Papers - KHAJORNRUNGRUANG, Panart
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Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP Invited Reviewed
Kimura K., Suzuki K., Khajornrungruang P.
ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings 345 - 350 2012.01
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Study on Sapphire CMP Slurry using Water-soluble Fullerenol as Fine Particles Reviewed
Keiichi Kimura,Panart Khajornrungruang,Eiichiro Okamoto
Proc of International Conference on Planarization/CMP Technology 287 - 292 2011.11
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Spatial Fourier Transform Analysis of Polishing Pad Surface Topography Reviewed
2011.09
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Performance of water-soluble fullerene as novel functional fine particles for sapphire CMP Reviewed
2011.09
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Slurry Supplying Method for Large Quartz Glass Substrate Polishing Reviewed
Panart Khajornrungruang,Keiichi Kimura,Ryuji Yui,Nagisa Wada,Keisuke Suzuki
Japanese Journals of Applied Physics 50 ( 5 ) 2011.05
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Investigation on slurry flow and temperature in polishing process of quartz glass substrate Invited Reviewed International journal
Khajornrungruang P., Wada N., Kimura K., Yui R., Suzuki K.
International Journal of Automation Technology 5 ( 2 ) 195 - 200 2011.03
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Evaluation method applying Fourier transform analysis for conditioned polishing pad surface topography Invited Reviewed International journal
Kimura K., Khajornrungruang P., Okuzono T., Suzuki K.
International Journal of Automation Technology 5 ( 2 ) 173 - 178 2011.03
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Evaluation Method Applying Fourier Transform Analysis for Conditioned Polishing Pad Surface Topography Reviewed
Keiichi Kimura,Panart Khajornrungruang,Takahisa Okuzono,Keisuke Suzuki
International Journal of Automation Technology 5 ( 2 ) 173 - 178 2011.03
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Investigation on Slurry Flow and Temperature in Polishing Process of Quartz Glass Substrate Reviewed
Panart Khajornrungruang,Nagisa Wada,Keiichi Kimura,Ryuji Yui,Keisuke Suzuki
International Journal of Automation Technology 5 ( 2 ) 195 - 200 2011.03
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Study on Sapphire Chemical Mechanical Polishing using mixed abrasive slurry with fullerenol Reviewed
294 - 295 2010.12
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Investigation on slurry flow and temperature in polishing process of quartz glass substrate Reviewed
559 - 562 2010.12
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Slurry supplying method for large quartz glass substrate polishing Reviewed
276 - 277 2010.12
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Evaluation method for conditioned polishing pad surface topography applying Fourier transform analysis Reviewed
388 - 391 2010.12
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Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching Reviewed
Khajornrungruang P., Kimura K., Baba A., Yasuda K. and Tanaka A.
Asian International Journal of Science and Technology in Production and Manufacturing Engineering 3 ( 3 ) 29 - 34 2010.12
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Study on Wafer and Polishing Pad Surface Contact with Stationary and Dynamic Behavior Reviewed
Keiichi Kimura,Panart Khajornrungruang,Eiichiro Okamoto
International Conference on Planarization/CMP Technology 2010.11
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Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching Reviewed
Khajornrungruang P.,Kimura K.,Baba A.,Yasuda K,Tanaka A.
Global Congress on Manufacturing and Management(GCMM2010) 253 - 258 2010.11
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Investigation of Slurry Flow in Chemical Mechanical Polishing Process of the Quartz Glass Substrate used for Flat Panel Display Photomask Reviewed
Kimura K.,Khajornrungruang P.,Wada N.
Global Congress on Manufacturing and Management(GCMM2010) 2010.11
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Study on Sapphire Chemical Mechanical Polishing using Mixed Abrasive Slurry with Fullerenol Reviewed
K. Suzuki,T. Saitou,T. Korezawa,P. Khajornrungruang,K. Kimura
Advanced Metallization Conference 2010 154 - 154 2010.10
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Slurry Supplying Method for Large Quartz Glass Substrate Polishing Reviewed
P. Khajornrungruang,R. Yui,N. Wada,K. Suzuki,K. Kimura
Advanced Metallization Conference 2010 136 - 136 2010.10
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Evaluation Method for Conditioned Polishing Pad Surface Topography applying Fourier Transform Analysis Reviewed
Keiichi KIMURA,Panart KHAJORNRUNGRUANG,Takahisa OKUZONO
International Symposium on Measurement and Quality Control 2010.09