Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

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Research on high speed polishing technology using electrode embedded type low refractive transparent pad Reviewed

Kato Yuya, Ryunosuke Matsumoto, Suzuki Keisuke, Panart Khajornrungruang

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) D39 2019.01

Language：English Publishing type：Research paper (scientific journal)

The manufacturing process of the transparent pad was developed by the thermal imprint method equipped with a special jig for controlling the thickness, pattern and electrode structure. Particle behavior is controlled by the electric field using a wire mesh inserted into a low index transparent polishing pad. As a result, the movement of hybrid particles of diamond particles and silica particles can be observed in an electric field using a digital microscope. Furthermore, in the polishing experiment, it was possible to obtain a higher amount of material removal in the presence of the electric field than in the absence of the electric field.

DOI： 10.1299/jsmemmt.2019.13.D39

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007836392

Study on processing method using superconductive assisted machining method

NAKASHIMA Hidetaka, NAKASAKI Tatsuya, TANAKA Yuki, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) D38 2019.01

Language：Japanese Publishing type：Research paper (other academic)

In recent years, superconductive assisted machining method (SUAM) using a magnetic levitation tool utilizing a superconducting phenomenon such as pinning effect has been developed to reduce tool interference on the conventinal procceing method. Measurement of the force by the magnetic levitation tool is evauated in the air to determind polishing conditions. In our study, polishing test were performed not only on aluminum plate but also stainless steel plate using fixed and loose abrasives. As a result, the superconductive assisted machining method was applicable to stainless steel material.

DOI： 10.1299/jsmemmt.2019.13.D38

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007836391

点滴流量精密計測の研究:Z値による画像処理とレンズ収差の影響

高市峻佑, カチョーンルンルアンパナート, 伊藤高廣, 村上直

精密工学会学術講演会講演論文集 ( 公益社団法人精密工学会 ) 2019 ( 0 ) 476 - 477 2019.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (other academic)

病院などで使用されている点滴装置は，流量を一定に保つために正確な流量測定が必要である．特に，抗がん剤などの副作用がある薬液を使用する場合には，より正確性が求められている．現在使用されている点滴測定装置は，液滴の濃度が高いと精度が悪化するというデメリットがあるため，液滴の種類によらず測定できる測定手法が求められている．本研究では，画像処理を使用した体積推定により，液滴の体積を測ることを目的とした．

DOI： 10.11522/pscjspe.2019A.0_476

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007800991

Study on Real Time Phenomenon Observation of Nano-Particle Adhesion and Removal by Evanescent Light

MORITA Rintarou, Khajornrungruang Panart, TERAYAMA Yutaka, KUSATSU Kohei, HIYAMA Hirokuni, WADA Yuutaka, HAMADA Satomi

The Proceedings of Conference of Kanto Branch ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) 18A02 2019.01

Authorship：Corresponding author Language：Japanese Publishing type：Research paper (other academic)

The study on removal mechanism of nanoparticles near to polished wafer surface is necessary to efficiently clean the nano-particles from the wafer in semiconductor manufacturing process. An optical method has been applied to visualize only the nano-particles moving near to a surface by an evanescent field. We generated the evanescent field locating in limited range from the film surfaces by reflecting a laser beam at an incident angle larger than critical angle. The removal phenomena of the SiO2 particles (105 nm) on the BK7 glass surfaces were observed by our developed experimental setup. The SiO2 particles removal with ultrasonic (approx. 1 MHz) was demonstrated.

DOI： 10.1299/jsmekanto.2019.25.18A02

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007712645

The Performance Evaluation of Developed Apparatus for Observing the Nanoparticles Phenomena During CMP Process by Applying Evanescent Field

Permpatdechakul Thitipat, Khajornrungruang Panart, Suzuki Keisuke, Blattler Aran, Taira Kanako

日本機械学会九州支部講演論文集 ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) A42 2019.01

Authorship：Corresponding author Language：English Publishing type：Research paper (other academic)

In this paper, the performance evaluation of developed in-situ apparatus for real-time observation were studied. The apparatus could observe the nanoparticles phenomena on surface between substrate and polishing pad that is essential to improve the Material Removal Rate (MRR) of the substrate during Chemical Mechanical Polishing (CMP) process. We propose the single wavelength by applying an evanescent field in order to observe the nanoparticles phenomena. The experimental condition were separated into two experiments, as different size (sub 10 nm and 105 nm) silica slurry ( 5 wt% with pH 10.5) with pure water (pH 10.5). According to the experimental result, the our apparatus could detect the scattering light intensity of pure water and silica slurry during polishing process. The silica slurry are higher scattering light intensity than pure water, and sub 10 nm silica slurry is highest intensity.

DOI： 10.1299/jsmekyushu.2019.72.A42

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007801889

Study on Organic Fibers in The Polishing Pad for Sapphire Chemical Mechanical Polishing

Chansatarpornkul Sansuwan, カチョーンルンルアンパナート, 鈴木恵友

精密工学会学術講演会講演論文集 ( The Japan Society for Precision Engineering ) 2019 ( 0 ) 18 - 19 2019.01

Language：English Publishing type：Research paper (other academic)

Chemical mechanical polishing (CMP) is an essential process in the manufacturing of sapphire substrate that needs to achieve a smooth planar surface without subsurface damage. Definitely, the polishing pad is one of the dominant factors in the polishing. In recent years, there are trends to decrease the synthases material that formed by chemical production for our world environment. The organic fibers are having uniform structure, easy to fabricate from the natural or waste product from agro-industry or food industry, and can be control the diameter from micro unit until nano size such as cellulose nanofibers. This study aims to developed polishing pad with organic polishing pad from the several kinds of fibers such as; bamboo, sugarcane bagasse, banana, and pineapple fibers. As a result, naturally SiO2-contained fiber types that were bamboo and bagasse, performed considerably higher material removal rate (MRR) more than a conventional pad by 157% and 191% respectively. On the other hand, none-SiO2 fiber type (banana, pineapple) did not perform MRR completely. Therefore, we conclude that the SiO2 in the organic fibers could improve a material removal rate of sapphire CMP.

DOI： 10.11522/pscjspe.2019A.0_18

CiNii Article

CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007800812

Real time nanoscale cleaning phenomenon observation during PVA brush scrubbing by evanescent field Reviewed International journal

Terayama Y., Khajornrungruang P., Suzuki K., Kusatsu K., Hamada S., Wada Y., Hiyama H.

ECS Transactions 92 ( 2 ) 191 - 197 2019.01

FDTD Simulation for Analysing Scattering Light Characteristic of Moving Nano-particle in Evanescent Field

Khajornrungruang PANART, SUZUKI Keisuke, TAIRA Kanako, ARAMAKI Hirochika

The Proceedings of The Manufacturing & Machine Tool Conference ( The Japan Society of Mechanical Engineers ) 2019 ( 0 ) D18 2019.01

Authorship：Lead author Language：Japanese Publishing type：Research paper (other academic)

In surface fabrication process, such as the polishing in semiconductor substrate, there are many nano-particles moving on or nearby the surface to be polished. We have been establishing an optical method to observe and to track the 3-dimensional position of each dynamical moving nano-particle on time by applying an evanescent light field. In this report, the scattering light characteristic from a moving nano-particle in an evanescent field generated by internal reflection on a silica glass surface was analysed by FDTD (Finite Difference Time Domain) method on MATLAB. We discuss the scattering light from a particle moving perpendicularly to a surface in an interval time as one recorded frame in practical observation.

DOI： 10.1299/jsmemmt.2019.13.D18

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007836425

Visualization of Slurry Flow between Polishing Pad and Wafer in CMP (4th Report)

Fukuda Akira, Sekiduka Noriaki, Yamamoto Hiroki, Suzuki Keisuke, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018A ( 0 ) 295 - 296 2018.08

Study on the Optimization of Hybrid fine particles on Chemical Mechanical Polishing of Hard to process materials

Suzuki Keisuke, Bun-Athuek Natthaphon, Takazaki Hiroko, Yasunaga Takuo, Yoshimoto Yutaka, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018A ( 0 ) 312 - 313 2018.08

Authorship：Last author Language：Japanese Publishing type：Research paper (other academic)

We repot on the hybrid fine particles using core silica particles adsorbed on the ultra fine nano particles such as nano silica particles (ca.4nm diameter) and fullerenol for Chemical Mechanical Polishing of Hard to process materials. In our study, chemical reactivity and mechanical action from the hybrid particles were investigated using the several diameters of the core silica particles. At the case of adsorption of the nano silica particles and fullerenol, chemical reactivity become dominant parameter under the small size region although the nano particle is coated on the surface of the core silica particles. These results expect that both parameters as chemical reactivity and mechanical action can be control by the sizes of core particles and coating condition of the nano silica particles. We also optimize the structure of the hybrid silica particles at the case of the nano silica particles and/or fullerenol to meet the high performance CMP of hard to process materials and discuss about these results.

DOI： 10.11522/pscjspe.2018a.0_312

CiNii Article

CiNii Research

Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire Reviewed International journal

Bun-Athuek N., Takazaki H., Yoshimoto Y., Khajornrungruang P., Yasunaga T., Suzuki K.

Japanese Journal of Applied Physics 57 ( 7 ) 2018.07

Study on Non-Contact Micro Tool Tip Nano-Position Detection by Means of Evanescent Field Penetration Depth Reviewed

Panart Khajornrungruang, Keisuke Suzuki, Tomoki Inoue

2018.06

Analytical on mixed colloidal silica particle in slurry of sapphire Chemical Mechanical Polishing Reviewed

BUN-ATHUEK NATTHAPHON, YOSHIMOTO YUTAKA, SAKAI KOYA, KHAJORNRUNGRUANG PANART, SUZUKI KEISUKE

LEM21 2017 ( 0 ) 2018.05

Development of new polishing pad with a semispherical shape formed by materials with different wear rates

ONIKI Takahiro, KATO Yuya, KHAJORNRUNGRUANG Panart, SUZUKI Keisuke, TASHIRO Yasunori, MATSUO Masaaki

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 62 ( 5 ) 264 - 266 2018.05

Language：Japanese Publishing type：Research paper (other academic)

We have developed a polishing pad using materials with different wear rates to achieve highly efficient polishing of difficult-to-process material substrates. Nylon fibers with good mechanical properties are arranged with other materials, followed by dressing to form protrusions on the polishing pad surface. Stable polishing performance can be expected if the orientation and arrangement of the nylon fibers can be controlled. A sapphire substrate was polished using the prototype polishing pad developed in this research. The results indicated 30% improvement in material removal rate compared to the ready-made pad.

DOI： 10.11420/jsat.62.264

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Study of Electroosmotic Micro-Flow Enhanced Abrasives Distribution in Nanoparticle Contained Slurry for Copper Chemical Mechanical Planarization Reviewed

Tsai Yueh-Hsun, Suzuki Keisuke, Chang Chao-Chung, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018S ( 0 ) 781 - 782 2018.03

Language：English Publishing type：Research paper (other academic)

Chemical mechanical planarization is one of the crucial steps for the manufacturing process of semiconductor. CMP process with good adaptability can lead to high productivity, low defect, and coping with the ever-changing materials. In CMP process, slurry plays a big role in material removal. Among the composition of slurry, the abrasive predominates in the removal rate and surface quality. Therefore, this study develops the application of water-soluble nanoparticles, such as fullerene, as abrasives for the copper CMP process. By electroosmotic phenomenon, a kind of electro kinetic force, it generates the micro-flow field for abrasive during CMP process. The increasing disturbance of flow enhances the uniformity of abrasive distribution and polishing efficiency. The electrode embedded polishing platen which causes the electroosmotic flow on polishing pad is revealed and simulated by multi-physics fields coupling software, COMSOL Multiphysics. Finally, comparing with the results of simulation and flow visualization with fluorescent powders, the optimal and reasonable design is discussed.

DOI： 10.11522/pscjspe.2018s.0_781

CiNii Article

CiNii Research

Accurate measurement of flow rate of continuous fluid

Takeuchi Ryosuke, Takaichi Shunsuke, Murakami Sunao, Ito Takahiro, Khajornrungruang Panart

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018S ( 0 ) 873 - 874 2018.03

Study on On-Machine Visualization of Surface Processing Phenomena in Nanoscale-4th: Estimation of longitudinal Resolution

Shirakawa Hiroaki, Blatter Aran, Takemoto Ryo, Khajornrungruang Panart, Suzuki Keisuke

Proceedings of JSPE Semestrial Meeting ( The Japan Society for Precision Engineering ) 2018S ( 0 ) 129 - 130 2018.03

Study on non-contact micro tool tip nano-position detection by means of evanescent field penetration depth Reviewed International journal

Khajornrungruang P., Suzuki K., Inoue T.

European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 18th International Conference and Exhibition, EUSPEN 2018 139 - 140 2018.01

Study on polishing method using magnetic levitation tool by superconducting Reviewed

TANAKA Yuki, NAKASHIMA Hidetaka, HIRAMATU Yuta, KHAJORNRUNGRUANG Panart, OTABE Edmund Soji, SUZUKI Keisuke

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 62 ( 4 ) 219 - 220 2018.01

Language：Japanese Publishing type：Research paper (scientific journal)

Precision machining techniques have a number of serious problem, such as tool interference against complicated machining shapes and improvement of accuracy in processing. To resolve these issues, we suggest the Superconductive Assisted Machining (SUAM) method, which involves application of a magnetic levitation tool using the pinning effect of superconductivity during polishing processing. The SUAM method can eliminate tool interference because machining shape is determined by movement of the magnetic levitation tool during processing. Here, we measured the holding force, such as attractive and repulsive forces, from the pinning effect of superconductivity. The results indicated a maximum attractive force of 4 N with an initial magnetic levitation tool height of 9 mm. In this case, the holding force was dependent on the initial distance between the magnetic levitation tool and the superconductor bulk. In addition, we evaluated the dependence of polishing pressure and rotation frequency on polishing rate using fixed abrasive polishing pads. The results indicated that the polishing removal rates increase with increasing polishing pressure and rotation frequency.

DOI： 10.11420/jsat.62.219

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CiNii Research

Other Link： https://ci.nii.ac.jp/naid/130007492417

Study on polishing processing using Superconductive Assisted Machining method(SUAM)

TANAKA Yuki, NAKASHIMA Hidetaka, ONOMATA Misaki, Khajornrungruang P, OTABE Soji, SUZUKI Keisuke

The Proceedings of Conference of Kyushu Branch ( The Japan Society of Mechanical Engineers ) 2018.71 ( 0 ) F36 2018.01

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Papers - KHAJORNRUNGRUANG, Panart