Conference Prsentations (Oral, Poster) -
-
Nano-Sized Particle Identification using Evanescent Field
Panart Khajornrungruang
Center for Advanced Materials Processing's Fall Meeting 2013 Clarkson University
-
Study on CMP Micro Patterned pad Fabricated by MEMS Technology:Fabrication of Micro Patterned Pad using Ni plated mold
Isono Shintaro, Suzuki Keisuke, Ito Takahiro, Khajornrungruang Panart, Urabe Masakazu, Kimura Keiichi, Tashiro Yasunori, Oniki Takahiro
Proceedings of JSPE Semestrial Meeting
-
1001 Study on the efficiency of the SiO2-CMP using microbubble
Nagaoka Atsushi, Panart Khajornrungruang, Kimura Keiichi, Suzuki Keisuke
The Proceedings of Conference of Kyushu Branch
-
21210 Study on slurry degradation factors during Cu-CMP
FUKAGAWA Hironobu, SUZUKI Keisuke, KIMURA Kenchi, Kajornrungraung Panart, HIYAMA Hirokuni
The Proceedings of Conference of Kanto Branch
-
21211 Study on mechanism of polishing pad surface dressing
KOREZAWA Tatsuya, KIMURA Keichi, SUZUKI Keisuke, Panart KHJAOMNRUNGRUANG, HIYAMA Hirokuni, MATSUO Hisanori
The Proceedings of Conference of Kanto Branch
-
水酸化フラーレンを利用したサファイアCMP高効率研磨手法に関する研究
河北 誠也, 山城 天心, 木村 景一, カチョーンルンルアン パナート, 鈴木 恵友
精密工学会学術講演会講演論文集
-
Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform (4th report)
Kushida Takashi, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke, Tajiri Takahiro
Proceedings of JSPE Semestrial Meeting
-
Study on Variable Rotation Polishing in CMP Process (1st report)
Phaisalpanumas Pipat, Keiichi Kimura, Keisuke Suzuki, Khajornrungruang Panart
精密工学会学術講演会講演論文集
-
Study on material removal mechanism for SiO<sub>2</sub>-CMP
Takano Yuichi, Suzuki Keisuke, Panart Khajornrungruang, Kimura Keiichi
Proceedings of JSPE Semestrial Meeting
-
水酸化フラーレ ン混合スラリー によるサファイ アCMPに関する研究̶材料除去メカニズムの検討̶
齊藤貴志
2012年度精密工学会全国春季大会
-
Study on measurement of micro tool using of laser light
Yashima Hirokazu, Kimura Keiichi, Panart Khajornrungruang, Suzuki Keisuke
Proceedings of JSPE Semestrial Meeting
-
1721 Observation and analysis on dynamic behavior between a wafer and a polishing pad
KIMURA Keiichi, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke, YAMANE Yasushi
The Proceedings of Conference of Kanto Branch
-
1722 Study on material removal mechanism in SiO_2-CMP : Adsorption characteristics of abrasive particles in SiO_2-CMP
TANAKA Akiho, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart, TAKANO Yuichi, KIMURA Keiichi
The Proceedings of Conference of Kanto Branch
-
606 Study on dressing mechanism R)r the polishing pad surface
KOREZAWA Tatsuya, Kimura Keiichi, Suzuki Keisuke, Panart Khajornrungruang, Matsuo Hisanori, wada Yutaka, Hiyama Hirokuni, Fukunaga Akira
The Proceedings of Conference of Kyushu Branch
-
Study on phenomenon on polishing surface in Oxide-CMP applying Evanescent field
Idei Yoshikazu, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke, Sakoda Suguru
Proceedings of JSPE Semestrial Meeting
-
Study on Sapphire CMP slurries using fullerenol as fine particles
Saito Takashi, Suzuki Keisuke, Panart Khajornrungruang, Karasudani Erika, Kimura Keiichi
Proceedings of JSPE Semestrial Meeting
-
Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform (2nd report)
Kushida Takashi, Kimura Keiichi, Panart Khajornrungruang, Suzuki Keisuke
Proceedings of JSPE Semestrial Meeting
-
光学的フーリエ変換に基づくCMP用ポリシングパッドの表面形状評価に関する研究(第三報)
櫛田 高志, 木村 景一, カチョーンルンルアン パナート, 鈴木 恵友, 田尻 貴寛
精密工学会学術講演会講演論文集
-
Study on material removal mechanism for SiO<sub>2</sub>-CMP
Takano Yuichi, Suzuki Keisuke, Khajornrungruang Panart, Kimura Keiichi
Proceedings of JSPE Semestrial Meeting
-
CMP用マイクロパターンパッドの開発
磯野 慎太郎, 木村 景一, 鈴木 恵友, カチョーンルンルアン パナート, 占部 正和
精密工学会学術講演会講演論文集