Faculty Profiles - SUZUKI Keisuke

Papers - SUZUKI Keisuke

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Nanoparticle Application of Polyhydroxylated Fullerene (Fullerenol) on Post Cleaning Process of Copper Wafer

Tsai Yuehhsun, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2017S ( 0 ) 789 - 790 2017.01

Language：Japanese Publishing type：Research paper (scientific journal)

During copper chemical mechanical polishing (CMP) process, large amount of contamination residues on polished surface as removing of great number of copper. The common contaminations such as abrasives, metallic ion, and organic compound, that will discourage the metallic line of fabrication, even result in decline of efficiency. Benzotriazole(BTA) is known as passivation behavior that combined with metallic surface forming the protective layer from the serious corrosion, but it indicates a feature hard to be removed comprehensively in the general cleaning solution, for example water, ethanol, and acetone…etc. Polyhydroxylated fullerene, called fullerenol, as the outstanding nanoparticle is utilized in biomedicine, material science, and precision engineering fields according to its water-solubility, medicinal chemistry, and cage structure. This study aims to introduce the diluted fullerenol solution to remove the remained BTA film in post cleaning system. The 20mm in square of copper specimen is treated by 0.05M BTA solution for 2 min, and then dipped into diluted fullerenol solution for 2 min. Finally, it is measured by x-ray photoelectron spectroscopy (XPS), to observe the signal from 1s orbital of nitrogen. The results show the N1s peak (˜400eV) is decrease even disappears after treated by diluted fullerenol solution (0.01wt%, 0.05wt%, and 0.1wt%).

DOI： 10.11522/pscjspe.2017s.0_789

CiNii Article

CiNii Research

Light scattering model for individual sub-100-nm particle size determination in an evanescent field Reviewed

55 ( 6 ) 2016.05

Study on evaluation method for surface topography of polishing pad based on optical Fourier transform Reviewed

2016.02

Study on fine particles observation using Transparency micro-patterned pad during CMP

ONIKI Takahiro, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart

The Proceedings of Mechanical Engineering Congress, Japan ( The Japan Society of Mechanical Engineers ) 2016 ( 0 ) S1330203 2016.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (scientific journal)

<p>Transparency micro-patterned pad is used to observe fine particles by an epi-illumination microscope. The material of transparency micro-patterned pad is resin which has almost same as the refractive index of water. Therefore, it has characteristic that the micro pattern could disappear in the observation image by filling water. Epi-illumination microscope has illumination system and the detection system on the same side. In this study, we succeeded to observe the diamond particles with a diameter of 1μm on the glass substrate at 1000 frame/s in dark-field illumination. This results show that the fine particles could be observed simplicity, and also suggest the possibility that the fine particles observation on opaque substrate using the epi-illumination microscope.</p>

DOI： 10.1299/jsmemecj.2016.s1330203

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmemecj/2016/0/2016_S1330203/_pdf

超伝導バルクを利用した磁気浮上工具による中空加工技術に関する研究

日高裕, 上原和晃, カチョーンルンルアンパナート, 小田部荘司, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2016S ( 0 ) 971 - 972 2016.01

Language：Japanese Publishing type：Research paper (scientific journal)

本研究では超電導現象である磁気浮上を利用し、金型や3Dプリンタなどの中空部品成形技術が抱える問題を解消する新規中空加工技術の確立を目指している。その概要としては、磁気浮上を利用して磁性体や超伝導体を一定間隔離して浮上させトラップし、さらに回転運動を加え回転工具とすることで被加工物を切削する技術である。本報では樹脂などを用いて本加工技術の原理検証を行ったので、その内容について報告する。

DOI： 10.11522/pscjspe.2016s.0_971

CiNii Article

CiNii Research

ポリシング前後におけるスラリー中の研磨微粒子径に関する研究

永井利幸, 八尋新, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2016S ( 0 ) 371 - 372 2016.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (scientific journal)

CMPでは，複数の加工材料に対して最適なスラリーやポリシングパッドを適用させる必要がある．これらの部材を最適化するためには，材料除去メカニズムに基づき，スラリー中微粒子の種類や微粒子径，材質，薬液を選定することが重要である．そこで本研究では，サファイア，SiO2などの複数の基板に対して動的光散乱法（DLS）を用いて微粒子径の変化について評価したので報告する．

DOI： 10.11522/pscjspe.2016s.0_371

CiNii Article

CiNii Research

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale:the apparatus development

Khajornrungruang Panart, Shirakawa Hiroaki, Suzuki Keisuke, Sakai Koya

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2016S ( 0 ) 5 - 6 2016.01

I-11 Optimization of mixed colloidal silica and fullerenol slurry in Chemical Mechanical Polishing of Sapphire Reviewed

BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUAN PANART, MURAKAWA WATARU, SATOU TOKIHITO, SUZUKI KEISUKE

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2016.69 ( 0 ) 361 - 362 2016.01

Language：English Publishing type：Research paper (other academic)

This research studies the method to optimization of polishing slurry which colloidal silica based (SiO_2 slurry) containing C_<60>(OH)_n n=ca.10 for Chemical Mechanical Polishing (CMP) process by concentration dependence on the C_<60>(OH)_n solute between 0-0.05 wt% and varying size of abrasive particle in colloidal silica slurry between 20-55 nm. We focussed on relationship between the effect of abrasive particle size and polishing performance such as Material Removl Rate (MRR) and surface roughness of sapphire substartes. This paper consists of two parts, the first section in order of slurry preparation and polishing condition setting up for CMP process. The last section are the MRR value calculating and abrasive particle diameter size before and after CMP process measuring for optimization of mixed colloidal silica and fullerenol slurry in CMP of sapphire. These results indicate that diameter of the fine particle composed by colloidal silica slurry and C_<60>(OH)_n is a dominant parametrs to determid the MRR values against the apphire CMP.

DOI： 10.1299/jsmekyushu.2016.69.361

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekyushu/2016.69/0/2016.69_361/_pdf

Study on evaluation method for polishing pad surface topography based on optical fourier transform Reviewed

205 - 208 2015.01

Study on polishing methods for the hard-to-work material using unconventional nano carbon particle

Murakawa Wataru, Suzuki Keisuke, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2014 ( 0 ) 19 - 20 2014.01

Language：Japanese Publishing type：Research paper (other academic)

Improvement of polishing performance against the hard-to-work material is required to realize high throughput manufacturing process of the wafers. Recently, Doi has reported new polishing technology of the high efficiency polishing methods of the materials assisted by plasma. In this method, it is difficult to use conventional polishing device because of microwave resistance. We develop new nano carbon particle formed by UV laser irradiation against fullerenol and diamond particles for the polishing method and will report our experimental results.

DOI： 10.11522/pscjspe.2014A.0_19

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130005479359

Study on material removal mechanism for SiO<sub>2</sub>-CMP:Development of quantitative evaluation method on the adhesion behavior

Takano Yuichi, Fukuda Kosuke, Khajornrungruang Panart, Kimura Keiichi, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2014 ( 0 ) 279 - 280 2014.01

C31 Study on the functional fine particles with the fullerenol molecules for sapphire CMP

Murakawa Wataru, Oisi Takahumi, Khajornrungruang Panart, Suzuki Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2014 ( 0 ) 177 - 178 2014.01

Language：English Publishing type：Research paper (other academic)

Material Removal Rate of sapphire CMP using silica slurry with the fullerenol increase as the higher concentration of the fullerenol in the slurry. The surface roughness of the sapphire substrate gives the influence against the MRR of sapphire CMP. Raman spectra indicate that molecule structure did not change during CMP process. The structure of fine particle by silica particle and fullerenol in the liquid characterize using DLS method. As results, two layers fullerenol molecules are adsorbed on the silica particle. And we discuss on the fine particle with the fullerenol based on our results.

DOI： 10.1299/jsmemmt.2014.10.177

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110009939353

C30 Study on the material removal mechanism during chemical mechanical polishing Reviewed

Nagai Toshiyuki, Yahiro Shin, KHAJORNRUNGRUANG Panart, Suzuki Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2014 ( 0 ) 175 - 176 2014.01

Language：English Publishing type：Research paper (scientific journal)

The material removal mechanisms on the SiO_2-CMP have been studied to develop new slurries and polishing pads for the advanced ULSI devices. We focus on the chemical reacted layer at the surface of SiO_2 film because formation of the layer is effected by pH of the slurry. Relationship between the MRR (Material removal rate) and chemical reacted layer was suggested by the results of the CMP tests and SEM observations at various pH conditions from 7.5 to 12.5. The size of the SiO_2 fine particles increase as the higher pH reason because the surface of the SiO_2 fine particles might be changed during the CMP. In our report, we discuss the material removal mechanism based on the experimental result of the SEM observation on the SiO_2 fine particles.

DOI： 10.1299/jsmemmt.2014.10.175

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110009939352

724 Study on Cyclomachining as a New Method for Nano-selective Fabrication Reviewed

Soejima Kazuki, SUZUKI Keisuke

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2014 ( 0 ) _724 - 1_-_724-2_ 2014.01

Spatial Fourier Transform Analysis of Polishing Pad Surface Topography Reviewed

Panart Khajornrungruang, Keiichi Kimura, Takahisa Okuzono, Keisuke Suzuki, and Takashi Kushida

Japanese Journal of Applied Physics 51 ( 5 ) 2012.05

High precision tool cutting edge monitoring using laser diffraction for on-machine measurement Reviewed

6 ( 2 ) 163 - 167 2012.01

Slurry Supplying Method for Large Quartz Glass Substrate Polishing Reviewed

Panart Khajornrungruang,Keiichi Kimura,Ryuji Yui,Nagisa Wada,Keisuke Suzuki

Japanese Journals of Applied Physics 50 ( 5 ) 2011.05

Evaluation method applying Fourier transform analysis for conditioned polishing pad surface topography Reviewed

5 ( 2 ) 173 - 178 2011.03

Study on Sapphire Chemical Mechanical Polishing using mixed abrasive slurry with fullerenol Reviewed

294 - 295 2010.12

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Papers - SUZUKI Keisuke