Faculty Profiles - SUZUKI Keisuke

Papers - SUZUKI Keisuke

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Real time nanoscale cleaning phenomenon observation during PVA brush scrubbing by evanescent field Reviewed

Terayama Y., Khajornrungruang P., Suzuki K., Kusatsu K., Hamada S., Wada Y., Hiyama H.

ECS Transactions 92 ( 2 ) 191 - 197 2019.01

Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire Reviewed

57 ( 7 ) 2018.07

Study on the Optimization of Hybrid fine particles on Chemical Mechanical Polishing of Hard to process materials:Chemical reactivity and Mechanical action

Suzuki Keisuke, Bun-Athuek Natthaphon, Takazaki Hiroko, Yasunaga Takuo, Yoshimoto Yutaka, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018 ( 0 ) 312 - 313 2018.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

We repot on the hybrid fine particles using core silica particles adsorbed on the ultra fine nano particles such as nano silica particles (ca.4nm diameter) and fullerenol for Chemical Mechanical Polishing of Hard to process materials. In our study, chemical reactivity and mechanical action from the hybrid particles were investigated using the several diameters of the core silica particles. At the case of adsorption of the nano silica particles and fullerenol, chemical reactivity become dominant parameter under the small size region although the nano particle is coated on the surface of the core silica particles. These results expect that both parameters as chemical reactivity and mechanical action can be control by the sizes of core particles and coating condition of the nano silica particles. We also optimize the structure of the hybrid silica particles at the case of the nano silica particles and/or fullerenol to meet the high performance CMP of hard to process materials and discuss about these results.

DOI： 10.11522/pscjspe.2018A.0_312

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007602798

Study on polishing method using magnetic levitation tool by superconducting

TANAKA Yuki, NAKASHIMA Hidetaka, HIRAMATU Yuta, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 62 ( 4 ) 219 - 220 2018.01

Language：Japanese Publishing type：Research paper (other academic)

Precision machining techniques have a number of serious problem, such as tool interference against complicated machining shapes and improvement of accuracy in processing. To resolve these issues, we suggest the Superconductive Assisted Machining (SUAM) method, which involves application of a magnetic levitation tool using the pinning effect of superconductivity during polishing processing. The SUAM method can eliminate tool interference because machining shape is determined by movement of the magnetic levitation tool during processing. Here, we measured the holding force, such as attractive and repulsive forces, from the pinning effect of superconductivity. The results indicated a maximum attractive force of 4 N with an initial magnetic levitation tool height of 9 mm. In this case, the holding force was dependent on the initial distance between the magnetic levitation tool and the superconductor bulk. In addition, we evaluated the dependence of polishing pressure and rotation frequency on polishing rate using fixed abrasive polishing pads. The results indicated that the polishing removal rates increase with increasing polishing pressure and rotation frequency.

DOI： 10.11420/jsat.62.219

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007492417

Study on fabrication method of low refractive transparent pad by thermal transfer Reviewed

Kato Yuya, Suzuki Keisuke, Khajornrungruang Panart, Yamaguchi Yuta, Tsai Yueh-Hsun

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2018 ( 0 ) 2018.01

Language：Japanese Publishing type：Research paper (other academic)

Fabrication process of the pad has been developed by imprint method with special zig to control of the thickness and patter and electrode structure. Movement of the fine particle is controlled by electrical field using copper wire electrode inserted in the low refractive index – transparency polishing pad. As results, we can be observe the movement of the diamond particle between the pattern structures under the pad by electrical field using digital microscope.

DOI： 10.1299/jsmemmt.2018.12.D06

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007637887

Observation of Nano-particle Adhesion and Desorption Phenomenon Near to Silicon Nitride and Oxide Film Surface in an Evanescent Field

TERAYAMA Yutaka, NAKANO Asato, Khajornrungruang Panart, SUZUKI Keisuke, WADA Yutaka, HAMADA Satomi

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2018 ( 0 ) 2018.01

Language：Japanese Publishing type：Research paper (other academic)

The study on adhesion and desorption mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. This report proposes an optical method to visualize only the nano-particles moving near to Si3N4 and SiO2 film surfaces by applying an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. Adhesion and desorption phenomena of the polystyrene latex standard particles (50±1 nm) and the SiO2 particles (55 nm) moving near to the Si3N4 and SiO2 film surfaces were observed by our developed experimental setup. Furthermore, desorption phenomenon of SiO2 particles (105 nm) with the flow occurred by polyvinyl alcohol (PVA) sponge brush sliding was also demonstrated.

DOI： 10.1299/jsmekanto.2018.24.OS0105

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130007486587

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale-4th: Estimation of longitudinal Resolution Reviewed

Shirakawa Hiroaki, Blatter Aran, Takemoto Ryo, Khajornrungruang Panart, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018 ( 0 ) 129 - 130 2018.01

Study on non-contact micro tool tip nano-position detection by means of evanescent field penetration depth Reviewed

Khajornrungruang P., Suzuki K., Inoue T.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 18th International Conference and Exhibition, EUSPEN 2018 139 - 140 2018.01

Language：English Publishing type：Research paper (international conference proceedings)

© 2018 CURRAN-CONFERENCE. All rights reserved. This study proposes a non-contact measurement method for detecting a micro tool tip position at a nanometre precision in atmospheric environment as a non-contact tool setter. Particularly, to measure rotating small tools, optical measurement method are applied in non-contact tool setters. However, the generally used geometrical optical measurement methods do fundamentally not have nanometre precision due to the well-known light diffraction phenomenon, notably when measuring a micro tool. Furthermore, the non-contact tool setter for measuring a rotating micro tool has been indispensable because the position of a tool tip during rotation is different from the position of a static tool. The precision of tool position non-contact measurement is definitely required in nanometre scale due to the miniaturization of micro rotating tool size down to smaller than 50 μm. An evanescent light field is applied to detect a micro tool tip position in nanometre scale without contacting between a micro tool and a reference surface. In this paper, non-rotation micro tools with diameter of 50 μm were experimentally approached to and/or departed from a reference surface of a plano-convex lens by a nano-controlled piezo actuator to verify our proposed detection method. Consequently, the tool tips were recognised in the evanescent field during 300 nm range (or the evanescent field effective penetration depth) from the reference surface. It implies that the tool tip position could be detected more precisely than ±150 nm by only recognising the scattering light from the evanescent light field without tool contacting.

Scopus

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85054532311&origin=inward

Study of Electroosmotic Micro-Flow Enhanced Abrasives Distribution in Nanoparticle Contained Slurry for Copper Chemical Mechanical Planarization

蔡岳勳, 鈴木恵友, 陳彰, Khajornrungruang Panart

精密工学会学術講演会講演論文集 2018 ( 0 ) 781 - 782 2018.01

Study on the nano combined fine particles in the CMP

SAKAI Koya, UEDA Tatsunori, YOSHIMOTO Hiroshi, SUZUKI Keisuke, BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUANG PANART

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2018 ( 0 ) 2018.01

Visualization of Slurry Flow between Polishing Pad and Wafer in CMP (4th Report):Difference due to pad conditioning conditions Reviewed

Fukuda Akira, Sekiduka Noriaki, Yamamoto Hiroki, Suzuki Keisuke, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018 ( 0 ) 295 - 296 2018.01

Evaluation of Magnetic Cutting and Polishing with Superconducting Bulks Reviewed

871 ( 1 ) 2017.07

In situ measurement method for film thickness using transparency resin sheet with low refractive index under wet condition on chemical mechanical polishing Reviewed

56 ( 7 ) 2017.07

Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire Reviewed

56 ( 7 ) 2017.07

Micro tool diameter monitoring by means of laser diffraction for on-machine measurement Reviewed

11 ( 5 ) 736 - 741 2017.01

Study on fullerenol as the additive to remove BTA film remaining on copper surface in chemical mechanical polishing process Reviewed

Tsai Y.H., Suzuki K., Chen C.C.A.

ICPT 2017 - International Conference on Planarization/CMP Technology 54 - 59 2017.01

Non-contact Micro Tool Tip Position Detection Method by Evanescent Light Field

Khajornrungruang PANART, INOUE Tomoki, SUZUKI Keisuke

The Proceedings of Mechanical Engineering Congress, Japan ( The Japan Society of Mechanical Engineers ) 2017 ( 0 ) S1330103 2017.01

Language：Japanese Publishing type：Research paper (scientific journal)

Non-contact tool setter for rotating micro tools has been needed because the position of tool tip during rotation is different from the position when the tool is not rotating. Furthermore, precision of tool position measurement is definitely required in nanoscale due to the miniaturization of micro rotating tool size down to smaller than 50μm. An evanescent light field is applied to detect a micro tool tip position in nanoscale without contacting between micro tool and detector. In this report, micro tools with diameter of φ 50μm were approached to and/or departed from a glass reference plane surface by a nano-controled piezo actuator to verify our detection method. Consequently, the tool tips were detected in the evanescent field during 300 nm range from the reference surface, implying that the tool tip can be detected in the precision of less than ±150 nm by only observing the scattering light from the evanescent light field without contacting.

DOI： 10.1299/jsmemecj.2017.s1330103

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmemecj/2017/0/2017_S1330103/_pdf

Study on processing technology using magnetic levitation tool by superconducting

Tanaka Yuki, Suzuki Keisuke, Khajornrungruang Panart, Otabe Soji, Nakashima Hidetaka

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2017A ( 0 ) 765 - 766 2017.01

Study on processing technology using magnetic levitation tool by superconducting

TANAKA Yuki, SUZUKI Keisuke, Khajornrungruang P

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2017.70 ( 0 ) 907 2017.01

ナノスケールにおける加工現象可視化に関する研究

白川裕晃, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2017A ( 0 ) 985 - 986 2017.01

Language：Japanese Publishing type：Research paper (scientific journal)

ナノスケールにおける加工現象として，ナノ粒子を用いたポリシング加工がある．本研究は，ポリシング加工のナノ粒子の挙動を観察し，ナノ粒子による加工現象を解明することを目的とする．そこで本研究では，表面上近傍に局在するエバネッセント光を用いた実時間観測を行っている．既知のナノ単粒子に多波長エバネッセント光を当て，その散乱光の強度を調べたので，ここに報告する．

DOI： 10.11522/pscjspe.2017a.0_985

CiNii Article

CiNii Research

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Papers - SUZUKI Keisuke