Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

Division display181 - 200 of about 221／ All the affair displays >>

Study on CMP Micro Patterned Pad Fabricated by MEMS Technology (1st Report):Fabrication of Micro Pyramid Pattern Pad

Takahashi Naoaki, Kimura Keiichi, Khajornrungruan Panart, Yasuda Keisuke, Baba Akiyoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2008 ( 0 ) 843 - 844 2008.01

K14 Study of Fabricated Micro Pattern Pad using CMP MEMS Technology : Characteristic Evaluation of Micro Pattern Pad Surface

Takahashi Naoaki, Kimura Keiichi, Panart Khajornrungruan

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2008 ( 0 ) 355 - 356 2008.01

K13 Study on Temperature Change of Wafer and Polishing pad in Chemical Mechanical Polishing

Ueno Kazuki, Wada Nagisa, Kimura Keiichi, Panart Khajornrungruang

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2008 ( 0 ) 353 - 354 2008.01

K12 Influence on UV irradiation on to single crystal SiC. surface

Matsumoto Tadashi, Kimura Keiichi, Panart Khajornrungruang

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2008 ( 0 ) 351 - 352 2008.01

K11 Study on UV-Polishing of PCD using ArF Excimer Laser

Koutake Yoshihiro, Kimura Keiichi, Panart Khajornrungruang

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2008 ( 0 ) 349 - 350 2008.01

Contact between Polishing Pad and Wafer in Chemical Mechanical Polishing.

Sumomogi Nobutaka, Kimura Keiichi, Khajornrungruang Panart, Ueno Kazuki

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2008 ( 0 ) 183 - 184 2008.01

Study on Temperature rise at Wafer and Polishing pad surface in Chemical Mechanical Polishing (1st report)

Ueno Kazuki, Kimura Keiichi, Khajornrungruang Panart, Koi Yuto, Wada Nagisa

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2008 ( 0 ) 839 - 840 2008.01

A Computational Study on Slurry Flow between a Wafer and CMP Pad with Grooves Reviewed

Katsuya Nagayama, Hirofumi Morishita, Keiichi Kimura, Kazuhiro Tanaka, Panart Khajornrungruang and Yousuke Inatsu

TOWARDS SYNTHESIS OF MICRO-/NANO-SYSTEMS 277 - 280 2007.10

Study on Material Removal Phenomena in CMP Process Reviewed

2007.10

高精度金型加工のためのオンマシンマイクロ工具計測

パナート・カチョーンルンルアン

型技術 ( 日刊工業新聞社 ) 22 ( 9 ) 25 - 29 2007.08

Study on Polishing Characteristics in High Temperature Chemical Mechanical Polishing for SiC Ceramics Reviewed

Panart Khajornrungruang,Hidenori Matano,Tadashi Matsumoto and Keiichi Kimura

International Journal for Manufacturing Science and Technology 9 ( 1 ) 29 - 34 2007.06

Study on Material Removal Phenomena in CMP Process Reviewed

Keiichi Kimura,Yuichi Hashiyama,Panart Khajornrungruang,Hirokuni Hiyama and Yoshihiro Mochizuki

2007 International Conference on Planarization/CMP Technology (ICPT 2007) 2007.04

Development of On-machine Micro Tool Measurement Device using Laser Diffraction

Khajornrung-ruang Panart, Kimura Keiichi, Miyoshi Takashi, Takaya Yasuhiro, Ueda Masahiro

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2007 ( 0 ) 305 - 306 2007.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

According to advanced functionality in a wide variety of equipments in these days, ultra precision, high complexity and high efficiency of fine-fabrications are required. Not only performance of machining center but also downsizing of cutting tool and the on-machine tool measurement have been an important issue to realize these fabrications. In this article, on-machine tool measurement technique using laser diffraction, which is applicable for on-machine measurement has been establishing and developing. The developed on-machine measurement device dimension is 150 mm×200 mm×135 mm, installable into machining center. Next, tool measuring experiments are carried out in order to evaluate tool-measurement performance of the developed device. Experimental results imply the measurement uncertainty(2σ) is less than 100 nm and the tool tip displacement error is less than 200 nm. Hence, it is considered that the measurement precision of the developed on-machine device is sufficient for tool measurement inside the next generation of machining center.

DOI： 10.11522/pscjspe.2007S.0.305.0

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130005028443

21711 A study on material removal model in CMP process

Hashiyama Yuuichi, Kimura Keiichi, Khajomrungruang Panart

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 237 - 238 2007.01

Language：Japanese Publishing type：Research paper (other academic)

The material removal mechanism on Chemical Mechanical Polishing is not clarified yet. Accordingly, it is difficult to build up a systematic CMP process simulation system. In order to develop CMP process simulation system, it is necessary to establish "material removal model" among wafer surface, polishing pad surface and fine particles in slurry. In the study, we are proposing material removal model for SiO_2 layer. Chemical adsorption between fine particles and wafer and between fine particles and polishing pad is an important factor for the material removal mechanism.

DOI： 10.1299/jsmekanto.2007.13.237

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110007083467

H44 Influence on UV irradiation on to single crystal SiC

Matsumoto Tadashi, Kimura Keiichi, Khajornrungruang Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 301 - 302 2007.01

H43 Study on Ultraviolet irradiation polishing for Cu-CMP

Kuzuma Hayato, Kimura Keiichi, Khajornrungruang Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 299 - 300 2007.01

H42 CMPにおけるスラリーフロー可視化に関する研究 : ポリシングパッド溝パターン設計の指針(H4 加工・生産システム4(CMPとその応用))

稲津陽介, 木村景一, カチョーンルンルアンパナート, 松永健助

日本機械学会九州支部講演論文集 ( 一般社団法人日本機械学会 ) 2007 ( 0 ) 297 - 298 2007.01

Language：Japanese Publishing type：Research paper (other academic)

CMPにおいてポリシングパッド-ウェハ聞のスラリーの迅速な供給・排出およびポリシングパッド-ウェハ間のスラリーの流量分布が研磨特性に重大な影響を与える.ポリシングパッド-ウェハ間のスラリーフローの制御を行うため,ポリシングパッド上に形成する溝パターンの適切な設計方法が重要となる.本報告では同心円状溝パターン,放射状溝パターンの溝寸法を変化させて,ポリシングパッド-石英ガラス問のスラリーフロー可視化実験を行い,パッド溝パターン設計法の指針について考察した.

DOI： 10.1299/jsmekyushu.2007.60.297

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110007112971

H41 Fundamental Study on High Temperature Chemical Mechanical Polishing for SiC Ceramics

MATANO Hidenori, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 295 - 296 2007.01

Study on groove pattern layout for slurry flow control in CMP process Reviewed International journal

Kimura K., Nagayama K., Morishita H., Inatsu Y., Khajornrungruang P.

Advanced Metallization Conference (AMC) 2006 571 - 576 2006.12

A lodestar on pad groove pattern design with slurry flow analysis and visualization experiments in CMP process Reviewed

K. Kimura,K. Nagayama,Y. Inatsu,P. Khajornrungruang

2006 International Conference on Planarization/CMP Technology (2006 ICPT) 2006.10

　 PREV - NEXT 　

<KHAJORNRUNGRUANG, Panart>

Papers - KHAJORNRUNGRUANG, Panart