Papers - WEN Xiaoqing
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Nonvolatile and SEU-Recoverable Latch Based on FeFET and CMOS for Energy-Harvesting Devices Reviewed International journal
Yan A., Lin Z., Liu G., Zhang Q., Huang Z., Cui J., Wen X., Girard P.
Proceedings - IEEE International Symposium on Circuits and Systems 2024.01
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Cost Efficient Flip-Flop Designs With Multiple-Node Upset-Tolerance and Algorithm-Based Verifications Reviewed International journal
Yan A., He Y., Huang Z., Yan W., Cui J., Wang X., Ni T., Girard P., Wen X.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2024.01
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Introduction to the Special Issue on Design for Testability and Reliability of Security-aware Hardware Reviewed International journal
Ni T., Wen X., Amrouch H., Zhuo C., Song P.
ACM Transactions on Design Automation of Electronic Systems 29 ( 1 ) 2023.12
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Design of True Random Number Generator Based on Multi-Ring Convergence Oscillator Using Short Pulse Enhanced Randomness Reviewed International journal
Ni T., Peng Q., Bian J., Yao L., Huang Z., Yan A., Wang S., Wen X.
IEEE Transactions on Circuits and Systems I: Regular Papers 70 ( 12 ) 5074 - 5085 2023.12
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RMC-NoC: A Reliable On-Chip Network Architecture With Reconfigurable Multifunctional Channel Reviewed International journal
Xu D., Ouyang Y., Zhou W., Huang Z., Liang H., Wen X.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 31 ( 12 ) 2061 - 2074 2023.12
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An AI-Driven VM Threat Prediction Model for Multi-Risks Analysis-Based Cloud Cybersecurity Reviewed International journal
Saxena D., Gupta I., Gupta R., Singh A.K., Wen X.
IEEE Transactions on Systems, Man, and Cybernetics: Systems 53 ( 11 ) 6815 - 6827 2023.11
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Two Double-Node-Upset-Hardened Flip-Flop Designs for High-Performance Applications Reviewed International journal
Yan A., Cao A., Huang Z., Cui J., Ni T., Girard P., Wen X., Zhang J.
IEEE Transactions on Emerging Topics in Computing 11 ( 4 ) 1070 - 1081 2023.10
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GPU-Accelerated Estimation and Targeted Reduction of Peak IR-Drop during Scan Chain Shifting Reviewed International journal
SHI Shiling, HOLST Stefan, WEN Xiaoqing
IEICE Transactions on Information and Systems ( The Institute of Electronics, Information and Communication Engineers ) E106.D ( 10 ) 1694 - 1704 2023.10
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An equivalent processing method for integrated circuit electrical parameter data using BP neural networks Reviewed International journal
Zhan W., Zhang L., Feng X., Pan P., Cai X., Wen X.
Microelectronics Journal 139 2023.09
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Two sextuple cross-coupled SRAM cells with double-node-upset protection and cost optimization for aerospace applications Reviewed International journal
Yan A., Xiang J., Chang Y., Huang Z., Cui J., Girard P., Wen X.
Microelectronics Journal 139 2023.09
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Designs of Array Multipliers with an Optimized Delay in Quantum-Dot Cellular Automata Reviewed International journal
Yan A., Li X., Liu R., Huang Z., Girard P., Wen X.
Electronics (Switzerland) 12 ( 14 ) 2023.07
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A Low Area and Low Delay Latch Design with Complete Double-Node-Upset-Recovery for Aerospace Applications Reviewed International journal
Yan A., Wei S., Zhang J., Cui J., Song J., Ni T., Girard P., Wen X.
Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI 167 - 171 2023.06
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Two Highly Reliable and High-Speed SRAM Cells for Safety-Critical Applications Reviewed International journal
Yan A., Chang Y., Xiang J., Luo H., Cui J., Huang Z., Ni T., Wen X.
Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI 293 - 298 2023.06
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Loop Subgraph-Level Greedy Mapping Algorithm for Grid Coarse-Grained Reconfigurable Array Reviewed International journal
Chen N., Cheng F., Han C., Jiang J., Wen X.
Tsinghua Science and Technology 28 ( 2 ) 330 - 343 2023.04
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SASL-JTAG: A Light-Weight Dependable JTAG Reviewed International journal
Wang S., Wei S., Ma J., Kai H., Higami Y., Takahashi H., Shimizu A., Wen X., Ni T.
Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2023.01
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Mitigating Test-Induced Yield-Loss by IR-Drop-Aware X-Filling Reviewed International journal
Shi S., Holst S., Wen X.
Proceedings - 2023 16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023 501 - 507 2023.01
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Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning Reviewed International journal
Nie M., Jiang W., Yang W., Wang S., Wen X., Ni T.
Proceedings of the Asian Test Symposium 2023.01
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Design of Low-Cost Approximate CMOS Full Adders Reviewed International journal
Yan A., Wei S., Li Z., Cui J., Huang Z., Girard P., Wen X.
Proceedings - IEEE International Symposium on Circuits and Systems 2023-May 2023.01
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Design of a Novel Latch with Quadruple-Node-Upset Recovery for Harsh Radiation Hardness Reviewed International journal
Yan A., Zhou C., Wei S., Cui J., Huang Z., Girard P., Wen X.
Proceedings - 7th IEEE International Test Conference in Asia, ITC-Asia 2023 2023.01
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Design of A Highly Reliable and Low-Power SRAM With Double-Node Upset Recovery for Safety-critical Applications Reviewed International journal
Yan A., Xiang J., Huang Z., Ni T., Cui J., Girard P., Wen X.
Proceedings - 7th IEEE International Test Conference in Asia, ITC-Asia 2023 2023.01