Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

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作用表面上におけるナノスケール現象の化学的実時間観測に関する研究:第1報:ラマン分光光度計の開発

ドバンタン, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 622 - 623 2020.01

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

This paper reports development of an optical apparatus for Real-time observation during chemical reactions in Nano-scale process on surface such as CMP (Chemical-Mechanical polishing) and catalysis by applying in evanescent field. Beside using evanescent field to observe Nano-particles in physical aspects, the developed Raman spectroscopy apparatus aims to observe chemical aspects during reactions on processing surface. Changes in Raman scattering spectrum is expected to understand chemical reactions on the processing surface. In this report, the 532 nm wavelength laser source will be used to generate evanescent field. A rotation stage of diffraction grating and a translation stage will used to optimize the Raman spectrum data.

DOI： 10.11522/pscjspe.2020S.0_622

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007896772

ナノスケールにおける加工現象可視化に関する研究:第6報:単一ナノ粒子の三次元目変位の検証

ブラットラーアラン, カチョーンルンルアンパナート, 鈴木恵友, パームパッデーチャークンティティパット

精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 588 - 589 2020.01

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

The nanoscale phenomena, such as chemical mechanical polishing (CMP) process, present near the surface. A three-dimensional nanoparticle tracking could explain the phenomena that happen in the polishing process. From our previous report, we have investigated the three-dimensional motion of an individual standard nanoparticle by using optical method, but the height Z on the third dimension was not accurately verified. In this report, the sub-100 nm individual nanoparticles were fixed on the tip which the tip was connected to the piezo actuator for controlling the height Z displacement. The multi-wavelength evanescent fields with optical microscopy system is also applied in the experiment for three-dimensional nanoparticle tracking. The scattering light from nanoparticle will exponentially increase when the nanoparticle on the tip was downward moved close to the reference surface. Finally, The height Z uncertainty could be measured approximately ±25 nm and the penetration height measurability were 200 nm far from the reference surface. We could three-dimensionally track the individual standard nanoparticle in recording speed higher than 50 frames per second for exposure time less than 10 milliseconds.

DOI： 10.11522/pscjspe.2020S.0_588

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007896683

Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, HAMADA Satomi, WADA Yuutaka, HIYAMA HIYAMA

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2020 ( 0 ) 17E02 2020.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

Cleaning phenomena in semiconductor manufacturing is about the nano-contamination being repelled out from, or adhering to, the wafer surface. However, residual contamination on the wafer has been usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light generated by internal reflection. This article introduces some of observed physical phenomena during duplicated cleaning process in both contact cleaning by a PVA brush and non-contact cleaning by mega-sonic wave.

DOI： 10.1299/jsmekanto.2020.17E02

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007994424

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:2nd report : Non-contact Removal of Abrasive Nano-particles during Enforcing Mega sonic

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Permpatdechakul Thitipat, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 660 - 661 2020.01

Three-dimensional tracking and height verification of polystyrene particles with piezo actuator positioning by means of multi-wavelength evanescent fields Reviewed

Blattler A., Khajornrungruang P., Suzuki K., Permpatdechakul T.

Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020 53 - 56 2020.01

3D trajectories and diffusion of single ceria particles near a glass surface and their removal Reviewed

Seo J., Gowda A., Khajornrungruang P., Hamada S., Babu S.V.

Journal of Materials Research 2020.01

Hydropower plant generator system model using labVIEW Reviewed International journal

Tammaruckwattana S., Reangkittakarn S., Khajornrungruang P., Phaisalpanumas P., Rerkratn A.

Proceeding - 5th International Conference on Engineering, Applied Sciences and Technology, ICEAST 2019 2019.07

Study on Relationship of the Material Removal Amount and the Increase in Abrasive Nanoparticle Size during Si-CMP Reviewed International journal

Boripatkosol S., Bun-Athuek N., Khajornrungruang P., Suzuki K., Chanthawong N., Phaisalpanumas P.

ESIT 2018 - 3rd International Conference on Engineering Science and Innovative Technology, Proceedings 2019.03

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field Reviewed

Terayama Yutaka, Kusatsu Kohei, Morita Rintaro, Khajornrungruang Panart, Wada Yutaka, Hamada Satomi, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2019S ( 0 ) 138 - 139 2019.03

Characteristic Evaluation of Scattering Light from Cutting edge in Evanescent Field by Using Numerical Simulation Method

Aramaki Hirochika, Khajornrungruang Panart, Suzuki Keisuke, Taira Kanako

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2019S ( 0 ) 904 - 905 2019.03

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale

Blattler Aran, Khajornrungruang Panart, Suzuki Keisuke, Permpatdechakul Thitipat

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2019S ( 0 ) 459 - 460 2019.03

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

The nanoparticle is popularly used for chemical mechanical polishing process (CMP) in semiconductor industry. There are many unknown phenomena in nanoparticles moving during polishing process. Therefore, we have been studying the phenomena by using optical method on 3D position tracking of nanoparticle in real-time measurement. In this report, the gold 50 nm standard particles would be observed to determine the 3D motion tracking of individual nanoparticle. According to our previous studies, the single wavelength of evanescent light field is hard to determine the 3D spatial position of each nanoparticle. Thus, the multi-wavelength of scattering light is applied in the experiment. The scattering light will occur when the particle moving near to the reference surface. Finally, the 3D position tracking results of standard nanoparticle will be investigated and discussed by the exponential relationships between the detected scattering light and the measured depth Z values.

DOI： 10.11522/pscjspe.2019s.0_459

CiNii Article

CiNii Research

Research on high speed polishing technology using electrode embedded type low refractive transparent pad Reviewed

Kato Yuya, Ryunosuke Matsumoto, Suzuki Keisuke, Panart Khajornrungruang

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) D39 2019.01

Language：English Publishing type：Research paper (scientific journal)

The manufacturing process of the transparent pad was developed by the thermal imprint method equipped with a special jig for controlling the thickness, pattern and electrode structure. Particle behavior is controlled by the electric field using a wire mesh inserted into a low index transparent polishing pad. As a result, the movement of hybrid particles of diamond particles and silica particles can be observed in an electric field using a digital microscope. Furthermore, in the polishing experiment, it was possible to obtain a higher amount of material removal in the presence of the electric field than in the absence of the electric field.

DOI： 10.1299/jsmemmt.2019.13.D39

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007836392

Study on processing method using superconductive assisted machining method

NAKASHIMA Hidetaka, NAKASAKI Tatsuya, TANAKA Yuki, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) D38 2019.01

Language：Japanese Publishing type：Research paper (other academic)

In recent years, superconductive assisted machining method (SUAM) using a magnetic levitation tool utilizing a superconducting phenomenon such as pinning effect has been developed to reduce tool interference on the conventinal procceing method. Measurement of the force by the magnetic levitation tool is evauated in the air to determind polishing conditions. In our study, polishing test were performed not only on aluminum plate but also stainless steel plate using fixed and loose abrasives. As a result, the superconductive assisted machining method was applicable to stainless steel material.

DOI： 10.1299/jsmemmt.2019.13.D38

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007836391

点滴流量精密計測の研究:Z値による画像処理とレンズ収差の影響

高市峻佑, カチョーンルンルアンパナート, 伊藤高廣, 村上直

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2019 ( 0 ) 476 - 477 2019.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (other academic)

病院などで使用されている点滴装置は，流量を一定に保つために正確な流量測定が必要である．特に，抗がん剤などの副作用がある薬液を使用する場合には，より正確性が求められている．現在使用されている点滴測定装置は，液滴の濃度が高いと精度が悪化するというデメリットがあるため，液滴の種類によらず測定できる測定手法が求められている．本研究では，画像処理を使用した体積推定により，液滴の体積を測ることを目的とした．

DOI： 10.11522/pscjspe.2019A.0_476

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007800991

Study on Real Time Phenomenon Observation of Nano-Particle Adhesion and Removal by Evanescent Light

MORITA Rintarou, Khajornrungruang Panart, TERAYAMA Yutaka, KUSATSU Kohei, HIYAMA Hirokuni, WADA Yuutaka, HAMADA Satomi

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 18A02 2019.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (other academic)

The study on removal mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. An optical method has been applied to visualize only the nano-particles moving near to a surface by an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. The removal phenomena of the SiO2 particles (105 nm) on the BK7 glass surfaces were observed by our developed experimental setup. The SiO2 particles removal with ultrasonic (approx. 1 MHz) was demonstrated.

DOI： 10.1299/jsmekanto.2019.25.18A02

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007712645

The Performance Evaluation of Developed Apparatus for Observing the Nanoparticles Phenomena During CMP Process by Applying Evanescent Field

Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Taira Kanako

日本機械学会九州支部講演論文集 ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) A42 2019.01

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

In this paper, the performance evaluation of developed in-situ apparatus for real-time observation were studied. The apparatus could observe the nanoparticles phenomena on surface between substrate and polishing pad that is essential to improve the Material Removal Rate (MRR) of the substrate during Chemical Mechanical Polishing (CMP) process. We propose the single wavelength by applying an evanescent field in order to observe the nanoparticles phenomena. The experimental condition were separated into two experiments, as different size (sub 10 nm and 105 nm) silica slurry ( 5 wt% with pH 10.5) with pure water (pH 10.5). According to the experimental result, the our apparatus could detect the scattering light intensity of pure water and silica slurry during polishing process. The silica slurry are higher scattering light intensity than pure water, and sub 10 nm silica slurry is highest intensity.

DOI： 10.1299/jsmekyushu.2019.72.A42

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007801889

Study on Organic Fibers in The Polishing Pad for Sapphire Chemical Mechanical Polishing

Chansatarpornkul Sansuwan, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering ) 2019 ( 0 ) 18 - 19 2019.01

Language：English Publishing type：Research paper (other academic)

Chemical mechanical polishing (CMP) is an essential process in the manufacturing of sapphire substrate that needs to achieve a smooth planar surface without subsurface damage. Definitely, the polishing pad is one of the dominant factors in the polishing. In recent years, there are trends to decrease the synthases material that formed by chemical production for our world environment. The organic fibers are having uniform structure, easy to fabricate from the natural or waste product from agro-industry or food industry, and can be control the diameter from micro unit until nano size such as cellulose nanofibers. This study aims to developed polishing pad with organic polishing pad from the several kinds of fibers such as; bamboo, sugarcane bagasse, banana, and pineapple fibers. As a result, naturally SiO2-contained fiber types that were bamboo and bagasse, performed considerably higher material removal rate (MRR) more than a conventional pad by 157% and 191% respectively. On the other hand, none-SiO2 fiber type (banana, pineapple) did not perform MRR completely. Therefore, we conclude that the SiO2 in the organic fibers could improve a material removal rate of sapphire CMP.

DOI： 10.11522/pscjspe.2019A.0_18

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007800812

Real time nanoscale cleaning phenomenon observation during PVA brush scrubbing by evanescent field Reviewed International journal

Terayama Y., Khajornrungruang P., Suzuki K., Kusatsu K., Hamada S., Wada Y., Hiyama H.

ECS Transactions 92 ( 2 ) 191 - 197 2019.01

FDTD Simulation for Analysing Scattering Light Characteristic of Moving Nano-particle in Evanescent Field

Khajornrungruang PANART, SUZUKI Keisuke, TAIRA Kanako, ARAMAKI Hirochika

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) D18 2019.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

In surface fabrication process, such as the polishing in semiconductor substrate, there are many nano-particles moving on or nearby the surface to be polished. We have been establishing an optical method to observe and to track the 3-dimensional position of each dynamical moving nano-particle on time by applying an evanescent light field. In this report, the scattering light characteristic from a moving nano-particle in an evanescent field generated by internal reflection on a silica glass surface was analysed by FDTD (Finite Difference Time Domain) method on MATLAB. We discuss the scattering light from a particle moving perpendicularly to a surface in an interval time as one recorded frame in practical observation.

DOI： 10.1299/jsmemmt.2019.13.D18

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007836425

Visualization of Slurry Flow between Polishing Pad and Wafer in CMP (4th Report)

Fukuda Akira, Sekiduka Noriaki, Yamamoto Hiroki, Suzuki Keisuke, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018A ( 0 ) 295 - 296 2018.08

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Papers - KHAJORNRUNGRUANG, Panart