Faculty Profiles - KHAJORNRUNGRUANG, Panart

Papers - KHAJORNRUNGRUANG, Panart

Division display141 - 160 of about 221／ All the affair displays >>

Slurry supplying method for large quartz glass substrate polishing Reviewed

276 - 277 2010.12

Evaluation method for conditioned polishing pad surface topography applying Fourier transform analysis Reviewed

388 - 391 2010.12

Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching Reviewed

Khajornrungruang P., Kimura K., Baba A., Yasuda K. and Tanaka A.

Asian International Journal of Science and Technology in Production and Manufacturing Engineering 3 ( 3 ) 29 - 34 2010.12

Study on Wafer and Polishing Pad Surface Contact with Stationary and Dynamic Behavior Reviewed

Keiichi Kimura,Panart Khajornrungruang,Eiichiro Okamoto

International Conference on Planarization/CMP Technology 2010.11

Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching Reviewed

Khajornrungruang P.,Kimura K.,Baba A.,Yasuda K,Tanaka A.

Global Congress on Manufacturing and Management(GCMM2010) 253 - 258 2010.11

Investigation of Slurry Flow in Chemical Mechanical Polishing Process of the Quartz Glass Substrate used for Flat Panel Display Photomask Reviewed

Kimura K.,Khajornrungruang P.,Wada N.

Global Congress on Manufacturing and Management(GCMM2010) 2010.11

Study on Sapphire Chemical Mechanical Polishing using Mixed Abrasive Slurry with Fullerenol Reviewed

K. Suzuki,T. Saitou,T. Korezawa,P. Khajornrungruang,K. Kimura

Advanced Metallization Conference 2010 154 - 154 2010.10

Slurry Supplying Method for Large Quartz Glass Substrate Polishing Reviewed

P. Khajornrungruang,R. Yui,N. Wada,K. Suzuki,K. Kimura

Advanced Metallization Conference 2010 136 - 136 2010.10

Evaluation Method for Conditioned Polishing Pad Surface Topography applying Fourier Transform Analysis Reviewed

Keiichi KIMURA,Panart KHAJORNRUNGRUANG,Takahisa OKUZONO

International Symposium on Measurement and Quality Control 2010.09

Investigation on Slurry Flow and Temperature in Polishing Process of Quartz Glass Substrate Reviewed

Panart KHAJORNRUNGRUANG,Nagisa WADA,Ryuji YUI,Keiichi KIMURA

International Symposium on Measurement and Quality Control 2010.09

Development of Periodically Arrayed Micro Pyramid Asperity on Polishing Pad Surface for CMP process using Lithography Reviewed

Panart Khajornrungruang,Keiichi Kimura,Akiyoshi Baba,Naoaki Takahashi,Yuichi Hashiyama and Keisuke Yasuda

Asian Symposium for Precision Engineering and Nanotechnology 2009 (ASPEN 2009) 2009.11

Study on Material Removal Model in Oxide CMP process Reviewed

Yuuichi Hashiyama,Panart Khajornrungruang,Keiichi Kimura

Asian Symposium for Precision Engineering and Nanotechnology 2009 (ASPEN 2009) 2009.11

Cu-CMP Assisted with Ultra Violet Light Irradiation Directly to Wafer Surface Reviewed

Panart Khajornrungruang,Keiichi Kimura and Nobutaka Sumomogi

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 247 - 251 2009.11

Development of Arrayed Micro Pattern on Polishing Pad Surface Applied with Anisotropic Etching Reviewed

Keisuke Yasuda,Keiichi Kimura,Akiyoshi Baba,Panart Khajornrungruang,Akiho Tanaka

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 461 - 466 2009.11

Study on Slurry Flow in CMP Process for Large Quadrilateral Quartz Glass Substrate Reviewed

Nagisa Wada,Panart Khajornrungruang,Keiichi Kimura

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 455 - 460 2009.11

Study of functionality of fine particles in slurry for oxide CMP process Reviewed

Yuuichi Hashiyama,Panart Khajornrungruang,Keiichi Kimura

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 370 - 374 2009.11

Evaluation Method for Surface Topography of Conditioned Polishing Pad based on Fourier Transform Reviewed

Takahisa Okuzono,Panart Khajornrungruang,Yoshikazu Idei and Keiichi Kimura

2009 International Conference on Planarization/CMP Technology (ICPT 2009) 449 - 454 2009.11

角形石英ガラス研磨におけるスラリー流れに関する研究 Reviewed

橋山雄一，木村景一，カチョーンルンルアン・パナート

砥粒加工学会 53 ( 9 ) 578 - 582 2009.09

Study on slurry flow in quadrilateral silica glass polishing Reviewed

HASHIYAMA Yuuichi, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

Journal of the Japan Society for Abrasive Technology 53 ( 9 ) 578 - 582 2009.09

Study on slurry flow in quadrilateral silica grass polishing Reviewed

HASHIYAMA Yuuichi, KIMURA Keiichi, KHAJORNRUNGRUANG Panart

Journal of the Japan Society for Abrasive Technology ( The Japan Society for Abrasive Technology ) 53 ( 9 ) 578 - 582 2009.01

Language：Japanese Publishing type：Research paper (scientific journal)

In liquid crystal display panel production, the silica glass photo mask in the photolithography process is becoming larger, and planarity improvement of the silica glass photo mask is required. Planarization of the mask surface requires polishing. However, the polishing of large-sized silica glass involves nonuniform slurry flow under the glass. In this study, we visualized the slurry flow in polishing of a square of silica glass to realize uniform slurry flow. Furthermore, we visualized the slurry flow with various grooved polishing pads and examined the slurry flow between the silica glass and pad surface.

DOI： 10.11420/jsat.53.578

CiNii Article

Other Link： https://ci.nii.ac.jp/naid/130004494500

　 PREV - NEXT 　

<KHAJORNRUNGRUANG, Panart>

Papers - KHAJORNRUNGRUANG, Panart