Conference Prsentations (Oral, Poster) -
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K42 Study on thickness measurement method of slurry layer betWeen Polishing pad and wafer in CMP process
YAMANE Yasushi, Kimura Keiichi, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart
The Proceedings of Conference of Kyushu Branch
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K24 Study on friction between wafer and polishing pad in CMP process
Yui Ryuji, Kimura Keiichi, Suzuki Keisuke, Khajornrungruang Panart
The Proceedings of Conference of Kyushu Branch
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220402 Observation of fine particles motion during CMP process by evanescent field
IDEI Yoshikazu, KIMURA Keiichi, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart, Johyama Jyunki
The Proceedings of Conference of Kanto Branch
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Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform
Kushida Takashi, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke
Proceedings of JSPE Semestrial Meeting
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Study on Sapphire CMP slurries using fullerenol as fine particles
Saito Takashi, Suzuki Keisuke, Panart Khajornrungruang, Karasudani Erika, Kimura Keiichi
Proceedings of JSPE Semestrial Meeting
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Study on fine particle behavior in SiO<sub>2</sub> film CMP using evanescent field
Idei Yoshikazu, Kimura Keiichi, Suzuki Keisuke, Khajornrungruang Panart
Proceedings of JSPE Semestrial Meeting
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MEMS技術を応用したCMP用マイクロパターンパッドの研究
安田 佳祐, 木村 景一, 鈴木 恵友, カチョーンルンルアン パナート, 磯野 慎太郎
精密工学会学術講演会講演論文集
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K44 Study on Material removal mechanism in CMP using Atomic Force Microscope
TANAKA Akiho, KIMURA Keiichi, SUZUKI Keisuke, KHAJORNRUNGRUANG Panart, TAKAHASHI Suguru
The Proceedings of Conference of Kyushu Branch
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K22 Study on Al203-CMP using mixed fullerene hydroxide slurry
Saito Takashi, Kimura Keiichi, Suzuki Keisuke, Khajornrungruang Panart
The Proceedings of Conference of Kyushu Branch
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Evaluation of Conditioned Polishing Pad Surface Topography based on Fourier Transform Analysis and its Polishing Characteristic
Okuzono Takahisa, Kimura Keiichi, Khajornrungruang Panart, Suzuki Keisuke, Kushida Takashi
Proceedings of JSPE Semestrial Meeting
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FFTを用いた研磨パッドの表面トポグラフィー解析
カチョーンルンルアン パナート
可視化情報学会全国講演会
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CMPプロセス中のウェハ面内における温度測定およびスラリー流れの可視化
由井隆司
可視化情報学会全国講演会
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SiO2系膜のCMPにおける材料除去メカニスムの研究―第1報スラリー中のSiO2微粒子の材料除去作用―
木村景一
2010年度精密工学会全国秋季大会
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レーザ回折光による高速回転中の工具先端と被加工物間の距離計測
カチョーンルンルアン パナート
2010年度精密工学会全国秋季大会
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An Attempt on Conditioned Polishing Pad Surface Evaluation with FFT Analysis
Keiichi Kimura
The 15th International Symposium on Chemical-Mechanical Planarization (CAMP)
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20305 Study on material removal model in CMP process : 4th report : Study on functionality of fine particles in slurry for oxide CMP process
Hashiyama Yuuichi, Kimura Keiichi, Khajornrungruang Panart
The Proceedings of Conference of Kanto Branch
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307 Study on Micro Pattern Pad Applied with MEMS Technology : Comparison of Polishing Rates with Two Types Polishing Pads
Yasuda Keisuke, Kimura keiichi, Khajornrungruang Panart, Tanaka Akiho
The Proceedings of Conference of Kyushu Branch
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Study on Slurry Flow in CMP Process for Large Quadrilateral Quartz Glass Substrate
Wada Nagisa, Kimura Keiichi, Khajornrungruang Panart
Proceedings of JSPE Semestrial Meeting
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Gap Measurement between High Speed Rotating Tool Tip and Workpiece by Laser Diffraction
Khajornrungruang Panart, Kimura Keiichi, Suzuki Keisuke
Proceedings of JSPE Semestrial Meeting
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Study on FFT Analysis for Surface Topography of Conditioned Polishing Pad for CMP
Okuzono Takahisa, Kimura Keiichi, Panart Khajornrungruang
Proceedings of JSPE Semestrial Meeting