
N. Hirata
2014 International Conference on Solid State Devices and Materials (SSDM2014)
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Real-time failure monitoring system for high power IGBT under acceleration test up to 500 A stress
A. Watanabe
The 26th International Symposium on power semiconductor devices and ICS (ISPSD2014)
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Internal degradation monitoring of power devices during power cycling test
A. Watanabe
8th International Conference on Integrated Power Electronics Systems (CIPS2014)