Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

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Study on the observation of the behavior of nano fine particles using transparency resin sheet with low refractive index

Matsumoto Ryunosuke, Suzuki Keisuke, Hirota Ren, Kijoronrunrunog Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 110 - 111 2021.09

Authorship：Last author Language：Japanese Publishing type：Research paper (other academic)

In this study, the behavior of polishing particles was observed to clarify the material removal mechanism in CMP. A transparent pad with a low refractive index was fabricated by thermal imprinting using a transparent resin with the same refractive index as that of the slurry. In addition, we observed the behavior of the abrasive particles during polishing and discussed the relationship between the behavior of the abrasive particles and the step relaxation during polishing.

DOI： 10.11522/pscjspe.2021a.0_110

CiNii Research

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale

Blattler Aran, Khajornrungruang Panart, Suzuki Keisuke, Baba Akiyoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 588 - 589 2021.09

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

An abrasive nanoparticle behavior in chemical mechanical polishing (CMP) process is a three-dimensional (3D) motion near a substrate or reference surface. The height position is a longitudinal distance between the reference surface and nanoparticle, which is a challenge for measuring the height position in a wet condition. Our previous report could estimate the relative height of polystyrene 100 nm particles by applying multi-wavelength evanescent fields, but the absolute height was not confirmed yet. Therefore, in this report, we proposed a design concept for absolute height verification by using the developed nano-step height patterns. The nano-step height was approximately less than hundred nanometers from the reference surface. The nano-step height made from an optical resin that has a refractive index close to water to decrease the scattering light during observing nanoparticles in water. Polystyrene 100 nm particles on the nano-step height were used to estimate the absolute height of nanoparticle. The proposed concept could be used to verify the nanoparticle's absolute height in water, which can be applied to clarify the nanoparticle phenomena during the CMP process in the near future.

DOI： 10.11522/pscjspe.2021a.0_588

CiNii Research

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 113 - 114 2021.09

3D trajectories and diffusion of single ceria particles near a glass surface and their removal Reviewed

Seo J., Gowda A., Khajornrungruang P., Hamada S., Babu S.V.

Journal of Materials Research 36 ( 1 ) 258 - 267 2021.01

近接場光を応用した工具刃先計測の数値シミュレーションによる散乱光特性の評価:第2報 : 工具材への金属モデルの適用

甲斐雅貴, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2021 ( 0 ) 635 - 636 2021.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (scientific journal)

本稿では、近接場光を応用した工具刃先計測手法の確立のための援用シミュレーションの高精度化を目的とし、Drude-Lorentzモデルの導入を試みた．これにより従来のDrudeモデルのみを用いたものと比較し，波長により変化する反射率を考慮した解析が可能となった．また，更なる改善のために解析時のセルサイズによる影響を調査した．最後に工具刃先計測の散乱光シミュレーションを行い，得られた光散乱光特性を報告する．

DOI： 10.11522/pscjspe.2021S.0_635

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130008084162

Study on the SUAM Double Magnet System for Polishing Reviewed International journal

Nakasaki Tatsuya, Kinoshita Yushi, Khajornrungruang Panart, Otabe Edmund Soji, Suzuki Keisuke

International Journal of Automation Technology ( Fuji Technology Press Ltd. ) 15 ( 4 ) 503 - 511 2021.01

Language：English Publishing type：Research paper (scientific journal)

Superconductive assisted machining (SUAM) is a novel machining method that eliminates tool interference via magnetic levitation tools. In our study, we developed a double magnet system (DMS) to increase the maximum power of the holding force and stabilize the magnetic rotation during polishing via the higher magnetic flux compared to a single magnet system (SMS). The maximum magnetic flux density of the DMS was approximately 100 mT higher than that of the SMS. In these cases, the entire holding force increases as the distance between the superconducting bulk and lower magnet decreases. The attractive forces are maximum around a displacement of 6 mm, although the repulsive and restoring forces increase spontaneously. The polishing performances of the DMS on the SUS304 and A1100P plates were evaluated using water-based diamond slurries, for equal levitation amounts. The amount removed by the DMS increased for the A1100P and SUS304 substrates compared to that by the SMS. In this case, we observe that the deviation of the polishing area on the DMS decreases compared to that of the SMS, reflecting a more stable rotation and movement due to the higher holding force.

DOI： 10.20965/ijat.2021.p0503

Scopus

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130008062468

Study on polishing method using magnetic levitation tool in superconductive-assisted machining Invited Reviewed

Nakashima H., Nakasaki T., Tanaka T., Kinoshita Y., Tanaka Y., Khajornrungruang P., Otabe E.S., Suzuki K.

International Journal of Automation Technology ( Fuji Technology Press Ltd. ) 15 ( 2 ) 234 - 242 2021.01

Language：English Publishing type：Research paper (scientific journal)

Superconductive-assisted machining (SUAM) is a polishing method that employs a magnetic levitation tool, which is based on a superconductive phenomenon called the pinning effect. Since the tool magnetically levitates, the issue of tool interference is eliminated. In this study, in order to set up the polishing conditions of the magnetic levitation tool, we evaluated the relation between the flux density distribution relative to the tool position and the holding force acting on the magnetic levitation tool to maintain its initial position, set by field cooling by the superconducting bulk. For the holding force, we measured the attractive, repulsive, restoring, and driving forces. We found that the greater the holding force, the smaller the initial distance between the superconducting bulk and the magnetic levitation tool. The attractive force was found to peak when the levitated tool was displaced 6 mm from an initial position of 9 mm from the bulk, and it became only the self-weight of the magnetic levitation tool at displacements of 30 mm and above, where the pinning effect broke down. We then evaluated the polishing characteristics for SUS304 and A1100P at a tool displacement that results in the maximum attractive force. In the polishing experiment, we employed a water-based diamond slurry because the temperature of the workpiece was close to room temperature. We found that it was possible to polish SUS304 and A1100P while avoiding the effects of magnetization due to the polishing pressure or induced currents that accompany the rotation of the metal plate. The arithmetic average roughness, Ra, of A1100P was relatively high due to the effect of scratches, while that of SUS304 improved from 92 nm before polishing to 55 nm after polishing when polished with grains with a diameter of 1 μm.

DOI： 10.20965/IJAT.2021.P0234

Scopus

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CiNii Research

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85102894272&origin=inward

Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field:(Particle Removal and Re-adhesion Characteristics on Scrubbing)

KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, UTSUMI Haruki, HAMADA Satomi, WADA Yutaka, HIYAMA Hirokuni

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2021 ( 0 ) 10A02 2021.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, these residual nanoparticles from polishing slurry on the wafer are usually inspected before-and-after cleaning process, not during the wet cleaning process. Accordingly, these cleaning phenomena mechanism on the surface have already not clearly known. Therefore, we have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light that is generated by an optically internal reflection. This report introduces some of observed physical characteristical phenomena during duplicated scrub cleaning process of 10 and 30 nm gold particles by PVA brushes without and with skin layer, which have different contact area ratio on the surface being cleaned.

DOI： 10.1299/jsmekanto.2021.27.10A02

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130008091970

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:3rd report: Detachment and Reattachment Behaviors of 20 nm Gold Single-particles during Enforcing Ultrasonic

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021 ( 0 ) 314 - 315 2021.01

Real-time visualization of the cleaning of ceria particles from silicon dioxide films using PVA brush scrubbing Reviewed

Ranaweera C.K., Khajornrungruang P., Hamada S., Gowda A., Vegi H., Seo J., Babu S.V.

ECS Journal of Solid State Science and Technology 10 ( 8 ) 2021.01

Brownian motion simulation of SiO2 abrasive nanoparticle on SiC substrate surface Reviewed International journal

SAENNA Soraya, KHAJORNRUNGRUANG Panart, BLATTLER Aran, PERMPATDECHAKUL Thitipat, SUZUKI Keisuke, BAKIER Mohammed A.

Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers ) 2021.10 ( 0 ) 178-171 2021.01

Authorship：Corresponding author Language：English Publishing type：Research paper (international conference proceedings)

Chemical-Mechanical Polishing (CMP) process has emerged as the method of choice for planarization in the semiconductor industry. The interaction force between the surface being polished and the abrasive nanoparticles plays a significant role in flattening the substrate surface in the CMP process. For example, when the SiO2 nanoparticle is distant from the SiC substrate surface, the interaction force between the surface and the nanoparticles is presented. This force could be analysed using Derjaguin and Landau and Verwey and Overbeek (DLVO) theory and particle Brownian motion. According to the simulation results, we found that very fine abrasive nanoparticle such as smaller than approximately 10 nm is comparatively approach to the surface being polished more certainly.

DOI： 10.1299/jsmelem.2021.10.178-171

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmelem/2021.10/0/2021.10_178-171/_pdf

Study on material removal mechanism for Cu-CMP on a patterned silicon wafer

Bakier M.A.Y.A., Matsumoto R., Fuchiwaki M., Khajornrungruang P., Suzuki K.

10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021 243 - 245 2021.01

Brownian motion simulation of SiO<inf>2</inf> abrasive nanoparticle on SiC substrate surface Reviewed

Saenna S., Khajornrungruang P., Blattler A., Permpatdechakul T., Suzuki K., Bakier M.A.

10th International Conference on Leading Edge Manufacturing Technologies in 21st Century, LEM 2021 353 - 357 2021.01

Investigation on the Abrasive Phenomenon of Colloidal SiO2 Particles and Water-soluble C60 Inclusion Complex Particles in the CMP Process of the 4H-SiC Substrate Wafer Reviewed International journal

Tsai Yueh-Hsun, Suzuki Keisuke, Chen Chao-Chang A., Khajornrnrungruang Panart

Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers ) 2021.10 ( 0 ) 094-114 2021.01

Language：English Publishing type：Research paper (international conference proceedings)

This study used a water-soluble inclusion complex, fullerene/β-cyclodextrins(C60/β-CDs), as additive abrasive with conventional SiO2 slurry for the chemical mechanical polishing/planarization(CMP) of the silicon carbide substrate wafer. The hydrodynamic size(dH) of C60/β-CDs suspension was measured by the dynamic light scattering(DLS) method; the appearance of a C60/β-CDs inclusion complex is observed by TEM. The C60/β-CDs hybrid SiO2-based slurry performed a higher removal rate than conventional SiO2 slurry, and the polished surface showed a lower depression and roughness, too.

DOI： 10.1299/jsmelem.2021.10.094-114

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmelem/2021.10/0/2021.10_094-114/_pdf

Study on Polishing Method Using Double Magnet System by Superconductive Assisted Machining Method Reviewed International journal

Keisuke Suzuki, Tatsuya Nakasaki, Hidetaka Nakashima, Panart Kajornrunruan, Misaki Onomata, Yushi Kinoshita, Ruizhe Zhang, Edmund Soji Otabe

JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing 2020.09

High-speed three-dimensional tracking of individual 100 nm polystyrene standard particles in multi-wavelength evanescent fields Invited Reviewed

Aran Blattler, Panart Khajornrungruang, Keisuke Suzuki, Thitipat Permpatdechakul

Measurement Science and Technology 31 ( 9 ) 2020.09

Advanced chemical-mechanical planarization for 4H-SiC substrate by water-soluble inclusion complexes of fullerene Reviewed International journal

Tsai Y.H., Chen C.C.A., Suzuki K., Khajornrungruang P., Chiu S.F., Hua C.T.

Japanese Journal of Applied Physics 59 ( SL ) 2020.07

Trajectories, diffusion, and interactions of single ceria particles on a glass surface observed by evanescent wave microscopy Reviewed

Seo J., Gowda A., Khajornrungruang P., Hamada S., Song T., Babu S.

Journal of Materials Research 35 ( 3 ) 321 - 331 2020.02

Study on novel nano fine particles reacted with fullerene for hard to process material

Hisayoshi Fuya, Suzuki Keisuke, Tsai Yueh-Hsun, Khajornrungruang Panart, Yasunaga Takuo, Takazaki Hiroko, Ouchi Masayoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 486 - 487 2020.01

局在光によるナノ研磨現象観測に関する研究:第1報:開発した小型装置による実験的評価

パームパッデーチャークンティティパット, カチョーンルンルアンパナート, 鈴木恵友, ブラットラーアラン, 寺山裕

精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering ) 2020 ( 0 ) 658 - 659 2020.01

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

The nanoscale polishing phenomena between the substrate surface and polishing pad during process, such as CMP process, were observed and evaluated, in this report. The concept of observation method is applied the generated evanescent field to limit the observable region only on the surface being polished, and the detectable scattering light from the nanoparticles and polishing pad when they move close to the surface in a range of evanescent field. The detected scattering light intensity could be used for evaluating the phenomena. According to the observed results, there should have been more than two different phenomena in polishing; the particles adhering on the polishing pad, and the individual movement particles during moving. However, the phenomena being able to perform polishing, could not clearly identify yet.

DOI： 10.11522/pscjspe.2020S.0_658

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007896847

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Papers - KHAJORNRUNGRUANG, Panart