Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

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Study on the Optimization of Hybrid fine particles on Chemical Mechanical Polishing of Hard to process materials

Suzuki Keisuke, Bun-Athuek Natthaphon, Takazaki Hiroko, Yasunaga Takuo, Yoshimoto Yutaka, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018A ( 0 ) 312 - 313 2018.08

Authorship：Last author Language：Japanese Publishing type：Research paper (other academic)

We repot on the hybrid fine particles using core silica particles adsorbed on the ultra fine nano particles such as nano silica particles (ca.4nm diameter) and fullerenol for Chemical Mechanical Polishing of Hard to process materials. In our study, chemical reactivity and mechanical action from the hybrid particles were investigated using the several diameters of the core silica particles. At the case of adsorption of the nano silica particles and fullerenol, chemical reactivity become dominant parameter under the small size region although the nano particle is coated on the surface of the core silica particles. These results expect that both parameters as chemical reactivity and mechanical action can be control by the sizes of core particles and coating condition of the nano silica particles. We also optimize the structure of the hybrid silica particles at the case of the nano silica particles and/or fullerenol to meet the high performance CMP of hard to process materials and discuss about these results.

DOI： 10.11522/pscjspe.2018a.0_312

CiNii Article

CiNii Research

Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire Reviewed International journal

Bun-Athuek N., Takazaki H., Yoshimoto Y., Khajornrungruang P., Yasunaga T., Suzuki K.

Japanese Journal of Applied Physics 57 ( 7 ) 2018.07

Study on Non-Contact Micro Tool Tip Nano-Position Detection by Means of Evanescent Field Penetration Depth Reviewed

Panart Khajornrungruang, Keisuke Suzuki, Tomoki Inoue

2018.06

Analytical on mixed colloidal silica particle in slurry of sapphire Chemical Mechanical Polishing Reviewed

BUN-ATHUEK NATTHAPHON, YOSHIMOTO YUTAKA, SAKAI KOYA, KHAJORNRUNGRUANG PANART, SUZUKI KEISUKE

LEM21 2017 ( 0 ) 2018.05

Development of new polishing pad with a semispherical shape formed by materials with different wear rates

ONIKI Takahiro, KATO Yuya, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke, TASHIRO Yasunori, MATSUO Masaaki

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 62 ( 5 ) 264 - 266 2018.05

Language：Japanese Publishing type：Research paper (other academic)

We have developed a polishing pad using materials with different wear rates to achieve highly efficient polishing of difficult-to-process material substrates. Nylon fibers with good mechanical properties are arranged with other materials, followed by dressing to form protrusions on the polishing pad surface. Stable polishing performance can be expected if the orientation and arrangement of the nylon fibers can be controlled. A sapphire substrate was polished using the prototype polishing pad developed in this research. The results indicated 30% improvement in material removal rate compared to the ready-made pad.

DOI： 10.11420/jsat.62.264

CiNii Research

Study of Electroosmotic Micro-Flow Enhanced Abrasives Distribution in Nanoparticle Contained Slurry for Copper Chemical Mechanical Planarization Reviewed

Tsai Yueh-Hsun, Suzuki Keisuke, Chang Chao-Chung, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018S ( 0 ) 781 - 782 2018.03

Language：English Publishing type：Research paper (other academic)

Chemical mechanical planarization is one of the crucial steps for the manufacturing process of semiconductor. CMP process with good adaptability can lead to high productivity, low defect, and coping with the ever-changing materials. In CMP process, slurry plays a big role in material removal. Among the composition of slurry, the abrasive predominates in the removal rate and surface quality. Therefore, this study develops the application of water-soluble nanoparticles, such as fullerene, as abrasives for the copper CMP process. By electroosmotic phenomenon, a kind of electro kinetic force, it generates the micro-flow field for abrasive during CMP process. The increasing disturbance of flow enhances the uniformity of abrasive distribution and polishing efficiency. The electrode embedded polishing platen which causes the electroosmotic flow on polishing pad is revealed and simulated by multi-physics fields coupling software, COMSOL Multiphysics. Finally, comparing with the results of simulation and flow visualization with fluorescent powders, the optimal and reasonable design is discussed.

DOI： 10.11522/pscjspe.2018s.0_781

CiNii Article

CiNii Research

Accurate measurement of flow rate of continuous fluid

Takeuchi Ryosuke, Takaichi Shunsuke, Murakami Sunao, Ito Takahiro, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018S ( 0 ) 873 - 874 2018.03

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale-4th: Estimation of longitudinal Resolution

Shirakawa Hiroaki, Blatter Aran, Takemoto Ryo, Khajornrungruang Panart, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018S ( 0 ) 129 - 130 2018.03

Study on non-contact micro tool tip nano-position detection by means of evanescent field penetration depth Reviewed International journal

Khajornrungruang P., Suzuki K., Inoue T.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 18th International Conference and Exhibition, EUSPEN 2018 139 - 140 2018.01

Study on polishing method using magnetic levitation tool by superconducting Reviewed

TANAKA Yuki, NAKASHIMA Hidetaka, HIRAMATU Yuta, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 62 ( 4 ) 219 - 220 2018.01

Language：Japanese Publishing type：Research paper (scientific journal)

Precision machining techniques have a number of serious problem, such as tool interference against complicated machining shapes and improvement of accuracy in processing. To resolve these issues, we suggest the Superconductive Assisted Machining (SUAM) method, which involves application of a magnetic levitation tool using the pinning effect of superconductivity during polishing processing. The SUAM method can eliminate tool interference because machining shape is determined by movement of the magnetic levitation tool during processing. Here, we measured the holding force, such as attractive and repulsive forces, from the pinning effect of superconductivity. The results indicated a maximum attractive force of 4 N with an initial magnetic levitation tool height of 9 mm. In this case, the holding force was dependent on the initial distance between the magnetic levitation tool and the superconductor bulk. In addition, we evaluated the dependence of polishing pressure and rotation frequency on polishing rate using fixed abrasive polishing pads. The results indicated that the polishing removal rates increase with increasing polishing pressure and rotation frequency.

DOI： 10.11420/jsat.62.219

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007492417

Observation of Nano-particle Adhesion and Desorption Phenomenon Near to Silicon Nitride and Oxide Film Surface in an Evanescent Field

TERAYAMA Yutaka, NAKANO Asato, Khajornrungruang Panart, SUZUKI Keisuke, WADA Yutaka, HAMADA Satomi

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2018.24 ( 0 ) OS0105 2018.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (other academic)

The study on adhesion and desorption mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. This report proposes an optical method to visualize only the nano-particles moving near to Si3N4 and SiO2 film surfaces by applying an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. Adhesion and desorption phenomena of the polystyrene latex standard particles (50±1 nm) and the SiO2 particles (55 nm) moving near to the Si3N4 and SiO2 film surfaces were observed by our developed experimental setup. Furthermore, desorption phenomenon of SiO2 particles (105 nm) with the flow occurred by polyvinyl alcohol (PVA) sponge brush sliding was also demonstrated.

DOI： 10.1299/jsmekanto.2018.24.os0105

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmekanto/2018.24/0/2018.24_OS0105/_pdf

Study on polishing processing using Superconductive Assisted Machining method(SUAM)

TANAKA Yuki, NAKASHIMA Hidetaka, ONOMATA Misaki, Khajornrungruang P, OTABE Soji, SUZUKI Keisuke

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2018.71 ( 0 ) F36 2018.01

Study on fabrication method of low refractive transparent pad by thermal transfer

Kato Yuya, Suzuki Keisuke, Khajornrungruang Panart, Yamaguchi Yuta, Tsai Yueh-Hsun

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2018.12 ( 0 ) D06 2018.01

Language：Japanese Publishing type：Research paper (other academic)

Fabrication process of the pad has been developed by imprint method with special zig to control of the thickness and patter and electrode structure. Movement of the fine particle is controlled by electrical field using copper wire electrode inserted in the low refractive index – transparency polishing pad. As results, we can be observe the movement of the diamond particle between the pattern structures under the pad by electrical field using digital microscope.

DOI： 10.1299/jsmemmt.2018.12.d06

CiNii Article

CiNii Research

Other Link： https://www.jstage.jst.go.jp/article/jsmemmt/2018.12/0/2018.12_D06/_pdf

Study on the nano combined fine particles in the CMP

SAKAI Koya, UEDA Tatsunori, YOSHIMOTO Hiroshi, SUZUKI Keisuke, BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUANG PANART

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2018.71 ( 0 ) G26 2018.01

Study on hybrid fine particles with nano particles for hard to process materials

UEDA Tatsunori, SAKAI Koya, YOSHIMOTO Hiroshi, BUN-ATHUEK NATTHAPHON, KHAJORNRUNGRUANG PANART, SUZUKI Keisuke

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2018.71 ( 0 ) G25 2018.01

Evaluation Method of the Approach of Nanoparticles-to-Surface in Chemical Mechanical Polishing using Optical Evanescent Field Reviewed International journal

Khajornrungruang Panart

Proc. of ICPT 2018 2018 356 - 360 2018.01

Study on Mechanism of High Material Removal in Sapphire-CMP with Sub-10nm Silica Particles using Evanescent Field Light Reviewed

Khajornrungruang Panart

Proc. of ICPT 2018 2018 76 - 81 2018.01

Analytical on mixed colloidal silica particle in slurry of sapphire chemical mechanical polishing Reviewed

2017.11

Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire Reviewed International journal

Bun-Athuek N., Yoshimoto Y., Sakai K., Khajornrungruang P., Suzuki K.

Japanese Journal of Applied Physics 56 ( 7 ) 2017.07

In situ measurement method for film thickness using transparency resin sheet with low refractive index under wet condition on chemical mechanical polishing Reviewed International journal

Oniki T., Khajornrungruang P., Suzuki K.

Japanese Journal of Applied Physics 56 ( 7 ) 2017.07

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Papers - KHAJORNRUNGRUANG, Panart