Faculty Profiles - SUZUKI Keisuke

Papers - SUZUKI Keisuke

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Brownian motion simulation of SiO2 abrasive nanoparticle on SiC substrate surface Reviewed International journal

SAENNA Soraya, KHAJORNRUNGRUANG Panart, BLATTLER Aran, PERMPATDECHAKUL Thitipat, SUZUKI Keisuke, BAKIER Mohammed A.

Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers ) 2021.10 ( 0 ) 178-171 2021.01

Language：English Publishing type：Research paper (scientific journal)

Chemical-Mechanical Polishing (CMP) process has emerged as the method of choice for planarization in the semiconductor industry. The interaction force between the surface being polished and the abrasive nanoparticles plays a significant role in flattening the substrate surface in the CMP process. For example, when the SiO2 nanoparticle is distant from the SiC substrate surface, the interaction force between the surface and the nanoparticles is presented. This force could be analysed using Derjaguin and Landau and Verwey and Overbeek (DLVO) theory and particle Brownian motion. According to the simulation results, we found that very fine abrasive nanoparticle such as smaller than approximately 10 nm is comparatively approach to the surface being polished more certainly.

DOI： 10.1299/jsmelem.2021.10.178-171

CiNii Research

Brownian motion simulation of SiO<inf>2</inf> abrasive nanoparticle on SiC substrate surface Reviewed

Saenna S., Khajornrungruang P., Blattler A., Permpatdechakul T., Suzuki K., Bakier M.A.

10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021 353 - 357 2021.01

High-speed three-dimensional tracking of individual 100 nm polystyrene standard particles in multi-wavelength evanescent fields Reviewed

Blattler A., Khajornrungruang P., Suzuki K., Permpatdechakul T.

Measurement Science and Technology 31 ( 9 ) 2020.09

Evaluation of superconductor assisted machining (SUAM) with superconducting coated conductors using the finite element method Reviewed

Kinoshita Y., Zhang R., Otabe E.S., Suzuki K., Tanaka Y., Nakashima H., Nakasaki T.

Journal of Physics: Conference Series 1590 ( 1 ) 2020.07

Advanced chemical-mechanical planarization for 4H-SiC substrate by water-soluble inclusion complexes of fullerene Reviewed

Tsai Y.H., Chen C.C.A., Suzuki K., Khajornrungruang P., Chiu S.F., Hua C.T.

Japanese Journal of Applied Physics 59 ( SL ) 2020.07

Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, HAMADA Satomi, WADA Yuutaka, HIYAMA HIYAMA

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2020 ( 0 ) 17E02 2020.03

Language：Japanese Publishing type：Research paper (scientific journal)

Cleaning phenomena in semiconductor manufacturing is about the nano-contamination being repelled out from, or adhering to, the wafer surface. However, residual contamination on the wafer has been usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light generated by internal reflection. This article introduces some of observed physical phenomena during duplicated cleaning process in both contact cleaning by a PVA brush and non-contact cleaning by mega-sonic wave.

DOI： 10.1299/jsmekanto.2020.17e02

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekanto/2020/0/2020_17E02/_pdf

Three-dimensional tracking and height verification of polystyrene particles with piezo actuator positioning by means of multi-wavelength evanescent fields Reviewed

Blattler A., Khajornrungruang P., Suzuki K., Permpatdechakul T.

Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020 53 - 56 2020.01

Study on novel nano fine particles reacted with fullerene for hard to process material Reviewed

Hisayoshi Fuya, Suzuki Keisuke, Tsai Yueh-Hsun, Khajornrungruang Panart, Yasunaga Takuo, Takazaki Hiroko, Ouchi Masayoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 486 - 487 2020.01

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:2nd report : Non-contact Removal of Abrasive Nano-particles during Enforcing Mega sonic Reviewed

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Permpatdechakul Thitipat, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 660 - 661 2020.01

ナノスケールにおける加工現象可視化に関する研究:第6報:単一ナノ粒子の三次元目変位の検証 Reviewed

ブラットラーアラン, カチョーンルンルアンパナート, 鈴木恵友, パームパッデーチャークンティティパット

精密工学会学術講演会講演論文集 2020 ( 0 ) 588 - 589 2020.01

作用表面上におけるナノスケール現象の化学的実時間観測に関する研究:第1報:ラマン分光光度計の開発 Reviewed

ドバンタン, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 2020 ( 0 ) 622 - 623 2020.01

局在光によるナノ研磨現象観測に関する研究:第1報:開発した小型装置による実験的評価 Reviewed

パームパッデーチャークンティティパット, カチョーンルンルアンパナート, 鈴木恵友, ブラットラーアラン, 寺山裕

精密工学会学術講演会講演論文集 2020 ( 0 ) 658 - 659 2020.01

Study on Relationship of the Material Removal Amount and the Increase in Abrasive Nanoparticle Size during Si-CMP Reviewed

Boripatkosol S., Bun-Athuek N., Khajornrungruang P., Suzuki K., Chanthawong N., Phaisalpanumas P.

ESIT 2018 - 3rd International Conference on Engineering Science and Innovative Technology, Proceedings 2019.03

Research on high speed polishing technology using electrode embedded type low refractive transparent pad

Kato Yuya, Ryunosuke Matsumoto, Suzuki Keisuke, Panart Khajornrungruang

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 2019.01

Language：Japanese Publishing type：Research paper (conference, symposium, etc.)

The manufacturing process of the transparent pad was developed by the thermal imprint method equipped with a special jig for controlling the thickness, pattern and electrode structure. Particle behavior is controlled by the electric field using a wire mesh inserted into a low index transparent polishing pad. As a result, the movement of hybrid particles of diamond particles and silica particles can be observed in an electric field using a digital microscope. Furthermore, in the polishing experiment, it was possible to obtain a higher amount of material removal in the presence of the electric field than in the absence of the electric field.

DOI： 10.1299/jsmemmt.2019.13.D39

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007836392

FDTD Simulation for Analysing Scattering Light Characteristic of Moving Nano-particle in Evanescent Field Reviewed

Khajornrungruang PANART, SUZUKI Keisuke, TAIRA Kanako, ARAMAKI Hirochika

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 2019.01

Language：Japanese Publishing type：Research paper (conference, symposium, etc.)

In surface fabrication process, such as the polishing in semiconductor substrate, there are many nano-particles moving on or nearby the surface to be polished. We have been establishing an optical method to observe and to track the 3-dimensional position of each dynamical moving nano-particle on time by applying an evanescent light field. In this report, the scattering light characteristic from a moving nano-particle in an evanescent field generated by internal reflection on a silica glass surface was analysed by FDTD (Finite Difference Time Domain) method on MATLAB. We discuss the scattering light from a particle moving perpendicularly to a surface in an interval time as one recorded frame in practical observation.

DOI： 10.1299/jsmemmt.2019.13.D18

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007836425

Study on processing method using superconductive assisted machining method

NAKASHIMA Hidetaka, NAKASAKI Tatsuya, TANAKA Yuki, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 2019.01

Language：Japanese Publishing type：Research paper (conference, symposium, etc.)

In recent years, superconductive assisted machining method (SUAM) using a magnetic levitation tool utilizing a superconducting phenomenon such as pinning effect has been developed to reduce tool interference on the conventinal procceing method. Measurement of the force by the magnetic levitation tool is evauated in the air to determind polishing conditions. In our study, polishing test were performed not only on aluminum plate but also stainless steel plate using fixed and loose abrasives. As a result, the superconductive assisted machining method was applicable to stainless steel material.

DOI： 10.1299/jsmemmt.2019.13.D38

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007836391

Characteristic Evaluation of Scattering Light from Cutting edge in Evanescent Field by Using Numerical Simulation Method Reviewed

Aramaki Hirochika, Khajornrungruang Panart, Suzuki Keisuke, Taira Kanako

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2019 ( 0 ) 904 - 905 2019.01

ナノスケールにおける加工現象可視化に関する研究:第5報:標準粒子の三次元挙動観測の試み

ブラッドラーアラン, カチョーンルンルアンパナート, 鈴木恵友, パームパッデーチャークンティティパッド

精密工学会学術講演会講演論文集 2019 ( 0 ) 459 - 460 2019.01

The Performance Evaluation of Developed Apparatus for Observing the Nanoparticles Phenomena During CMP Process by Applying Evanescent Field

Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Taira Kanako

日本機械学会九州支部講演論文集 2019 ( 0 ) 2019.01

Study on Organic Fibers in The Polishing Pad for Sapphire Chemical Mechanical Polishing

Chansatarpornkul Sansuwan, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 2019 ( 0 ) 18 - 19 2019.01

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Papers - SUZUKI Keisuke