Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

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Study on Material Removal Phenomena in CMP Process Reviewed

Keiichi Kimura,Yuichi Hashiyama,Panart Khajornrungruang,Hirokuni Hiyama and Yoshihiro Mochizuki

2007 International Conference on Planarization/CMP Technology (ICPT 2007) 2007.04

Development of On-machine Micro Tool Measurement Device using Laser Diffraction

Khajornrung-ruang Panart, Kimura Keiichi, Miyoshi Takashi, Takaya Yasuhiro, Ueda Masahiro

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2007 ( 0 ) 305 - 306 2007.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

According to advanced functionality in a wide variety of equipments in these days, ultra precision, high complexity and high efficiency of fine-fabrications are required. Not only performance of machining center but also downsizing of cutting tool and the on-machine tool measurement have been an important issue to realize these fabrications. In this article, on-machine tool measurement technique using laser diffraction, which is applicable for on-machine measurement has been establishing and developing. The developed on-machine measurement device dimension is 150 mm×200 mm×135 mm, installable into machining center. Next, tool measuring experiments are carried out in order to evaluate tool-measurement performance of the developed device. Experimental results imply the measurement uncertainty(2σ) is less than 100 nm and the tool tip displacement error is less than 200 nm. Hence, it is considered that the measurement precision of the developed on-machine device is sufficient for tool measurement inside the next generation of machining center.

DOI： 10.11522/pscjspe.2007S.0.305.0

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130005028443

21711 A study on material removal model in CMP process

Hashiyama Yuuichi, Kimura Keiichi, Khajomrungruang Panart

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 237 - 238 2007.01

Language：Japanese Publishing type：Research paper (other academic)

The material removal mechanism on Chemical Mechanical Polishing is not clarified yet. Accordingly, it is difficult to build up a systematic CMP process simulation system. In order to develop CMP process simulation system, it is necessary to establish "material removal model" among wafer surface, polishing pad surface and fine particles in slurry. In the study, we are proposing material removal model for SiO_2 layer. Chemical adsorption between fine particles and wafer and between fine particles and polishing pad is an important factor for the material removal mechanism.

DOI： 10.1299/jsmekanto.2007.13.237

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110007083467

H44 Influence on UV irradiation on to single crystal SiC

Matsumoto Tadashi, Kimura Keiichi, Khajornrungruang Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 301 - 302 2007.01

H43 Study on Ultraviolet irradiation polishing for Cu-CMP

Kuzuma Hayato, Kimura Keiichi, Khajornrungruang Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 299 - 300 2007.01

H42 CMPにおけるスラリーフロー可視化に関する研究 : ポリシングパッド溝パターン設計の指針(H4 加工・生産システム4(CMPとその応用))

稲津陽介, 木村景一, カチョーンルンルアンパナート, 松永健助

日本機械学会九州支部講演論文集 ( 一般社団法人日本機械学会 ) 2007 ( 0 ) 297 - 298 2007.01

Language：Japanese Publishing type：Research paper (other academic)

CMPにおいてポリシングパッド-ウェハ聞のスラリーの迅速な供給・排出およびポリシングパッド-ウェハ間のスラリーの流量分布が研磨特性に重大な影響を与える.ポリシングパッド-ウェハ間のスラリーフローの制御を行うため,ポリシングパッド上に形成する溝パターンの適切な設計方法が重要となる.本報告では同心円状溝パターン,放射状溝パターンの溝寸法を変化させて,ポリシングパッド-石英ガラス問のスラリーフロー可視化実験を行い,パッド溝パターン設計法の指針について考察した.

DOI： 10.1299/jsmekyushu.2007.60.297

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110007112971

H41 Fundamental Study on High Temperature Chemical Mechanical Polishing for SiC Ceramics

MATANO Hidenori, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2007 ( 0 ) 295 - 296 2007.01

Study on groove pattern layout for slurry flow control in CMP process Reviewed International journal

Kimura K., Nagayama K., Morishita H., Inatsu Y., Khajornrungruang P.

Advanced Metallization Conference (AMC) 2006 571 - 576 2006.12

A lodestar on pad groove pattern design with slurry flow analysis and visualization experiments in CMP process Reviewed

K. Kimura,K. Nagayama,Y. Inatsu,P. Khajornrungruang

2006 International Conference on Planarization/CMP Technology (2006 ICPT) 2006.10

Study on groove pattern layout for slurry flow control in CMP process Reviewed

K. Kimura,K. Nagayama,H. Morishita,Y. Inatsu,P. Khajornrungruang

Advanced Metallization Conference 2006 (ADMETA 2006) ( CMP 5-16 ) 2006.09

A Computational Study on Slurry Flow between a Wafer and CMP Pad with Grooves Reviewed

Katsuya Nagayama,Hirofumi Morishita,Keiichi Kimura,Kazuhiro Tanaka,Panart Khajornrungruang,Yousuke Inatsu

The 11th International Conference on Precision Engineering (ICPE) 277 - 280 2006.09

小径工具切れ刃プロファイルの光回折オンマシン計測に関する研究（第2報，極小径工具(φ300μm)摩耗の測定評価） Reviewed

カチョーンルンルアン　パナート，三好隆志，木村景一，高谷裕浩，原田孝，砂金総一郎

日本機械学会論文集（C編） 72 ( 718 ) 1730 - 1737 2006.06

On-Machine Cutting Edge Profile Measurement for Micro Milling Tool (2nd Report, Micro Endmill (.PHI.300.MU.m) Wear Measurement and Evaluation):2nd Report, Micro Endmill (φ300μm) Wear Measurement and Evaluation Reviewed

KHAJORNRUNGRUANG Panart, MIYOSHI Takashi, TAKAYA Yasuhiro, HARADA Takashi, ISAGO Soichiro

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C ( The Japan Society of Mechanical Engineers ) 72 ( 6 ) 1730 - 1737 2006.06

Authorship：Lead author Language：English Publishing type：Research paper (scientific journal)

The extremely precise level of cutting work's demand has been increasing, recently. Therefore, the establishment of a supreme measurement technology for micro endmills during operating on ultra-precision machining center plays an important role in many micro fabrication industries. The “Diffraction Gauge Method”, a novel measuring technique based on far-field laser diffraction, has been proposed to measure cutting-edge profiles of micro tools (φ<500μm) with repeatability of better than 100 nm even though on-machine surroundings. In this paper, cutting-edge profile measurement of worn micro endmills (φ300μm), which operated side-milling on graphite work material, is carried out. Agreement of the measured profiles with SEM image confirms the high accuracy of the measurement technique. Subsequently, the tool wear evaluations in various cutting lengths of micro endmills before and after cutting notify the relationship between increase in tool wears and cutting length. These experimental results verify the validity of our novel micro endmill measurement technique, which can be applied into ultra-precision machining center in the near future.

DOI： 10.1299/kikaic.72.1730

Scopus

CiNii Article

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=33748329393&origin=inward

Study on Polishing Characteristics in High Temperature Chemical Mechanical Polishing for SiC Ceramics (Selected paper) Reviewed

Panart Khajornrungruang,Hidenori Matano,Tadashi Matsumoto and Keiichi Kimura

2006 International Conference on Micro/Nano Fabrication Technologies MNPX ( 12 ) 1 - 6 2006.05

Study on UV irradiation CMP process

Kuzuma Hayato, Fukuda Jyunya, Kimura Keiiti, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2006 ( 0 ) 523 - 524 2006.01

Micro Endmill Cutting–edge Profile Measurement for On–machine Monitoring using Laser Diffraction

Khajornrungruang Panart, Kimura Keiichi, Miyoshi Takashi, Takaya Yasuhiro

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2006 ( 0 ) 1103 - 1104 2006.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

Recently, much more micro–shaped milling work, such as die/mold and parts machining, with supreme precision has been required. Therefore, establishment of the high precision measurement technology for tool cutting–edge profile during operation is indispensable. The aim of our study is to develop a measurement technique, which is based on the far–field laser diffraction, in order to evaluate cutting–edge profiles of micro endmill as sub–micrometer precision. In addition, the technique is applicable for on–machine measurement due to simplicity and long working distance of the optical system. In this article, the measurements of poly–crystalline diamond (PCD) micro endmill diameters are curried out. The measured results show the validity of measurement method and the measurement repeatability.

DOI： 10.11522/pscjspe.2006S.0.1103.0

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130005027134

20102 An attempt on polishing pad surface modeling in Chemical Mechanical Polishing

Hashiyama Yuuichi, Kimura Keiichi, Panart Khajomrungruang

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2006 ( 0 ) 25 - 26 2006.01

Language：Japanese Publishing type：Research paper (other academic)

The material removal mechanism of Chemical Mechanical Polishing has a lot of unidentified aspects which are not yet clarified. Moreover, it is very difficult to build up the systematic simulation system on the mechanism. It is indispensable to model the contact mechanism among abrasive particles, surface of wafer and surface of polishing pad in order to construct a simulation system in CMP. However, the conventional modeling of polishing pad surface is not appropriate for the simulation. In this research, by observing the surface of the polishing pad, a model of the polishing pad surface was proposed. Further, the relationship was considered between the surface structure of polishing pad and material removal mechanism.

DOI： 10.1299/jsmekanto.2006.12.25

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110006638491

Study on Chemical Mechanical Polishing for SiC Ceramics

Matano Hidenori, Kimura Keiiti, Khajornrungruang Panart, Matumoto Tadashi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2006 ( 0 ) 559 - 560 2006.01

Study on slurry flow visualization in CMP process

Inatu Yousuke, Koutake Yoshihiro, Kimura Keiiti, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2006 ( 0 ) 537 - 538 2006.01

316 Development of On-machine Micro Tool Measurement Device using Laser Diffraction : Fundamental Characteristics of Measurement Device

KHAJORNRUNGRUANG Panart, Kimura Keiichi, MIYOSHI Takashi, TAKAYA Yasuhiro, Ueda Masahiro

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2006 ( 0 ) 131 - 132 2006.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

According to advanced functionality in a wide variety of equipments in these days, ultra precision, high complexity and high efficiency of fine-fabrication is required. Not only performance of machine tool but also downsizing of high accurate working tool itself has been an important issue to realize above conditions. In this study, on-machine tool measurement technology using laser diffraction which is able to manage micro tool and able to post in the machine tool has been establishing. In this article, the on-machine tool measurement device is developed. The developed on-machine device is carried out a response measurement experiment of hundreds nano-displacement using piezo stage then the fundamental characteristics of the developed measurement device is verified.

DOI： 10.1299/jsmemmt.2006.6.131

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/110006638933

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Papers - KHAJORNRUNGRUANG, Panart