Papers - WEN Xiaoqing
-
BiSTAHL: A Built-In Self-Testable Soft-Error-Hardened Scan-Cell Reviewed International journal
Holst S., Ma R., Wen X., Yan A., Xu H.
Proceedings of the European Test Workshop 2023-May 2023.01
-
Advanced DICE Based Triple-Node-Upset Recovery Latch with Optimized Overhead for Space Applications Reviewed International journal
Yan A., Li X., Gao Z., Huang Z., Ni T., Wen X.
Proceedings of the Asian Test Symposium 2023.01
-
A Robust and High-Performance Flip-Flop with Complete Soft-Error Recovery Reviewed International journal
Yan A., Li X., Ni T., Huang Z., Wen X.
Proceedings - 2023 10th International Conference on Dependable Systems and Their Applications, DSA 2023 474 - 476 2023.01
-
A Low Overhead and Double-Node-Upset Self-Recoverable Latch Reviewed International journal
Yan A., Xia F., Ni T., Cui J., Huang Z., Girard P., Wen X.
Proceedings - 7th IEEE International Test Conference in Asia, ITC-Asia 2023 2023.01
-
A Lightweight and Machine-Learning-Resistant PUF framework based on Nonlinear Structure and Obfuscating Challenges Reviewed International journal
Ni T., Li F., Peng Q., Wang S., Wen X.
Proceedings of the 2023 Asian Hardware Oriented Security and Trust Symposium, AsianHOST 2023 2023.01
-
A High-Performance and P-Type FeFET-Based Non-Volatile Latch Reviewed International journal
Yan A., Chen Y., Huang Z., Cui J., Wen X.
Proceedings of the Asian Test Symposium 2023.01
-
A ReRAM-Based Non-Volatile and Radiation-Hardened Latch Design Reviewed International journal
Yan A., Wei S., Chen Y., Fan Z., Huang Z., Cui J., Girard P., Wen X.
Micromachines 13 ( 11 ) 2022.11
-
A double-node-upset completely tolerant CMOS latch design with extremely low cost for high-performance applications Reviewed International journal
Yan A., Qian K., Song T., Huang Z., Ni T., Chen Y., Wen X.
Integration 86 22 - 29 2022.09
-
A Highly Robust, Low Delay and DNU-Recovery Latch Design for Nanoscale CMOS Technology Reviewed International journal
Yan A., Zhou Z., Wei S., Cui J., Zhou Y., Ni T., Girard P., Wen X.
Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI 255 - 260 2022.06
-
Two 0.8 V, Highly Reliable RHBD 10T and 12T SRAM Cells for Aerospace Applications Reviewed International journal
Yan A., He Z., Xiang J., Cui J., Zhou Y., Huang Z., Girard P., Wen X.
Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI 261 - 266 2022.06
-
Sextuple Cross-Coupled-DICE Based Double-Node-Upset Recoverable and Low-Delay Flip-Flop for Aerospace Applications Reviewed International journal
Yan A., Chen Y., Song S., Zhai Z., Cui J., Huang Z., Girard P., Wen X.
Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI 333 - 338 2022.06
-
A Secure and Multiobjective Virtual Machine Placement Framework for Cloud Data Center Reviewed International journal
Saxena D., Gupta I., Kumar J., Singh A.K., Wen X.
IEEE Systems Journal 16 ( 2 ) 3163 - 3174 2022.06
-
Quadruple and Sextuple Cross-Coupled SRAM Cell Designs With Optimized Overhead for Reliable Applications Reviewed International journal
Yan A., Xiang J., Cao A., He Z., Cui J., Ni T., Huang Z., Wen X., Girard P.
IEEE Transactions on Device and Materials Reliability 22 ( 2 ) 282 - 295 2022.06
-
Cost-Effective and Highly Reliable Circuit-Components Design for Safety-Critical Applications Reviewed International journal
Yan A., Fan Z., Ding L., Cui J., Huang Z., Wang Q., Zheng H., Girard P., Wen X.
IEEE Transactions on Aerospace and Electronic Systems 58 ( 1 ) 517 - 529 2022.02
-
SCLCRL: Shuttling C-elements based Low-Cost and Robust Latch Design Protected against Triple Node Upsets in Harsh Radiation Environments Reviewed International journal
Yan A., Li Z., Huang S., Zhai Z., Cheng X., Cui J., Ni T., Wen X., Girard P.
Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022 1257 - 1262 2022.01
-
Novel Quadruple-Node-Upset-Tolerant Latch Designs with Optimized Overhead for Reliable Computing in Harsh Radiation Environments Reviewed International journal
Yan A., Xu Z., Feng X., Cui J., Chen Z., Ni T., Huang Z., Girard P., Wen X.
IEEE Transactions on Emerging Topics in Computing 10 ( 1 ) 404 - 413 2022.01
-
Broadcast-TDMA: A Cost-Effective Fault Tolerance Method for TSV Lifetime Reliability Enhancement Reviewed International journal
Ni T., Bian J., Yang Z., Nie M., Yao L., Huang Z., Yan A., Wen X.
IEEE Design and Test 39 ( 5 ) 34 - 42 2022.01
-
A Highly Reliable and Low Power RHBD Flip-Flop Cell for Aerospace Applications Reviewed International journal
Yan A., Qian K., Cui J., Cui N., Huang Z., Wen X., Girard P.
Proceedings of the IEEE VLSI Test Symposium 2022-April 2022.01
-
Power-Aware Testing in the Era of IoT Reviewed International journal
Wen X.
Proceedings of 2022 IEEE 16th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022 2022.01
-
Power and Energy Safe Real-Time Multi-Core Task Scheduling Reviewed International journal
Baita K., Chakrabarti A., Chatterjee B., Holst S., Wen X.
Proceedings - 2022 35th International Conference on VLSI Design, VLSID 2022 - held concurrently with 2022 21st International Conference on Embedded Systems, ES 2022 16 - 21 2022.01