Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

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Study on Material Removal Model in Oxide CMP process Reviewed

Yuuichi Hashiyama,Panart Khajornrungruang,Keiichi Kimura

Asian Symposium for Precision Engineering and Nanotechnology 2009 (ASPEN 2009) 2009.11

Cu-CMP Assisted with Ultra Violet Light Irradiation Directly to Wafer Surface Reviewed

Panart Khajornrungruang,Keiichi Kimura and Nobutaka Sumomogi

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 247 - 251 2009.11

Development of Arrayed Micro Pattern on Polishing Pad Surface Applied with Anisotropic Etching Reviewed

Keisuke Yasuda,Keiichi Kimura,Akiyoshi Baba,Panart Khajornrungruang,Akiho Tanaka

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 461 - 466 2009.11

Study on Slurry Flow in CMP Process for Large Quadrilateral Quartz Glass Substrate Reviewed

Nagisa Wada,Panart Khajornrungruang,Keiichi Kimura

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 455 - 460 2009.11

Study of functionality of fine particles in slurry for oxide CMP process Reviewed

Yuuichi Hashiyama,Panart Khajornrungruang,Keiichi Kimura

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 370 - 374 2009.11

Evaluation Method for Surface Topography of Conditioned Polishing Pad based on Fourier Transform Reviewed

Takahisa Okuzono,Panart Khajornrungruang,Yoshikazu Idei and Keiichi Kimura

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 449 - 454 2009.11

角形石英ガラス研磨におけるスラリー流れに関する研究 Reviewed

橋山雄一，木村景一，カチョーンルンルアン・パナート

砥粒加工学会 53 ( 9 ) 578 - 582 2009.09

Study on slurry flow in quadrilateral silica glass polishing Reviewed

HASHIYAMA Yuuichi, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

Journal of the Japan Society for Abrasive Technology 53 ( 9 ) 578 - 582 2009.09

Study on slurry flow in quadrilateral silica grass polishing Reviewed

HASHIYAMA Yuuichi, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 53 ( 9 ) 578 - 582 2009.01

Language：Japanese Publishing type：Research paper (scientific journal)

In liquid crystal display panel production, the silica glass photo mask in the photolithography process is becoming larger, and planarity improvement of the silica glass photo mask is required. Planarization of the mask surface requires polishing. However, the polishing of large-sized silica glass involves nonuniform slurry flow under the glass. In this study, we visualized the slurry flow in polishing of a square of silica glass to realize uniform slurry flow. Furthermore, we visualized the slurry flow with various grooved polishing pads and examined the slurry flow between the silica glass and pad surface.

DOI： 10.11420/jsat.53.578

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130004494500

Study on CMP polishing characteristic with Ultraviolet light irradiation

Sumomogi Nobutaka, Kimura Keiichi, Panart Khajornrungruang

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2009 ( 0 ) 305 - 306 2009.01

Study on effects of ultraviolet irradiation in Cu-CMP:Observation and investigation of reactions during ultraviolet irradiation of Cu wafer

Murali Rao, Sumomogi Nobutaka, Kimura Keiichi, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2009 ( 0 ) 1015 - 1016 2009.01

レーザー回折を用いた工具切れ刃位置のオンマシン計測の研究:2波長レーザによる測定精度向上への試み

吉廣俊志, 木村景一, KHAJORNRUNGRUANG PANART

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2009 ( 0 ) 815 - 816 2009.01

Language：Japanese Publishing type：Research paper (other academic)

近年の工業製品の高度機能化に伴い，工作機械による加工精度のみならず，加工工具そのものの小型化及び高精度化，さらには機上での工具管理が重要な課題となっている．本研究では，レーザの回折現象を用いた非接触かつ高精度な工具測定方法及び小型で機上に搭載できる装置の研究開発を行っている．本稿では，波長の異なる2つのレーザ光を用い，2個の同時測定データから工具位置測定のさらなる高精度化を試みたので報告する．

DOI： 10.11522/pscjspe.2009S.0.815.0

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130005029877

21107 Study on material removal model in CMP process : 3nd report-Investigation of material removal phenomenon with fine particle in slurry

Hashiyama Yuuichi, Kimura Keiichi, Khajornrungruang Panart

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2009 ( 0 ) 461 - 462 2009.01

Language：Japanese Publishing type：Research paper (other academic)

The material removal phenomenon in CMP process is not clarified yet. Therefore, the appropriate material removal model has not established. In this study, the interaction among wafer surface, polishing pad surface and fine particles in slurry was observed and material removal mechanism was investigated. In this report. the property of SiO_2 film in alkalinity solution was investigated with AFM indentation. In pH8.5 solution. SiO_2 film in KOH solution is softer than SiO_2 film in NH_4OH. In pH10 solution, a property of SiO_2 film in KOH solution is quite simillar to a property of SiO, film in NH_4OH solution. This fact suggests that in pH10 solution SiO_2 film changes soft film, the a chemical reaction layer in KOH solution is the same as a chemical layer solution in NH_4OH.

DOI： 10.1299/jsmekanto.2009.15.461

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110007722430

S1303-1-4 On-Machine Tool Measurement Precision Improvement using dual wavelength laser diffraction

Khajornrungruang Panart, Kimura Keiichi, Yoshihiro Shunji

The proceedings of the JSME annual meeting ( The Japan Society of Mechanical Engineers ) 2009 ( 0 ) 273 - 274 2009.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

In these days, ultra precision, high complexity and high efficiency of fine-fabrication using cutting tool are required. Not only performance of machine tool but also downsizing of high accurate working tool itself has been an important issue to realize the requirements. In this study, on-machine tool measurement technology using laser diffraction which is able to manage micro tool and able to post in the machine tool has been establishing. In this article, the on-machine tool measurement device applying dual wavelength is developed. We use the developed tool measurement device, installable size for machining center, to evaluate fundamental measurement performance.

DOI： 10.1299/jsmemecjo.2009.4.0_273

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110007861922

Study on CMP Micro Patterned Pad Fabricated by MEMS Technology(2nd Report)

Takahashi Naoaki, Kimura Keiiti, Khajornrungruang Panart, Yasuda Keisuke, Baba Akiyoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2009 ( 0 ) 1027 - 1028 2009.01

H13 Study on observation methods for contact configuration between polishing pad and wafer under wet condition in CMP

Okamoto Eiichiro, Kimura Keiichi, Khajornrungruang Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2009 ( 0 ) 247 - 248 2009.01

H12 Study on slurry flow in CMP process for large quadrilateral quartz glass substrate

Wada Nagisa, Kimura Keiichi, Khajomrungruang Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2009 ( 0 ) 245 - 246 2009.01

H11 Polishing characteristic on Cu-CMP with Ultraviolet light irradiation

Sumomogi Nobutaka, Kimura Keiichi, Khajornrungruan Panart, Appalasamy Murari Rao

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2009 ( 0 ) 243 - 244 2009.01

Mechanical property of copper complexing film and interaction between SiO<sub>2</sub> particle in slurry and the film

Imamura Akira, Kimura Keiichi, Panart Khajornrungruang, Hashiyama Yuichi, Hiyama Hirokuni, Mochizuki Yoshihiro

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2009 ( 0 ) 1021 - 1022 2009.01

Study on Temperature Rise at Wafer and Polishing pad surfacein Chemical Mechanical Polishing (2nd report)

Ueno Kazuki, Kimura Keiichi, Khajornrungruang Panart, Koi Yuto

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2009 ( 0 ) 1041 - 1042 2009.01

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Papers - KHAJORNRUNGRUANG, Panart