Papers - WEN Xiaoqing
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Single-Event Double-Upset Self-Recoverable and Single-Event Transient Pulse Filterable Latch Design for Low Power Applications Reviewed International journal
Yan A., Hu Y., Song J., Wen X.
Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 1679 - 1684 2019.05
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STAHL: A novel scan-test-aware hardened latch design Reviewed International journal
Ma R., Holst S., Wen X., Yan A., Xu H.
Proceedings of the European Test Workshop 2019-May 2019.05
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Novel Double-Node-Upset-Tolerant Memory Cell Designs Through Radiation-Hardening-by-Design and Layout Reviewed International journal
Yan A., Wu Z., Guo J., Song J., Wen X.
IEEE Transactions on Reliability 68 ( 1 ) 354 - 363 2019.03
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LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults Reviewed International journal
Ni T., Yao Y., Chang H., Lu L., Liang H., Yan A., Huang Z., Wen X.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 39 ( 10 ) 2938 - 2951 2019.01
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Novel Quadruple Cross-Coupled Memory Cell Designs with Protection against Single Event Upsets and Double-Node Upsets Reviewed
Yan A., Zhou J., Hu Y., Cui J., Huang Z., Girard P., Wen X.
IEEE Access 7 176188 - 176196 2019.01
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Clock-Skew-Aware Scan Chain Grouping for Mitigating Shift Timing Failures in Low-Power Scan Testing Reviewed International journal
Zhang Y., Wen X., Holst S., Miyase K., Kajihara S., Wunderlich H., Qian J.
Proceedings of the Asian Test Symposium 2018-October 149 - 154 2018.12
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Message from the Technical Program Co-Chairs Invited Reviewed International journal
Li H., Wen X., Huang Z.
Proceedings of the Asian Test Symposium 2018-October 2018.12
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Foreword Reviewed International journal
Li X., Li H., Cheng K.T.T., Wen X.
Proceedings - 2nd IEEE International Test Conference in Asia, ITC-Asia 2018 2018.09
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The impact of production defects on the soft-error tolerance of hardened latches Reviewed International journal
Holst S., Ma R., Wen X.
Proceedings of the European Test Workshop 2018-May 1 - 6 2018.06
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Bit-Flip Errors Detection using Random Partial Don't-Care Keys for a Soft-Error-Tolerant TCAM Reviewed International journal
I. Syafalni, T. Sasao, X. Wen
Proceedings of the 27th International Workshop on Logic and Synthesis 124 - 131 2018.06
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A Double-Node-Upset Self-Recoverable Latch Design for High Performance and Low Power Application Reviewed International journal
A. Yan, K. Yang, Z. Huang, J. Zhang, X. Fang, X. Wen
IEEE Transactions on Circuits and Systems II: Express Briefs 66 ( 2 ) 287 - 291 Early Access 2018.06
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A Method to Detect Bit Flips in a Soft-Error Resilient TCAM Reviewed International journal
I. Syafalni, T. Sasao, X. Wen
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 37 ( 6 ) 1185 - 1196 2018.06
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The Impact of Production Defects on the Soft-Error Tolerance of Hardened Latches Reviewed International journal
S. Holst, R. Ma, X. Wen
Proceedings of IEEE European Test Symposium Paper 7A-1 2018.05
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Design Automation for Legacy Circuits Reviewed International journal
I. Syafalni, K. Wakasugi, T. Yang, T. Sasao, X. Wen
Proceedings of the 21st Workshop on Synthesis and System Integration of Mixed Information Technologies 174 - 179 2018.03
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Locating Hot Spot with Justification Techniques in a Layout Design Reviewed International journal
K. Miyase, Y. Kawano, X. Wen, S. Kajihara
Proceedings of IEEE Workshop on RTL and High Level Testing Paper S1.2 2017.11
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Scan Chain Grouping for Mitigating IR-Drop-Induced Test Data Corruption Reviewed International journal
Y. Zhang, S. Holst, X. Wen, K. Miyase, S. Kajihara, J. Qian
Proceedings of the Asian Test Symposium 140 - 145 2017.11
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Analysis and Mitigation of IR-Drop Induced Scan Shift-Errors Reviewed International journal
S. Holst, E. Schneider, H. Kawagoe, M. A. Kochte, K. Miyase, H.-J. Wunderlichz, S. Kajihara, X. Wen
Proceedings - International Test Conference 2017-December 1 - 8 Paper 3.4 2017.10
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A Flexible Scan-in Power Control Method in Logic BIST and Its Evaluation with TEG Chips Reviewed International journal
T. Kato, S. Wang, Y. Sato, S. Kajihara, X. Wen
IEEE Transactions on Emerging Topics in Computing 8 ( 3 ) 591 - 601 Early Access 2017.10
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Vernier Ring Based Pre-bond Through Silicon Vias Test in 3D ICs Reviewed International journal
T. Ni, M. Nie, H. Liang, J. Bian, X. Xu, X. Fang, Z. Huang, X. Wen
IEICE Electronics Express 18 ( 14 ) Letter 20170590 2017.10
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GPU-Accelerated Simulation of Small Delay Faults Reviewed International journal
E. Schneider, M. Kochte, S. Holst, X. Wen, H. Wunderlich
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 36 ( 5 ) 829 - 841 2017.05