Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

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Highly accurate flow rate measuring device for intravenous drip

Meguro Akira, Uchimura Mamoru, Panart Khajornrungruang, Ito Takahiro, Murakami Sunao

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2022A ( 0 ) 61 - 62 2022.08

Language：Japanese Publishing type：Research paper (other academic)

Flow rate control is essential for safety and time management in intravenous drip therapy. The main control method is to adjust the drop velocity. However, due to the influence of surfactants contained in some drugs, a drop may fall below the specified volume, and therefore, much effort and expense are required to improve the accuracy.In this paper, we report on the use of light to measure the volume of a droplet, and the successful miniaturization of a device and highly accurate flow rate measurement by devising an optical path. It is expected to contribute to the improvement of the performance of drip infusion systems.

DOI： 10.11522/pscjspe.2022a.0_61

CiNii Research

Real Time Nanoscale Cleaning Phenomenon Observation During Enforcing MHz Wave By Evanescent Field Reviewed International journal

Terayama Y., Khajornrungruang P., Suzuki K., Mori R., Hamada S., Wada Y., Hiyama H.

ECS Transactions 108 ( 4 ) 17 - 23 2022.01

Proposal of a novel peeling of nano-particle (PNP) process for localized material removal on a hard material surface by controllable magnetic fields Reviewed

Permpatdechakul T., Khajornrungruang P., Suzuki K., Kutomi S.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022 279 - 280 2022.01

Absolute longitudinal distance measurement verification of a standard polystyrene nanoparticle near a surface in water by means of multi-wavelength evanescent field Reviewed

Blattler A., Khajornrungruang P., Suzuki K., Baba A., Goto D.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022 385 - 388 2022.01

Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field

KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, UTSUMI Haruki, HAMADA Satomi, WADA Yuutaka, HIYAMA Hirokuni

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2022.28 ( 0 ) 15H06 2022.01

Authorship：Lead author,　Corresponding author Language：Japanese Publishing type：Research paper (other academic)

Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, the residual nanoparticles from polishing slurry on the wafer are usually inspected only before and after cleaning process, not during wet cleaning process. Therefore, these cleaning phenomena mechanism on the surface have not already clearly known. We have been studying these phenomena by visualizing the nanoparticle motion on a surface in nanoscale wet cleaning process that are duplicated in lab-scale. This report focuses on the flow velocity distribution occurring on a surface that was obtained by duplicating the water flow in a micro fluid cell on a silica glass surface. We found that the flow, which is nearer than few micrometers from the surface being cleaned, has less shear flow velocity. Therefore, there should be some external force or energy, such as PVA brush or cavitation from ultrasonic, to remove residue particles in cleaning process.

DOI： 10.1299/jsmekanto.2022.28.15h06

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekanto/2022.28/0/2022.28_15H06/_pdf

A novel method for 3d nanoscale tracking of 100 nm polystyrene particles in multi-wavelength evanescent fields microscopy – absolute difference height verification – Invited Reviewed International journal

Blattler A., Khajornrungruang P., Suzuki K., Saenna S.

International Journal of Automation Technology ( Fuji Technology Press Ltd. ) 15 ( 6 ) 831 - 841 2021.11

Authorship：Corresponding author Language：English Publishing type：Research paper (scientific journal)

Total internal reflection is an optical imaging technique for nanoparticle tracking and observation employing the scattered light from an evanescent field near the interface or reference surface. Generally, the nanoparticle behavior is the three-dimensional Brownian motion in an aqueous medium. The motion can be traced by an optical microscopy, but it cannot be traced by an electron microscopy technique. In the three-dimensional nanoparticle moving position, the X and Y positions are parallel to the surface, which can be traced by the general microscopy techniques. However, the height position Z of a nanoparticle perpendicular to the surface could not be traced without the longitudinal scanning method. Here, a novel method is proposed to investigate the 3D position of nanoparticles by applying multi-wavelength evanescent fields microscopy, which has a high spatial resolution in the Z-direction without longitudinal scanning. This paper focuses on the verification of measurement in the Z-direction. A piezoelectric actuator was employed to control the nanoparticle displacement in height Z. Standard polystyrene 100 nm particles were randomly adhered on a spherical tip that connected with the piezoelectric actuator. The spherical tip was essentially made from an optical adhesive (n = 1.348) with a refractive index close to the water for decreasing the unnecessary signal from the tip-self during nanoparticle observation in the water. The proposed method could obtain the multi-wavelength scattering lights from the observed nanoparticles by an 8-bit color camera with higher than 50 frames per second recording to investigate the 3D nanoscale tracking. The X and Y positions of nanoparticles were determined by the centroid of the scattering light intensities. The height Z was determined from the logarithm ratios between the detected scattering light intensities of both wavelengths. The measurement repeatability of the absolute difference in height between nanoparticles could be measured less than ±16 nm by using the proposed method. The penetration height measurability range was approximated at 250 nm from the reference surface.

DOI： 10.20965/ijat.2021.p0831

Scopus

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CiNii Research

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85118859497&origin=inward

Computational analysis of nano abrasive motion on SiC surface

Saenna Soraya, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Permpatdechakul Thitipat

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 126 - 127 2021.09

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

The motion of nano-silica abrasive particle before attaching to the SiC surface being polished was analyzed numerically based on Brownian motion with DLVO theory, and then was compared with the results observed by evanescent light field localized on the SiC surface. We found that, when approximately 100 nm-sized silica particles are moving in close proximity within 100 nm from the SiC substrate surface, the nanoparticles would stay intermittently with slightly oscillating behavior before attaching to the surface.

DOI： 10.11522/pscjspe.2021a.0_126

CiNii Research

Compact and highly accurate flow rate measuring device for intravenous drip

Uchimura Mamoru, Khajornrungruang Panart, Ito Takahiro, Murakami Sunao

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 383 - 384 2021.09

Study on Nanoscale Observatory in Polishing Phenomena applying Optical Evanescent Field

Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Baba Akiyoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 102 - 103 2021.09

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

The nanoscale polishing phenomena between substrate surface, 105 nm-sized SiO2 particles slurry, and polishing pad during CMP process were experimentally observed and evaluated to identify the main factors which effectively polish a 4H-SiC substrate. The nanoscale polishing phenomena were observed in-situ by our developed compact apparatus applied an optical evanescent field. The observation is able to detect the scattering light from either the nano-abrasive particles or the pad asperities when they react to the surface to being polishing. The nanoparticle motion phenomena, which two conditions (i)only nanoparticles (without pad) and (ii)nanoparticles with pad sliding, on 4H-SiC substrate were observed. According to the observed results, the observed scattering light of nanoparticle on 4H-SiC was the ellipse shape compared with the observing on SiO2 substrate. Furthermore, we could observe the particles moved nearer and then adhered on the surface. Less particle’s Brownian motion when the particle moved nearer to the surface. In case of nanoparticle with pad sliding, we could observe only the scattering light of pad sliding because the scattering light intensity of particle is quite lower than pad. Therefore, approached nanoparticle to 4H-SiC surface phenomena might be one possible role to explain higher polishing rate CMP parameter.

DOI： 10.11522/pscjspe.2021a.0_102

CiNii Research

Study on the observation of the behavior of nano fine particles using transparency resin sheet with low refractive index

Matsumoto Ryunosuke, Suzuki Keisuke, Hirota Ren, Kijoronrunrunog Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 110 - 111 2021.09

Authorship：Last author Language：Japanese Publishing type：Research paper (other academic)

In this study, the behavior of polishing particles was observed to clarify the material removal mechanism in CMP. A transparent pad with a low refractive index was fabricated by thermal imprinting using a transparent resin with the same refractive index as that of the slurry. In addition, we observed the behavior of the abrasive particles during polishing and discussed the relationship between the behavior of the abrasive particles and the step relaxation during polishing.

DOI： 10.11522/pscjspe.2021a.0_110

CiNii Research

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale

Blattler Aran, Khajornrungruang Panart, Suzuki Keisuke, Baba Akiyoshi

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 588 - 589 2021.09

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

An abrasive nanoparticle behavior in chemical mechanical polishing (CMP) process is a three-dimensional (3D) motion near a substrate or reference surface. The height position is a longitudinal distance between the reference surface and nanoparticle, which is a challenge for measuring the height position in a wet condition. Our previous report could estimate the relative height of polystyrene 100 nm particles by applying multi-wavelength evanescent fields, but the absolute height was not confirmed yet. Therefore, in this report, we proposed a design concept for absolute height verification by using the developed nano-step height patterns. The nano-step height was approximately less than hundred nanometers from the reference surface. The nano-step height made from an optical resin that has a refractive index close to water to decrease the scattering light during observing nanoparticles in water. Polystyrene 100 nm particles on the nano-step height were used to estimate the absolute height of nanoparticle. The proposed concept could be used to verify the nanoparticle's absolute height in water, which can be applied to clarify the nanoparticle phenomena during the CMP process in the near future.

DOI： 10.11522/pscjspe.2021a.0_588

CiNii Research

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021A ( 0 ) 113 - 114 2021.09

3D trajectories and diffusion of single ceria particles near a glass surface and their removal Reviewed

Seo J., Gowda A., Khajornrungruang P., Hamada S., Babu S.V.

Journal of Materials Research 36 ( 1 ) 258 - 267 2021.01

近接場光を応用した工具刃先計測の数値シミュレーションによる散乱光特性の評価:第2報 : 工具材への金属モデルの適用

甲斐雅貴, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2021 ( 0 ) 635 - 636 2021.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (scientific journal)

本稿では、近接場光を応用した工具刃先計測手法の確立のための援用シミュレーションの高精度化を目的とし、Drude-Lorentzモデルの導入を試みた．これにより従来のDrudeモデルのみを用いたものと比較し，波長により変化する反射率を考慮した解析が可能となった．また，更なる改善のために解析時のセルサイズによる影響を調査した．最後に工具刃先計測の散乱光シミュレーションを行い，得られた光散乱光特性を報告する．

DOI： 10.11522/pscjspe.2021S.0_635

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130008084162

Study on the SUAM Double Magnet System for Polishing Reviewed International journal

Nakasaki Tatsuya, Kinoshita Yushi, Khajornrungruang Panart, Otabe Edmund Soji, Suzuki Keisuke

International Journal of Automation Technology ( Fuji Technology Press Ltd. ) 15 ( 4 ) 503 - 511 2021.01

Language：English Publishing type：Research paper (scientific journal)

Superconductive assisted machining (SUAM) is a novel machining method that eliminates tool interference via magnetic levitation tools. In our study, we developed a double magnet system (DMS) to increase the maximum power of the holding force and stabilize the magnetic rotation during polishing via the higher magnetic flux compared to a single magnet system (SMS). The maximum magnetic flux density of the DMS was approximately 100 mT higher than that of the SMS. In these cases, the entire holding force increases as the distance between the superconducting bulk and lower magnet decreases. The attractive forces are maximum around a displacement of 6 mm, although the repulsive and restoring forces increase spontaneously. The polishing performances of the DMS on the SUS304 and A1100P plates were evaluated using water-based diamond slurries, for equal levitation amounts. The amount removed by the DMS increased for the A1100P and SUS304 substrates compared to that by the SMS. In this case, we observe that the deviation of the polishing area on the DMS decreases compared to that of the SMS, reflecting a more stable rotation and movement due to the higher holding force.

DOI： 10.20965/ijat.2021.p0503

Scopus

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130008062468

Study on polishing method using magnetic levitation tool in superconductive-assisted machining Invited Reviewed

Nakashima H., Nakasaki T., Tanaka T., Kinoshita Y., Tanaka Y., Khajornrungruang P., Otabe E.S., Suzuki K.

International Journal of Automation Technology ( Fuji Technology Press Ltd. ) 15 ( 2 ) 234 - 242 2021.01

Language：English Publishing type：Research paper (scientific journal)

Superconductive-assisted machining (SUAM) is a polishing method that employs a magnetic levitation tool, which is based on a superconductive phenomenon called the pinning effect. Since the tool magnetically levitates, the issue of tool interference is eliminated. In this study, in order to set up the polishing conditions of the magnetic levitation tool, we evaluated the relation between the flux density distribution relative to the tool position and the holding force acting on the magnetic levitation tool to maintain its initial position, set by field cooling by the superconducting bulk. For the holding force, we measured the attractive, repulsive, restoring, and driving forces. We found that the greater the holding force, the smaller the initial distance between the superconducting bulk and the magnetic levitation tool. The attractive force was found to peak when the levitated tool was displaced 6 mm from an initial position of 9 mm from the bulk, and it became only the self-weight of the magnetic levitation tool at displacements of 30 mm and above, where the pinning effect broke down. We then evaluated the polishing characteristics for SUS304 and A1100P at a tool displacement that results in the maximum attractive force. In the polishing experiment, we employed a water-based diamond slurry because the temperature of the workpiece was close to room temperature. We found that it was possible to polish SUS304 and A1100P while avoiding the effects of magnetization due to the polishing pressure or induced currents that accompany the rotation of the metal plate. The arithmetic average roughness, Ra, of A1100P was relatively high due to the effect of scratches, while that of SUS304 improved from 92 nm before polishing to 55 nm after polishing when polished with grains with a diameter of 1 μm.

DOI： 10.20965/IJAT.2021.P0234

Scopus

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CiNii Research

Other Link： https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85102894272&origin=inward

Study on Visualization of Cleaning Phenomena in Nano-scale by Evanescent Field:(Particle Removal and Re-adhesion Characteristics on Scrubbing)

KHAJORNRUNGRUANG Panart, TERAYAMA Yutaka, SUZUKI Keisuke, UTSUMI Haruki, HAMADA Satomi, WADA Yutaka, HIYAMA Hirokuni

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2021 ( 0 ) 10A02 2021.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

Cleaning phenomena in semiconductor manufacturing is about the nanoparticles being removed out from, or re-adhering to, or returning to the wafer surface. However, these residual nanoparticles from polishing slurry on the wafer are usually inspected before-and-after cleaning process, not during the wet cleaning process. Accordingly, these cleaning phenomena mechanism on the surface have already not clearly known. Therefore, we have been establishing dynamically visualization of wet cleaning phenomena on the surface applying localized light called evanescent light that is generated by an optically internal reflection. This report introduces some of observed physical characteristical phenomena during duplicated scrub cleaning process of 10 and 30 nm gold particles by PVA brushes without and with skin layer, which have different contact area ratio on the surface being cleaned.

DOI： 10.1299/jsmekanto.2021.27.10A02

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130008091970

Brownian motion simulation of SiO2 abrasive nanoparticle on SiC substrate surface Reviewed International journal

SAENNA Soraya, KHAJORNRUNGRUANG Panart, BLATTLER Aran, PERMPATDECHAKUL Thitipat, SUZUKI Keisuke, BAKIER Mohammed A.

Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 ( The Japan Society of Mechanical Engineers ) 2021.10 ( 0 ) 178-171 2021.01

Authorship：Corresponding author Language：English Publishing type：Research paper (international conference proceedings)

Chemical-Mechanical Polishing (CMP) process has emerged as the method of choice for planarization in the semiconductor industry. The interaction force between the surface being polished and the abrasive nanoparticles plays a significant role in flattening the substrate surface in the CMP process. For example, when the SiO2 nanoparticle is distant from the SiC substrate surface, the interaction force between the surface and the nanoparticles is presented. This force could be analysed using Derjaguin and Landau and Verwey and Overbeek (DLVO) theory and particle Brownian motion. According to the simulation results, we found that very fine abrasive nanoparticle such as smaller than approximately 10 nm is comparatively approach to the surface being polished more certainly.

DOI： 10.1299/jsmelem.2021.10.178-171

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmelem/2021.10/0/2021.10_178-171/_pdf

Real Time Nanoscale Observation in Cleaning Phenomena by Evanescent Field:3rd report: Detachment and Reattachment Behaviors of 20 nm Gold Single-particles during Enforcing Ultrasonic

Terayama Yutaka, Khajornrungruang Panart, Suzuki Keisuke, Mori Ryotaro, Hamada Satomi, Wada Yutaka, Hiyama Hirokuni

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2021 ( 0 ) 314 - 315 2021.01

Real-time visualization of the cleaning of ceria particles from silicon dioxide films using PVA brush scrubbing Reviewed

Ranaweera C.K., Khajornrungruang P., Hamada S., Gowda A., Vegi H., Seo J., Babu S.V.

ECS Journal of Solid State Science and Technology 10 ( 8 ) 2021.01

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Papers - KHAJORNRUNGRUANG, Panart